JP3264072B2 - Electronic component and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention, which relates to an electrode structure and a manufacturing how electronic components, for example, is applied to the electrodes of the liquid crystal driving IC is connected to the liquid crystal display panel .

[0002]

2. Description of the Related Art Conventionally, connection of electronic parts such as semiconductor parts,
For example, the connection between the liquid crystal display panel and the liquid crystal driving IC is generally performed by face-down soldering. The liquid crystal driving IC having the solder bumps formed on the electrode terminals is aligned with the liquid crystal display panel, and heated with a hot plate. Was soldered. Therefore, it is necessary to heat the solder until the temperature exceeds the melting point, and this heating has a problem that the liquid crystal display panel is deteriorated. For this reason, the liquid crystal display panel is mounted on the liquid crystal display panel without using the soldering method.
There is a demand for a method of implementing C. As such a method, the document “IMC'90 (International Microelectron
ics Conference) '' CHIP-ON-GLASS TECHN
OLOGY USING CONDUCTIVE PARTICLES AND LIGHT-SETTING
As shown in "ADHESIVES", a connection structure using conductive particles was used, and the structure was such that conductive particles were mounted on electrode terminals of a liquid crystal driving IC. FIG. 17 is a manufacturing process diagram showing a method of mounting conductive particles on the electrode terminals of the conventional liquid crystal driving IC in order of process. In the figure,
1 is a liquid crystal driving IC, 2 is an electrode terminal of the liquid crystal driving IC 1, 3a is an uncured ultraviolet curing resin, 3b is a cured ultraviolet curing resin, and 4 is a liquid crystal driving IC electrode terminal 2 pattern. Photomask, 5 is an exposure apparatus, 6 is conductive particles, for example, a metal ball such as gold is plated on the surface of a resin ball, and specifically, for example, Micropearl (registered trademark, manufactured by Sekisui Fine Chemical Co., Ltd.) is there. In this figure, for the sake of clarity, the cross section is shown without hatching except for a part, and this is the same in other drawings.

Next, a method of mounting the conductive particles 6 on the electrode terminals 2 of the conventional liquid crystal driving IC 1 will be described. First, as shown in FIG. 17A, an ultraviolet curable resin 3a is applied to the surface of the liquid crystal driving IC 1 by spin coating. Next, as shown in FIG. 17B, the liquid crystal driving IC 1 and the photomask 4 are aligned, and the ultraviolet curing resin 3a applied to the liquid crystal driving IC 1 is exposed by the exposure device 5. As a result, as shown in FIG. 17C, the ultraviolet curable resin 3a on the electrode terminals 2 of the liquid crystal driving IC is uncured, and the ultraviolet curable resin 3b other than the hatched electrode terminals 2 is in a cured state. Becomes next,
As shown in FIG. 17 (d), the liquid crystal drive I is driven by utilizing the adhesive force of the uncured ultraviolet curing resin 3 a on the electrode terminals 2.
The conductive particles 6 were mounted only on the electrode terminals 2 of C.

[0004]

However, in the above-mentioned conventional electronic parts and the method of manufacturing such electronic parts, the conductive particles 6 are mounted by utilizing the adhesive force of the uncured ultraviolet curing resin 3a on the electrode terminals. Therefore, it is difficult to control the surface state of the uncured ultraviolet curable resin 3a, and the conductive particles 6
Was unstable.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide an electronic component capable of reliably mounting conductive particles on an electrode terminal and a method of manufacturing the same.

[0006]

According to the first aspect of the present invention, there is provided an electronic component comprising at least two protrusions having different heights.
Each of the above-mentioned protruding electrodes or electrodes
The conductive particles are press-fitted into the pole terminals, and
The protruding electrode or electrode terminal is connected to the wiring pattern
In electronic components, the height of the protruding electrode
Or the electrode terminal press-fit depth is
The difference between the above heights from the press-fitting depth of the electrode or electrode terminal
It is deeply formed.

The electronic component according to the second aspect of the present invention has a small number of components.
At least two projecting electrodes or electrode terminals
The conductive particles are pressed into the protruding electrodes or electrode terminals,
The protruding electrodes or electrode terminals are raised from each other via
Electronic components connected to different wiring patterns
The above connected to the higher wiring pattern
The protruding electrode or electrode terminal has a low press fit depth, but the above height is low
Protruding electrode or electrode connected to one of the wiring patterns
It is formed deeper than the terminal press-fitting depth by the above height difference.
ing.

[0008] electronic device according to the third aspect of the present invention is butt
Having an electromotive electrode or electrode terminal
Pre-cured insulating tree with plasticity on poles or electrode terminals
A fat layer is formed.

[0009] electronic device according to a fourth aspect of the invention, 請
4. The method according to claim 3, wherein the projection electrode or the electrode terminal
Conductive particles are pressed into the insulating resin layer formed in
Things.

The electronic component according to the invention described in claim 5 is a contractor.
The insulating resin layer according to claim 3 or 4, wherein the insulating resin layer is a photosensitive resist,
Silicone resin, acrylic resin, epoxy resin
It is formed of a polyimide resin.

[0011] The electronic component according to the invention described in claim 6 is a contractor.
6. The method according to claim 3, wherein
Electrodes or electrode terminals are formed on chip parts or IC wafers
Is what is being done.

[0012] The method of manufacturing an electronic component according to the invention according to claim 7, the dispersed conductive particles on a transfer substrate, projecting electrode
Poles, electrode terminals, or plastics formed on these electrodes
Press-fit into the hardened insulating resin layer
It is.

[0013] The method of manufacturing an electronic component according to the invention of claim 8, the projection electrodes or electrode end pressurization of claim 7, wherein
While heating at least one of the
Is Umono.

