JPH1164388A - Electrode plate and current-carrying inspecting device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a burn-in board capable of obtaining a current-carrying inspecting result of highly reliable. SOLUTION: At the time of mounting an electronic component 10 in a prescribed area on a burn-in board 15 and pressurizing the back surface of this by a socket 13, a conductor particle 4a on the surface of a contact terminal 11a breaks through the oxide coating of a bump 9 formed on the electrode pad 10a of the part 10 and cuts into the inside of it. Thereby, electric connection is established between the pad 10a of the component 10 and the terminal 11a of the board 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric current inspection technique for inspecting electrical characteristics of an electronic component, and more particularly to an anisotropic conductive film (ACF: Anisotropic Conductive Film).
The present invention relates to a current-carrying inspection device that establishes an electrical connection with an electronic component via an anisotropic conductive material such as a film.

[0002]

2. Description of the Related Art Japanese Patent Laying-Open No. 6-302657 discloses a novel probe card used for electrically connecting an electrode pad of an electronic component to a tester.
Unlike the conventional stylus type probe card, a tentacle portion 5 for supplying an inspection current to the electronic component 4 is formed on the surface of the probe card as shown in FIG.
The surfaces of the tentacles 5 are covered with a thin film 9 of an anisotropic conductive material in which conductive particles are dispersed in a viscous composition or the like. Therefore, when the electrode pad 11 of the electronic component 4 is strongly pressed against the anisotropic conductive layer 9, the plurality of conductive particles contained in the anisotropic conductive layer 9 are chained, and An electrical connection will be established between the probe card and the tentacle section 5. The anisotropic conductive layer 9
As an example of a method for forming the tentacle, a method of applying an anisotropic conductive material to the tentacle portion 5 or the like is mentioned.

[0003]

SUMMARY OF THE INVENTION However, Japanese Patent Laid-Open No.
The use of the probe card described in JP-A-302657 has a problem that the electronic component 4 is often damaged by a strong pressing force applied during the power-on inspection. Since the electrical connection must be established between the electrode pad 11 of the electronic component 4 and the tentacle portion 5 of the probe card, there is a certain limit in weakening the pressing force. Was very difficult.

When the probe card described in Japanese Patent Application Laid-Open No. 6-302657 is used, the electric resistance between the electrode pad 11 of the electronic component 4 and the tentacle portion 5 becomes too large,
There is also a problem that it is not possible to obtain a highly reliable energization test result.

Accordingly, at the present stage, Japanese Unexamined Patent Publication No.
Practical application of the probe card described in Japanese Patent Publication No. 02657 has been postponed.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electrode plate and an electric current inspection apparatus capable of performing a highly reliable electric inspection without deteriorating the quality of an electronic component to be inspected.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides an electronic component as an electrode plate suitable for a burn-in board used especially in a high-temperature atmosphere (usually in air at about 125 ° C.). And an electrode plate for electrically connecting between the electrical test device and a contact terminal for pressing a bump formed on an electrode pad of the electronic component, and on the contact terminal, An electrode plate is provided, in which a thin film in which the conductive particles are fixed by a part of a plurality of conductive particles is arranged.

[0008] Just by lightly pressing the bump on the electrode pad of the electronic component onto the contact terminal of the present electrode plate, the fine conductive particles easily break through the oxide film of the bump and dig into the inside. Therefore, when the present electrode plate is used, an electrical connection can be established between the electrode pad of the electronic component and the contact terminal of the electrode plate without applying a load to the electronic component.

When the conductive particles in contact with the surface of the contact terminal of the electrode plate directly penetrate the bumps 9 on the electrode pads of the electronic component, the conductive particles may be anisotropically conductive like a conventional probe card. The contact resistance can be suppressed as compared with a case where a plurality of conductive particles contained in the conductive material are linked to establish an electrical connection. Therefore, if this electrode plate is used,
The reliability of the result of the conduction test is improved.