[0014] The method of manufacturing an electronic component according to the invention of claim 9, wherein the protruding electrodes or electrode end pressurization of claim 7, wherein
Ultrasonic waves to at least one of the element and the conductive particles.
While doing.

According to a tenth aspect of the present invention, there is provided a method of manufacturing an electronic component according to any one of the seventh to ninth aspects.
In, after press-fitting conductive particles, projecting electrodes or electrode terminals
Air around the area to remove excess conductive particles
Things.

According to the eleventh aspect of the present invention, there is provided a method of manufacturing an electronic component according to any one of the seventh to tenth aspects.
In the method, after the conductive particles are pressed into
Vibration is applied to the element to remove excess conductive particles.
You.

According to a twelfth aspect of the present invention, there is provided a method of manufacturing an electronic component according to any one of the seventh to eleventh aspects.
The substrate in which the conductive particles are dispersed
Those having a difference are used.

[0018]

According to the first aspect of the present invention, the height is high.
Press-fit depth of either of the protruding electrodes or electrode terminals
Press-fit depth of the lower protruding electrode or electrode terminal
More deeply by the height difference
Even if the height of the protruding electrode or electrode terminal is different,
Secure connection between protruding electrodes or electrode terminals and wiring patterns
can do.

According to the second aspect of the present invention, the height
The protruding electrode connected to the higher wiring pattern or
Is the wiring pattern with the lower electrode terminal press-fit depth
Depth of the protruding electrode or electrode terminal connected to
Well, because it is formed deep by the difference in height,
Even if the height of the wiring pattern is different,
Electrode terminals and wiring patterns can be securely connected.
You.

According to the third aspect of the present invention, at least
Even the cured electrode with plasticity on the protruding electrodes or electrode terminals
Because the insulating resin layer is formed,
Electronic components can be prevented from being destroyed.

According to the fourth aspect of the present invention, the projection electrode
Alternatively, conductive particles may be added to the insulating resin layer formed on the electrode terminals.
Is already pressed in during production
Since the conductive particles are pressed into the insulating resin layer,
It is easy to control the amount of particles injected, and the connection reliability is improved. Ma
In addition, the insulating resin layer that is prone to plastic deformation due to pressure
Because it is formed on electrodes or electrode terminals, conductive particles
Is easily press-fitted and transferred from the transfer substrate
As a result, connection reliability and yield are improved. In addition,
The rim resin is in a cured state, and changes over time and adhesion of dust
No conductive particles can be reliably pressed
You.

According to the fifth aspect of the present invention, the insulating tree
The photosensitive layer, silicone resin, acrylic resin,
Made of epoxy resin or polyimide resin
In this case, an uncured insulating resin layer having plasticity is obtained.

According to the sixth aspect of the present invention, the projection electrode
Or, if the electrode terminals are formed on the chip parts or IC wafer
In the case of chip components, conductive particles are only included in non-defective products.
, And in the case of an IC wafer, the productivity is improved.

In the invention according to claim 7, the transfer substrate
The conductive particles dispersed on the upper surface can be used for projecting electrodes, electrode terminals,
Is a pre-cured, plasticized material formed on these electrodes
Contains conductive particles because it is press-fit into the insulating resin layer by pressure
The height of the protruding electrodes or electrode terminals becomes uniform. That
Therefore, when connecting this electronic component to other electronic components, etc.
By simply pressing the claw, the connection between the two electronic components is electrically connected.
I can continue.

According to the eighth aspect of the present invention, the pressurizing operation is performed.
At least one of an electromotive electrode or an electrode terminal, and conductive particles
The conductive particles while heating the
Can be press-fitted.

In the ninth aspect of the present invention, the pressurizing operation is performed.
At least one of an electromotive electrode or an electrode terminal, and conductive particles
The conductive particles while applying ultrasonic waves to the
Indeed, it can be pressed into the electrode.

According to the tenth aspect of the present invention, the conductive particles
The air around the protruding electrodes or electrode end element after the press-fitting of the child
Spray to remove extra conductive particles
Or short-circuit due to conductive particles between electrode terminals
And reliability and yield are improved.

In the eleventh aspect, the conductive particles
Vibration is applied to the protruding electrodes or electrode terminals after the
To remove protruding conductive particles.
There is no short circuit due to conductive particles between
And the yield is improved .

In the twelfth aspect of the present invention, the conductive particles
Use a substrate that has a gap in the press-fit direction
The conductive particles to the same height electrode,
Or press-fit the conductive particles to electrodes of different heights.
Or press-fit in quantity.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an electronic component, a method of manufacturing the same, and an electronic component mounting table according to the present invention will be described with reference to the drawings. In the following embodiments, a liquid crystal driving IC will be described as an example of an electronic component. However, the present invention is not limited to this. For example, a contact image sensor, a thermal head driving IC, a chip resistor, a chip capacitor, and the like may be used. Electronic components and flexible substrates, TAB (Tape Automat
The present invention can be similarly applied to connection wiring such as ed bonding).

Embodiment 1 FIG. 1 is a view showing an electronic component manufacturing process according to an embodiment of an electronic component and a method of manufacturing the electronic component according to the first, seventh, and eighth aspects of the present invention. In the figure, 7 is a liquid crystal driving IC 1
Au, Cu, etc. protruding electrodes formed on the electrode terminals of
Reference numeral 8 denotes a transfer substrate on which the conductive particles 6 are dispersed and arranged, and 9 denotes a head for heating and pressing the liquid crystal driving IC 1 onto the transfer substrate 8.

First, as shown in FIG. 1A, a transfer substrate 8 on which conductive particles 6 are dispersedly arranged and a liquid crystal driving IC 1
Are heated and pressed by the head 9. At this time, since the pressure is concentrated on the contact portion between the conductive particles 6 and the protruding electrode 7, the protruding electrode 7 is easily deformed, and a concave portion is formed. The recess is formed in the form of conductive particles 6, and the conductive particles 6 are pressed into the protruding electrodes 7. In this case, the contact portion between the conductive particles 6 and the protruding electrode 7 may
Since the surface layer is slightly removed, the removal of the natural oxide film and the like is performed at the same time, thereby preventing poor connection between the two and obtaining a good ohmic contact.
When the conductive particles 6 are press-fitted into the protruding electrodes 7, the contact area increases, and the adhesive force between the transfer substrate 8 and the conductive particles 6 is weakened by heating. Is reliably transferred. by this,
As shown in FIG. 1 (b), the conductive particles 6 are
And the conductive particles 6 are mounted on the protruding electrodes 7.

In this electrode structure, since there is no adhesive layer such as the ultraviolet curable resin 3 between the protruding electrodes 7 and the conductive particles 6, the protruding electrodes 7 and the conductive particles 6 are surely in contact with each other, and an open failure occurs. Never. Further, a photolithography step is not required, and productivity is improved. Further, a material such as the photomask 4 and a manufacturing apparatus such as the exposure apparatus 5 are not required, and the cost can be reduced. Further, in this manufacturing method, the liquid crystal driving IC 1 is pressed against the transfer substrate 8 by the head 9 when the conductive particles 6 are pressed into the protruding electrodes 7. The protruding electrodes 7 and the conductive particles 6 are deformed, and the height of the protruding electrodes including the conductive particles 6 becomes uniform. Therefore, when connecting to the liquid crystal display panel, the liquid crystal display panel and the liquid crystal drive
The electrode terminals of C can be electrically connected. Also,
By pressing the liquid crystal driving IC 1 against the liquid crystal display panel, a lighting test of the liquid crystal display panel can be performed. Further, in this manufacturing method, the press-fitting is easy because the press-fitting of the conductive particles 6 into the bump electrodes 7 is performed while heating.

In the first embodiment, the liquid crystal driving IC 1 is heated and pressed on the transfer substrate 8 by the head 9. However, the transfer substrate 8 is heated and the liquid crystal driving IC 1 is pressed on the transfer substrate 8 by the head 9. Has the same effect.

Embodiment 2 FIG. Another embodiment of the invention of claim 7, wherein, in the low heat electronic components, it is also possible to mount the conductive particles 6 projecting electrodes 7 only by pressure.

Embodiment 3 FIG. Further, an embodiment related to the first and second aspects of the present invention will be described. By forming a metal layer on the surface of the projecting electrode 7 and the conductive particles 6 of the liquid crystal driving IC 1 by a combination that easily forms an alloy layer at a low temperature, when the liquid crystal driving IC 1 is heated and pressed by the head 9, the conductive particles 6 An alloy layer is formed by the and the protruding electrode 7, and the connection is reliably performed, and the connection reliability can be further improved. Examples of combinations of metal layers include Au and Sn, solder and solder, solder and Au, solder and Ag, and solder and Cu.

Embodiment 4 FIG. It will be described an embodiment of the invention of claim 9, wherein. In the first to third embodiments, the liquid crystal driving IC 1 is heated and pressurized on the transfer substrate 8, but applying ultrasonic waves through the head 9 at this time is also very effective. Due to the ultrasonic wave, the projection electrode 7 is deformed even by a slight pressure, and has an effect of removing an oxide film on the surface. Further, ultrasonic waves may be applied from the transfer substrate 8 side. Further, it is needless to say that applying the ultrasonic wave from both sides of the head 9 and the transfer substrate 8 is more effective.

Embodiment 5 FIG. Figure 2 shows an embodiment of the invention of claim 10, wherein. In the figure, reference numeral 10 denotes an air nozzle. In the step of transferring the conductive particles 6, the conductive particles 6 may enter between the adjacent protruding electrodes 7 and conduct between the electrode terminals in some cases. Therefore,
After press-fitting the conductive particles 6 into the protruding electrodes 7, air is blown around the protruding electrodes 7 from an air nozzle 10 to blow off excess conductive particles existing between the protruding electrodes 7. Thus, the conductive particles 6 between the protruding electrodes 7 are efficiently and reliably removed. As a result, no short circuit occurs between the electrode terminals of the liquid crystal driving IC 1 due to the conductive particles 3, and the reliability and the yield are improved.

Embodiment 6 FIG. Further, as another embodiment of the present invention defined in claim 10 wherein, because many of the conductive particles 6 except protruding electrodes 7 parts attached by static electricity, by blowing ionized air,
The conductive particles 6 between the protruding electrodes 7 can be more effectively removed. Furthermore, an IC for driving a liquid crystal by applying static electricity
1 can be prevented from being destroyed.

Embodiment 7 FIG. Furthermore, as one embodiment of the invention described in claim 11 ,
After the conductive particles 6 are transferred to the protruding electrodes 7, vibrations, for example, ultrasonic waves or shock waves are applied to the protruding electrodes 7, that is, the liquid crystal driving IC 1, and the conductive particles other than the protruding electrode 7 portions are applied in the same manner as in Examples 5 and 6. 6 can be eliminated. At this time, the vibration may be given by, for example, an ultrasonic wave via the heating / pressing head 9, or the liquid crystal driving IC 1 may be vibrated while heating the liquid crystal driving IC 1 without cooling the heating of the heating / pressing head 9. Moreover, you may hit it lightly with a hammer or the like.