[0010]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

First, the basic configuration of the continuous conduction inspection device according to the present embodiment will be described with reference to FIG. However,
Here, the description will be made with emphasis on the burn-in board 15 which is a characteristic part of the continuous conduction inspection apparatus.

A burn-in board 15 on which contact terminals 11a are formed in accordance with an arrangement of electrode pads 10a of the electronic component 10, a sensor for detecting the electrical characteristics of the electronic component 10, and other electronic components on a mother board 17 of the continuous power supply device. 18 are mounted. In this embodiment, the motherboard 17 and the burn-in board 15 are connected by the contact connector 16 so that the burn-in board 15 can be attached to and detached from the motherboard 17. Then, on the motherboard 17, the motherboard 17
Guide 19 for burn-in board 15 with respect to
Has been erected.

Then, on the surface of each contact terminal 11a on the burn-in board 15, as shown in FIG.
One or more conductive particles 4a are adhered by resin 4b in a partially exposed state.

The conductive particles 4a used here include:
Particles having a particle size of about 20 μm to 30 μm are recommended. 12
It has been experimentally confirmed that the conductive particles 4a having such a particle diameter will not peel off from the surface of the contact terminal 11a even when used for a one-hour continuous energization test in an atmosphere of 5 ° C. is there.

When using conductive particles 4a that are easily oxidized, such as nickel, for example, the surface of the conductive particles 4a is first oxidized by a plating method or a vapor deposition method as a measure for suppressing contact resistance. , For example, a gold, platinum, rhodium or other noble metal layer. However, the film thickness of about 0.1 μm is sufficient. This is also true for the contact terminals 11a. For example, even when the contact terminals 11a are formed of a conductor that is easily oxidized, such as copper, each contact terminal 11a is previously determined.
It is desirable to coat the surface of a with a thin film for preventing oxidation.

From the viewpoint of preventing the resin 4b from peeling off, it is preferable that the surface of each contact terminal 11a is previously coated with a metal thin film having excellent adhesion to the resin. As a specific example, a metal thin film (about 1 μm to 10 μm) such as solder or tin may be formed in advance on the surface of each contact terminal 11a. However, since solder, tin, and the like are easily oxidized, a thin film for preventing oxidation similar to the case described above is necessary in this case as well.

The contact terminals 11a are supplied with a current for conducting inspection through a wiring pattern 11b.

Accordingly, the electronic component 10 is placed in a predetermined area on the burn-in board 15 using the positioning guide 14, and then the socket 13 is lowered along the guide 12 erected on the burn-in board 15. When the back of the electronic component 10 is lightly pressed by the socket 13, as shown in FIG. 3, the fine conductive particles 4 a on the surface of the contact terminal 11 a form the electrode pad 10 a of the electronic component 10.
The oxide film of the bump 9 formed thereon is easily pierced and cut into the inside. Thus, the electrode pads 10a of the electronic component 10 and the contact terminals 1 of the burn-in board 15
The electrical connection is established between the electronic component 1a and the electronic component 10, and the electronic component 10 is ready for electrical characteristic inspection.

As described above, in order to break through the oxide film of the bump 9 with the conductive particles 4a having a particle diameter of about 20 to 30 μm, when the diameter of the bump 9 is about 0.3 mm, at most about 10 g of each bump 9 is required. It is sufficient that the electronic component 10 is pressed with a pressing force to such an extent that the force of the above is applied.
The electronic component 10 cannot be damaged by such a pressing force. Further, even when such a force is applied to the bump 9, only a change in height of about 10% occurs in the bump 9, and no excessive deformation that causes a mounting failure does not occur. . That is, if the burn-in board is used, the quality of the electronic component 10 does not deteriorate during the power-on inspection.