Embodiment 8 FIG. FIG. 3 shows an embodiment according to the second and twelfth aspects of the present invention. In the figure, 11 is a liquid crystal display panel, 12 is an output wiring pattern formed on the liquid crystal display panel 11, 13 is a flexible substrate for supplying an input signal to the liquid crystal driving IC1, and a flexible substrate is mounted on the mounting portion of the liquid crystal display panel 11. 13 are arranged. 14 is a flexible substrate 1
3 is an input wiring pattern formed in FIG. Reference numeral 15 denotes a protrusion formed on the transfer substrate 8, and the height of the protrusion, that is, the step in the press-fitting direction is equal to a value obtained by subtracting the thickness of the output wiring pattern 12 from the sum of the thicknesses of the flexible substrate 13 and the input wiring pattern 14. . As shown in FIG. 3A, when an input signal is supplied to the liquid crystal driving IC 1 by the flexible substrate 13, the input wiring pattern 14 is located higher than the output wiring pattern 12 by the thickness of the flexible substrate 13.
Therefore, the output wiring pattern 12 and the electrode terminal 2 of the liquid crystal driving IC 1 are hardly in contact with each other, and an open failure may occur. Therefore, as shown in FIG.
The conductive particles are mounted on the transfer substrate 8 on which the liquid crystal driving IC 5 is formed, the input projection electrodes of the liquid crystal driving IC are arranged on the projections 15, and the liquid crystal driving IC 1 is pressed by the head 9 to project the conductive particles 6. Press into electrode 7. Then, as shown in FIG.
In the projection electrode for input of the liquid crystal driving IC 1, the depth of press-fitting of the conductive particles 6 is increased and the height is determined by subtracting the thickness of the output wiring pattern 12 from the sum of the thicknesses of the flexible substrate 13 and the input wiring pattern 14. Only lower. As a result, the liquid crystal display panel and the electrode terminals of the liquid crystal driving IC are electrically connected only by slightly applying pressure to the liquid crystal driving IC 1, and no open failure occurs.

Embodiment 9 FIG. The transfer mechanism such as the heating / pressurizing head 9 and the transfer substrate 8 described in Embodiments 1 to 8 is provided in a bonder for connecting the liquid crystal display panel 11 and the liquid crystal driving IC 1 to press-fit the conductive particles 6. In addition, since the connection between the liquid crystal driving IC 1 and the liquid crystal display panel 11 can be consistently performed by one device, productivity is further improved.

Embodiment 10 FIG. FIG. 4 is a sectional view showing an embodiment relating to the first to twelfth aspects of the present invention . In the figure, reference numeral 16 denotes an IC mounting table on which electronic components, for example, a liquid crystal driving IC 1 are mounted;
7a is a concave portion formed on the IC mounting table 16.
When connecting the liquid crystal driving IC 1 to which the conductive particles 6 have been transferred and the liquid crystal display panel, the conductive particles 6 on the projecting electrodes 7
The conductive particles 6 come into contact with the C mounting table 16 and
There is a risk of getting out of the way. Therefore, the IC mounting table 16
Of the liquid crystal driving IC 1
Is supported at a portion other than the protruding electrode 7, the protruding electrode 7 does not come into contact with the IC mounting table 16 and the conductive particles 6 do not come off, and the connection reliability and the yield are improved.

Embodiment 11 FIG. FIG. 5 shows another embodiment related to the first to twelfth aspects of the present invention . As shown in FIG.
Has the same effect.

Embodiment 12 FIG. An embodiment related to the first and second aspects of the present invention will be described. In the electronic components as described in the first to eleventh embodiments, the protruding electrodes or electrode terminals may be formed on a chip component such as an IC chip, a chip resistor or a chip capacitor, or the IC wafer before cutting out the IC chip. May be formed. That is, processing may be performed one chip at a time, or all steps may be performed in a wafer state. Furthermore, there is no problem even if the wafer is divided into 1/2, 1/4, and the like. By performing the press-fitting of the conductive particles 6 on the wafer, the productivity can be improved. As described above, when the transfer process is performed in a wafer state, it is necessary to dice the wafer into individual IC chips after the transfer process. On the other hand, in the case of chip components, the conductive particles 6 can be mounted only on non-defective products.

Embodiment 13 FIG. FIG. 6 is a manufacturing process diagram showing an embodiment relating to the first and second aspects of the present invention . In the figure, 18 is the conductive particles 6
Is a volatile solvent containing ethanol. First, as shown in FIG. 6A, the manufacturing method
Ethanol 18 in which conductive particles 6 are dispersed is applied by spin coating, spraying, or the like. Next, the transfer substrate 8 is left at room temperature. As shown in FIG. 6B, since the ethanol 18 evaporates, the conductive particles 6 are transferred to the transfer substrate 8.
It is loosely fixed evenly and without an adhesive layer. In addition, by appropriately selecting the type of volatility in which the conductive particles 6 are dispersed, the drying conditions, and the like, the adhesive layer is not formed, but the conductive particles 6 can be loosely fixed on the transfer substrate 8. The conductive particles 6 do not fall off from the transfer substrate 8 by subsequent handling or the like. Further, since the conductive particles 6 are not firmly fixed to the transfer substrate 8 by an adhesive, the conductive particles 6 are easily peeled off from the transfer substrate 8. Therefore, the projection electrode 7 of the liquid crystal driving IC 1 is heated and pressed.
The conductive particles 6 can be reliably and easily press-fitted into the substrate, and the yield can be improved. As the transfer substrate 8, for example, a silicon substrate is used. However, it is likely that the surface roughness of the substrate is related to the ease with which the conductive particles 6 are fixed, and it is difficult to use a mirror surface.

Embodiment 14 FIG. Another embodiment related to the first and second aspects of the present invention will be described. In the thirteenth embodiment, ethanol was used as a volatile solvent for dispersing the conductive particles 6. However, a liquid containing no dust or impurities and hardly remaining after evaporation, for example, acetone, IPA (isopropyl alcohol), pure water Etc. may be used. In addition, although drying after application is performed at room temperature, the temperature and heating method may be selected according to the solvent used. For example, when using pure water, a method of heating with a hot plate at about 80 ° C. Is valid. The number of the conductive particles 6 mounted on the transfer substrate 8 depends on the solvent 1
The transfer reliability of the conductive particles 6 can be improved by easily adjusting the content of the conductive particles 6 dispersed in the conductive particles 4 and the spin speed.

Embodiment 15 FIG. Still another embodiment related to the first and second aspects of the present invention will be described. Since the conductive particles 6 remaining on the transfer substrate 8 that have not been pressed into the protruding electrodes 7 and the like can be easily removed with a solvent such as acetone or ethanol, the remaining conductive particles 6 are collected and reapplied to the transfer substrate 8. As a result, manufacturing costs can be reduced. At this time, it goes without saying that the transfer substrate 8 can also be reused. Further, the transfer substrate 8
Is formed in a box shape with the peripheral edge lifted as shown in FIG. 7, so that the conductive particles 6 washed away with the solvent accumulate on the transfer substrate 8. By spinning the transfer substrate 8 in this state, the conductive particles 6 can be easily and uniformly applied again, and the productivity is further improved.

Embodiment 16 FIG. An embodiment related to the inventions according to claims 7 to 12 will be described. When a transfer substrate 8 having concave portions formed on the surface thereof at predetermined intervals is used, the conductive particles 6 are held in the concave portions and dispersed at predetermined intervals when a solvent containing the conductive particles 6 is applied to the transfer substrate. Therefore, it is possible to disperse the conductive particles 6 on the transfer substrate 8 at a desired interval by controlling the interval between the concave portions.

Embodiment 17 FIG. It relates to another embodiment of the invention of claim 12 wherein the projection electrodes 7
A method for connecting a liquid crystal driving IC in which no is formed will be described with reference to FIG. In the figure, reference numeral 15 denotes a projection corresponding to the electrode terminal 2 of the liquid crystal driving IC 1, which is formed by an etching method or the like. As shown in FIG. 8A, the transfer substrate 8 having a step in the press-fitting direction due to the protrusion 15.
The conductive particles 6 are mounted on the surface of the substrate. The mounting of the conductive particles 6 is performed, for example, according to the method of the fourteenth embodiment. Next, as shown in FIG. 8B, the electrode terminals 2 of the liquid crystal driving IC 1 and the projections 15 of the transfer substrate are positioned so as to face each other, and heated and pressed by the head 9. As a result, as shown in FIG. 8C, the conductive particles 6 are pressed into the electrode terminals 2 of the liquid crystal driving IC 1. In addition, due to the pressing force that presses the liquid crystal driving IC 1, the conductive particles 6 and the surface of the electrode terminal 2 are slightly deformed, the natural oxide film on the surface is also removed, and a reliable connection is obtained.

Embodiment 18 FIG. FIG. 9 is a manufacturing process diagram showing one embodiment of the third aspect of the present invention. In the figure, reference numeral 19 denotes an insulating resin layer, for example, a negative photosensitive resist. Next, a manufacturing method will be described. First, as shown in FIG.
A negative photosensitive resist 19 is applied to the surface of C1 by spin coating or printing. Next, the liquid crystal driving IC 1
Is heated at about 90 ° C. to pre-bake the negative photosensitive resist 19. Then, as shown in FIG. 9B, the liquid crystal driving IC 1 and the photomask 4 on which the electrode terminal 2 pattern of the liquid crystal section driving IC is formed are aligned, and the exposure device 5 uses the negative type photosensitive resist 19. Is exposed. By performing post-exposure development, as shown in FIG. 9C, the negative photosensitive resist 19 selectively remains on the projecting electrodes 7, and is a hardened insulating resin having plasticity on the projecting electrodes 7. Nineteen layers can be formed. in this way,
Since the negative photosensitive resist 19 layer can be selectively formed on the bump electrodes 7 of the liquid crystal driving IC 1 by applying the photolithography method, the liquid crystal driving IC 1 which tends to have fine pitch and multiple terminals is formed. Has the effect that the electrode terminals can be easily adapted to two pitches. Further, since the electrode terminals 2 are covered with the negative photosensitive resist 19 layer, it is possible to prevent the liquid crystal driving IC 1 from being destroyed by applying static electricity. Although the case of a negative photosensitive resist has been described, it goes without saying that a positive photosensitive resist has the same effect.

Embodiment 19 FIG. Further, as the insulating resin layer 19, any resin may be used as long as it has a property that plastic deformation is easily caused by a pressing force.
Not limited to the above-mentioned photosensitive resist, for example, silicon resin, acrylic resin, epoxy resin, polyimide resin and the like may be used.

Embodiment 20 FIG. As a method for forming the insulating resin layer 19 on the electrode terminals 2, for example, a printing method includes a screen printing method, a pad printing method, and a transfer printing method. The pad printing method will be briefly described with reference to FIG. In the figure, 20 is an elastic rubber pad, 21 is a metal blade having a concave portion 21a formed corresponding to the electrode terminal 2 pattern of the liquid crystal driving IC, and 22 is a squeegee for rubbing the insulating resin 19 against the metal blade 21. is there. First, as shown in FIG. 10A, an insulating resin 19 is applied to a metal blade 21. Next, as shown in FIG. 10B, the insulating resin 19 is packed in the concave portion 21 a of the metal blade 21 by the squeegee 22. Then, by pressing the rubber pad 20 against the metal blade 21, the recess 21 a of the metal blade 21 is formed.
Is transferred to the rubber pad 20. Next, as shown in FIG. 10C, the rubber pad 20 is pressed against the liquid crystal driving IC 1, and the insulating resin 19 layer is transferred to the bump electrode 7. Finally, the insulating resin 19 is cured to form a plastic cured uncured insulating resin 19 layer on the protruding electrodes 7.