Also, as described above, the burn-in board 15
The conductive particles 4a that are in contact with the contact terminals 11a are directly cut into the bumps 9 formed on the electrode pads 10a of the electronic component 10, thereby forming an anisotropic conductive layer like a conventional probe card. The contact resistance can be suppressed as compared with a case where a plurality of conductive particles contained in the conductive material are linked to establish an electrical connection. Therefore, if this burn-in board is used, a more reliable energization test result can be expected. So, in a high temperature atmosphere
(In air at about 125 ° C.), the contact resistance was actually measured by the four-terminal method. As a result, as expected, a value of 2 Ω or less that ensures the reliability of the conduction test result was detected. In order to further enhance the effect of suppressing the contact resistance, as shown in FIG. 7, the inside of the resin 4b that adheres the conductive particles 4a to the contact terminals 11a of the burn-in board 15 is further larger than the conductive particles 4a. It is recommended to include fine conductive particles. The fine conductive particles contained in the resin 4b are used for the contact terminals 11 of the burn-in board 15.
a near the interface between the conductive particles 4a and the conductive particles 4a, and the socket 1
This is because the contact area between the contact terminals 11a of the burn-in board 15 and the conductive particles 4a when the electronic component 10 is lightly pressed on the back surface in Step 3 is substantially increased.

In the present embodiment, the conductive particles 4a are adhered to the respective contact terminals 11a of the burn-in board 15, but each of the contact terminals is formed by a film or the like in which only a part of the conductive particles 4a is embedded. The surface of the terminal 11a may be covered.

Next, a method of manufacturing the burn-in board 15 will be described with reference to FIGS.

First, for example, a metal foil (eg, glass epoxy, polyimide film, etc.) is placed on an insulating substrate (eg, glass epoxy, polyimide film, etc.).
The contact terminals 11 are adhered on the surface of the burn-in board 15 according to a predetermined layout by a method of bonding copper (copper).
a and the wiring pattern 11b are formed.

In the meantime, suitable conductive particles 4a (for example, Ni particles) and resin 4b (for example, epoxy resin) are mixed to prepare an anisotropic conductive paste having a suitable viscosity in advance. When fine conductive particles are contained in the resin 4b (see FIG. 7), finer conductive particles (for example, Au particles) are also mixed at this time.

Thereafter, as shown in FIG. 4, the anisotropic conductive paste 40A prepared in advance is transferred onto the contact terminals 11a of the burn-in board 15 by a screen printing method. The same applies to the case where fine conductive particles are contained in the resin 4b (see FIG. 7) (see FIG. 8).
Specifically, first, the contact terminals 11 of the burn-in board 15
Positioning the opening 23 of the screen 22 with respect to a
After that, the opening 23 of the screen 22 is filled with the anisotropic conductive paste 40A by running the squeegee 21 on the surface of the screen 22, and then the burn-in board 15 and the screen 22 are separated.

Thereafter, the surface of the burn-in board 15 is covered with a Teflon sheet, and the curing temperature of the resin 4b is set thereon.
By pressing a thermocompression bonding tool heated to (usually around 200 ° C.), the anisotropic conductive paste 40A is heated and compressed at an appropriate pressure (usually about 20 MPa). The reason for covering the surface of the burn-in board 15 with the Teflon sheet at this time is to prevent the anisotropic conductive paste 40A from adhering to the thermocompression bonding tool. Therefore, it has excellent heat resistance,
In addition, the material does not need to be a Teflon sheet as long as the material is excellent in the releasability from the resin.

Then, after pulling up the thermocompression bonding tool from above the Teflon sheet and leaving it for an appropriate cooling time, the Teflon sheet is peeled off from the surface of the burn-in board 15, and as shown in FIG. The resin 4b is completely cured with a part thereof exposed. The reason why the conductive particles 4a can be appropriately exposed is as follows.
This is because only the resin 4a slightly flows during heating and melting. In addition, shrinkage of the resin 4a during curing is also a factor.

As described above, the present burn-in board can be manufactured by using a screen printing method or the like which has already been established as a soldering technique or the like. Therefore, there is no difficulty in manufacturing the burn-in board.