The transfer printing method will be briefly described with reference to FIG. In the figure, reference numeral 23 denotes a resin-coated substrate on which an insulating resin 19 is applied. First, as shown in FIG. 11A, an insulating resin 19 is applied to a uniform thickness on a resin application substrate 23 by a screen printing method or the like. Next, as shown in FIG. 11 (b), the liquid crystal driving IC 1 on which the projecting electrodes 7 are formed is pressed against the resin coating substrate 23, and the insulating resin 19 is attached to the projecting electrodes 7 of the liquid crystal driving IC 1.
Then, as shown in FIG. 11 (c), the insulating resin is cured, and
Nine layers are formed. Such a printing method is excellent in mass productivity, and since the insulating resin 19 layer can be formed only by a printing machine, improvement in productivity and reduction in cost can be realized.

Embodiment 21 FIG. Also relates to another embodiment of the invention of claim 3, wherein, in the liquid crystal driving IC1 which protruding electrodes 7 are not formed, a method of forming the insulating resin 19 layer with a transfer printing method, FIG. 12
This will be described with reference to FIG. In the figure, 24 is a liquid crystal driving IC
Resin coated substrate 23 formed corresponding to one electrode terminal 2
The protrusion. First, as shown in FIG. 12A, an insulating resin 19 is applied to the surface of the resin application substrate 23 including the protrusion 24. Next, as shown in FIG. 12B, the liquid crystal driving IC 1 and the protrusion 24 of the resin-coated substrate are opposed to each other and aligned and pressed. Then, as shown in FIG. 12 (c), an insulating resin 19 is attached to the electrode terminals 2 of the liquid crystal driving IC 1, and then the insulating resin 19 is cured.
Then, a 19-layer cured plastic insulating resin having plasticity is formed.

As described above, in the screen printing method, the pad printing method, and the photolithography method, the projection electrode 7 may or may not be provided, and it can be applied to all IC chips. Further, the material of the protruding electrode 7 is not particularly limited, and a normal material structure such as Au or Cu can be used.
Furthermore, the electrode terminal 2 on which the protruding electrode 7 is not formed
In this case, no special electrode material is required, and a normal electrode metallization such as Al may be used.

Embodiment 22 FIG. FIG. 13 is a sectional view showing another embodiment of the third aspect of the present invention. In this example, as shown in FIG. 13, an uncured insulating resin 1 having plasticity is formed on the entire surface of the liquid crystal driving IC 1.
Nine layers are formed. The manufacturing method is the liquid crystal driving IC 1
An insulating resin, for example, a polyimide resin 19 is applied to the wiring pattern surface to a thickness of about several μm by spin coating, screen printing, pad printing, transfer printing, or the like. Next, the liquid crystal driving IC 1 is heated and cured by curing the polyimide resin 19, thereby forming a polyimide resin 19 layer on the entire surface of the liquid crystal driving IC 1. Thus, the polyimide resin 19 is formed on the entire surface of the liquid crystal driving IC 1.
Is applied without any influence of the pitch of the electrode terminals 2 or the number of electrode terminals, and the liquid crystal driving I / F which has a fine pitch and multiple terminals is provided.
C1 can be easily handled. In addition, since the electrode terminals 2 are covered with the polyimide resin 19 layer, static electricity can be applied to prevent the liquid crystal driving IC 1 from being broken.

Although the case where the insulating resin is a polyimide resin has been described, the present invention is not limited to this. Any resin may be used as long as it has characteristics that easily cause plastic deformation by a pressing force. An epoxy resin, a photosensitive resist, or the like may be used. Further, in the case of an electronic component having low heat resistance, it is not necessary to heat the electronic component if a room-temperature-curable insulating resin, for example, a moisture-curable silicone resin is used.

Further, the projecting electrode 7 of the liquid crystal driving IC
May or may not be present. Further, the material structures of the electrode terminals 2 and the protruding electrodes 7 are not particularly limited.
l, Au, metallized, such as Cu is found using.

Embodiment 23 FIG. An embodiment of the invention according to claim 6 will be described. In the electronic components as described in Examples 18 to 22, the protruding electrodes or electrode terminals may be formed on chip components such as IC chips, chip resistors, and chip capacitors,
It may be formed on the IC wafer before cutting out the IC chip. That is, processing may be performed one chip at a time, or all steps may be performed in a wafer state. Furthermore, there is no problem even if the wafer is divided into 1/2, 1/4, and the like. The productivity can be further improved by forming the insulating resin 19 layer on the wafer. As described above, when the insulating resin 19 layer is formed in a wafer state, it is necessary to dice the wafer into individual IC chips after the insulating resin 19 layer is formed. On the other hand, in the case of chip components, the insulating resin layer 19 can be formed only on non-defective products.

Embodiment 24 FIG. FIG. 14 is a manufacturing process diagram showing one embodiment of the invention according to claims 4 and 7 . In the present invention, as described in detail in Examples 18 to 23, the conductive particles 6 are press-fitted into the 19 cured plastic resin layers formed on the protruding electrodes 7 or the electrode terminals 2 according to claim 6. The present invention relates to an electrode terminal structure and a method for manufacturing the same. First, the manufacturing method is shown in FIG.
As shown in FIG. 4A, the liquid crystal driving IC 1 in which the insulating resin 19 layer is formed at the tip of the protruding electrode 7 is pressed against the transfer substrate 8 on which the conductive particles 6 are mounted. Here, the conductive particles 6 are described in detail in Examples 13 to 16.
The method can be easily mounted on the transfer substrate 8 by the methods related to 1 and 2 . Next, as shown in FIG.
The conductive particles 6 are pressed into the insulating resin 19 layer,
Contacts the protruding electrode 7, and the conductive particles 6 can be fixed to the protruding electrode 7. Even after the conductive particles 6 and the protruding electrodes 7 come into contact with each other, by applying pressure, the protruding electrodes 7 are deformed, and the intervening insulating resin 19 is eliminated.
The protruding electrode 7 and the conductive particles 6 are formed by frictional force or the like at that time.
The surface oxide layer is destroyed and a good contact is obtained. As described above, since the conductive particles 6 are pressed into the already cured insulating resin 19 layer, at least a part of the spherical surface of the conductive particles 6 is exposed from the insulating resin 19 layer. The connection between the chip and another wiring board is achieved. By pressing the liquid crystal driving IC 1 against the liquid crystal display panel, a lighting test of the liquid crystal display panel can be performed. In addition, since the conductive particles 6 are fixed only on the protruding electrodes 7, short-circuit failure does not occur between adjacent protruding electrodes 7, and connection reliability is improved. In addition, since the insulating resin layer 19 having plasticity, which is liable to undergo plastic deformation by pressure, is formed on the protruding electrodes 7, the conductive particles 6 are easily pressed into the protruding electrodes 7, and are reliably transferred from the transfer substrate 8 onto the protruding electrodes 7. , Connection reliability and yield are improved. Further, since the insulating resin 19 is in a cured state and does not change with time or adhere to dust, the conductive particles 6 are not cured.
Can be reliably press-fitted. Further, when transferring the conductive particles 6, the liquid crystal driving IC 1 is pressed against the transfer substrate 8 by the head 9. Therefore, even if the height of the bump electrodes 7 varies, the bump electrodes 7 and the bumps 7 are deformed. ,
The height of the protruding electrodes including the conductive particles 6 becomes uniform. Therefore, when connecting to the liquid crystal display panel 11, the liquid crystal driving IC
The electrode terminal of the liquid crystal display panel and the liquid crystal driving IC can be electrically connected only by slightly applying pressure to 1.

Embodiment 25 FIG. FIG. 15 shows another embodiment of the invention according to claims 4 and 12 and is a manufacturing process diagram showing a method of press-fitting the conductive particles 6 into the liquid crystal driving IC 1 having the insulating resin 19 applied to the entire surface. First, as shown in FIG.
The conductive particles 6 are mounted on the surface of the transfer substrate 8 on which the projections 15 are formed so as to correspond to the C projection electrodes 7. The conductive particles 6 can be mounted on the transfer substrate 8 by the method described in claim 16. Next, as shown in FIG.
The projection electrodes 7 of the liquid crystal driving IC and the projections 15 of the transfer substrate are positioned so as to face each other, and are pressed by the head 9. Thus, as shown in FIG. 15C, the conductive particles 6 are pressed into the insulating resin 19 on the protruding electrodes 7 and fixed. According to this method, since the conductive particles 6 are mounted only on the protruding electrodes 7, short-circuit failure does not occur between the protruding electrodes 7, and connection reliability and yield are improved.

Embodiment 26 FIG. It will be described another embodiment of the invention of claim 4 and 7, wherein. In the above embodiments 24 and 25, the case where the protruding electrode 7 is formed on the liquid crystal driving IC 1 has been described.
Needless to say, the conductive particles 6 can be mounted in C1 by the same process. In the case where the liquid crystal driving IC does not have the protruding electrode 7, the conductive particles 6 are mounted on the electrode terminals 2 and then further pressurized to slightly deform the conductive particles 6 and the surface of the electrode terminals 2, At this time, the intervening resin is removed, and the natural oxide film on the surface is also removed by the frictional force, so that a reliable connection is obtained.

Embodiment 27 FIG. Further, as another embodiment of the invention of claim 12 wherein the area of FIG. 8 and projection 15 formed on the transfer substrate 8 as shown in Figure 15 of Example 17 and Example 25, the liquid crystal driving Formed smaller than the electrode terminal 2 size of the IC for use. As a result, the conductive particles 6 are mounted in the central portion of the electrode terminal 2, so that a short circuit between the adjacent electrode terminals 2 does not easily occur, and the connection reliability is improved.

Embodiment 28 FIG. Furthermore, as another embodiment of the invention described in claim 7 ,
When press-fitting the conductive particles 6 into the insulating resin layer 19, FIG.
As shown in (2), the operation may be stopped at a stage where the conductive particles 6 do not contact the electrode terminals 2 of the liquid crystal driving IC 1. In this case, when the liquid crystal driving IC 1 is pressure-connected to the liquid crystal display panel 11, the conductive particles 6 are further pressed into the insulating resin layer 19,
The electrode terminals of the liquid crystal display panel 11 and the liquid crystal driving IC 1 are
They are electrically connected via the conductive particles 6.