Incidentally, the manufacturing method described here is merely an example. For example, as shown in FIG. 6, the anisotropic conductive film 40 </ b> B is placed on the contact terminal 11 a of the burn-in board 15 from the surface of the separator 6 such as a Teflon sheet.
Thermal transfer may be performed on the top. In this case,
The opening 8 of the mask 7 is positioned with respect to the contact terminal 11 a of the burn-in board 15, and further, the anisotropic conductive film 40 is placed on the mask 7 together with the separator 6. All you have to do is press Thereafter, the thermocompression bonding tool is pulled up from the Teflon sheet and left for an appropriate cooling time, and then the burn-in board 15 and the mask 7 are separated from each other, as shown in FIG. With resin exposed, resin 4
This is because b is cured.

[0030]

By using the burn-in board according to the present invention, it is possible to prevent the quality of the electronic component to be inspected from deteriorating during the energization inspection and to expect a more reliable energization inspection result.

[Brief description of the drawings]

FIG. 1 is a diagram showing a basic configuration of a continuous conduction inspection device according to an embodiment of the present invention.

FIG. 2 is a front view of a burn-in board mounted on the continuous conduction inspection device of FIG. 1;

FIG. 3 is a conceptual diagram illustrating an electrical connection established between an electrode pad of an electronic component and a contact terminal of a burn-in board.

FIG. 4 is a diagram for explaining a method for manufacturing a burn-in board.

FIG. 5 is an example of a cross-sectional view of a burn-in board.

FIG. 6 is a diagram illustrating a method for manufacturing a burn-in board.

FIG. 7 is an example of a sectional view of a burn-in board.

FIG. 8 is a diagram for explaining a method for manufacturing a burn-in board.

FIG. 9 is a sectional view of a conventional probe card.

[Explanation of symbols]

 4a ... Resin 4b ... Conductor particles 9 ... Bump 10 ... Electronic component 10a ... Electrode pad of electronic component 11a ... Contact terminal of burn-in board 11b ... Wiring pattern 13 ... Socket 14 ... Positioning guide 15 ... Burn-in board 16 ... Contact connector 17 ... Motherboard 18 ... Sensors and other electronic parts 21 ... Squeegee 22 ... Screen 23 ... Screen opening 40A ... Anisotropic conductive paste 40B ... Anisotropic conductive film

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Akio Hasebe 5-2-1, Josuihonmachi, Kodaira-shi, Tokyo Inside the Semiconductor Division, Hitachi, Ltd. 20-1 Chome, Semiconductor Division, Hitachi, Ltd. (72) Inventor Kenichiro Morinaga 5-2-1, Josuihoncho, Kodaira-shi, Tokyo Inside Semiconductor Division, Hitachi, Ltd.

Claims (6)

[Claims] 1. An electrode plate for electrically connecting an electronic component and a conduction inspection device, comprising: a contact terminal for pressing a bump formed on an electrode pad of the electronic component. An electrode plate, wherein a thin film in which a part of a plurality of conductive particles fixes the conductive particles is arranged on a surface of the contact terminal. 2. An electrode plate for electrically connecting between an electronic component and an electrical test device, comprising: a contact terminal for pressing a bump formed on an electrode pad of the electronic component. An electrode plate, wherein a plurality of conductive particles are adhered to the contact terminal with a resin. 3. The electrode plate according to claim 2, wherein the surface of the conductive particles is coated with a noble metal layer. 4. The electrode plate according to claim 3, wherein said noble metal layer is any one of gold, platinum and rhodium.
An electrode plate, characterized in that it is a noble metal plating layer. 5. The electrode plate according to claim 2, wherein a plurality of conductive particles having a particle size smaller than a particle size of the conductive particles inside the resin. An electrode plate characterized by containing: 6. An electric current inspection apparatus for inspecting electrical characteristics of an electronic component while pressing a bump formed on a terminal pad of the electronic component against a contact terminal of the electrode plate, wherein the electrode plate is used. An electrical conduction inspection device comprising the electrode plate according to any one of claims 3, 4, and 5.