Embodiment 29 FIG. Further, as another embodiment of the present invention, when the liquid crystal driving IC 1 is pressed against the transfer substrate 8 by the head 9, not only the pressing but also the heating and the pressing may be performed simultaneously. Furthermore, by applying ultrasonic waves, the insulating resin 19 is deformed even by a slight pressure, and the conductive particles 6 are deformed.
Can be reliably press-fitted. Further, there is also an effect of removing an oxide film on the surfaces of the conductive particles 6 and the electrode terminals 2. It is needless to say that the ultrasonic wave may be applied from the transfer substrate 8 side or from both sides of the head 9 and the transfer substrate 8, which is more effective. Further, as in the eighth embodiment of the present invention described in claim 12 , the projection 15 is formed on the transfer substrate 8 so that the mounting portion of the circuit board to which the IC chip is connected has irregularities. Can also respond. Therefore, I
The connection reliability between the C chip and the circuit board is improved.

Embodiment 30 FIG. Further, as another embodiment of the invention as set forth in claim 6 , in the electronic parts as described in the embodiments 24 to 29, the protruding electrodes or electrode terminals are formed on chip parts such as IC chips, chip resistors and chip capacitors. May be
What is formed on the IC wafer before the IC chip is cut out is the same as that described in the twelfth and twenty-third embodiments.

[0068]

As described above , according to the first aspect of the present invention, the protruding electrode or electrode terminal having the higher height is used.
The press-fit depth of the projecting electrode or
Formed deeper than the electrode terminal press-fit depth by the above height difference
The height of the protruding electrodes or electrode terminals
In the case where the protruding electrodes or electrode terminals are
Can be securely connected.

According to the second aspect of the present invention, the height is
The protruding electrode connected to the higher wiring pattern or
The wiring pattern with the lower electrode terminal press-in depth
Depth of the protruding electrode or electrode terminal connected to the
Is formed deeper by the above-mentioned height difference.
Even when the height of the line patterns are different, the protruding electrodes or electrostatic
The pole terminal and the wiring pattern can be securely connected.

According to the third aspect of the present invention, at least
Pre-cured insulation with plasticity on protruding electrodes or electrode terminals
Since an edge resin layer is formed,
Destruction of electronic components can be prevented.

According to the invention described in claim 4, the protruding electrode and the protruding electrode are provided.
Or conductive particles in the insulating resin layer formed on the electrode terminals
Since it is press-fitted,
Since conductive particles are pressed into the edge resin layer, the conductive particles
It is easy to control the press-fit amount of the child, and the connection reliability is improved. Ma
In addition, the insulating resin layer that is prone to plastic deformation due to pressure
Because it is formed on electrodes or electrode terminals, conductive particles
Is easy to press-fit, and connection reliability and yield are improved.
Furthermore, the insulating resin is in a cured state,
Press-fit conductive particles without any dust
be able to.

According to the fifth aspect of the present invention, the insulating resin
The layer is made of photosensitive resist, silicone resin, acrylic resin,
If it is made of oxy resin or polyimide resin,
A hardened insulating resin layer having plasticity is obtained.

According to the sixth aspect of the present invention, the protrusion electrode and
Or electrode terminals are formed on chip parts or IC wafers.
In the case of chip parts, only conductive
It can be mounted, and in the case of an IC wafer, the productivity is improved.

According to the seventh aspect of the present invention, on the transfer substrate
The conductive particles dispersed in the projection electrode, the electrode terminal, or
A pre-cured resin with plasticity formed on these electrodes
Since it is press-fitted into the edge resin layer by pressurization, protrusions containing conductive particles
The height of the electromotive electrode or the electrode terminal becomes uniform. for that reason,
When connecting this electronic component to other electronic components, etc.
By simply applying pressure, the connection between both electronic components can be electrically connected.
Wear.

According to the eighth aspect of the present invention, the pressure is applied to the protrusion.
At least one of the electrodes or the electrode terminals, and Shirubedentsubu child
Is performed while heating, so that conductive particles can be more reliably
Press fit.

According to the ninth aspect of the present invention, the pressure is applied to the protrusion.
Electrodes or electrode terminals and / or at least one of conductive particles
Conducting while applying ultrasonic waves to the conductive particles
Can be pressed into the electrode. According to the invention described in claim 10,
After press-fitting the conductive particles,
To remove excess conductive particles.
Do not cause a short circuit between the electrodes or electrode terminals due to conductive particles.
The reliability and yield are improved.

According to the eleventh aspect, the conductive particles
Vibrating the protruding electrodes or electrode terminals after press-fitting
Elimination of conductive particles
No short-circuits due to conductive particles
And yield are improved.

According to the twelfth aspect of the present invention, the conductive particles
Use a substrate with a gap in the press-fit direction
Therefore, apply conductive particles to electrodes of the same height,
Press-fit or press-fit conductive particles to electrodes of different heights
Can be press-fitted.

[Brief description of the drawings]

FIG. 1 is a manufacturing process diagram illustrating an electronic component and a method for manufacturing the same according to a first embodiment.

FIG. 2 is a sectional view illustrating a method for manufacturing an electronic component according to a fifth embodiment.

FIG. 3 is a manufacturing process diagram showing an electronic component and a method for manufacturing the same according to an eighth embodiment.

FIG. 4 is a cross-sectional configuration diagram illustrating an electronic component mounting table according to a tenth embodiment.

FIG. 5 is a cross-sectional configuration diagram illustrating an electronic component mounting table according to an eleventh embodiment.

FIG. 6 is a manufacturing step diagram showing a method for manufacturing an electronic component according to Embodiment 13.

FIG. 7 is a sectional view illustrating a method for manufacturing an electronic component according to Embodiment 15.

FIG. 8 is a manufacturing step diagram showing a method for manufacturing an electronic component according to Embodiment 17.

FIG. 9 is a manufacturing step diagram showing an electronic component and a method for manufacturing the same according to Example 18.

FIG. 10 is a manufacturing step diagram showing a method for manufacturing an electronic component according to Example 20.

FIG. 11 is a manufacturing process diagram showing a method for manufacturing an electronic component according to Example 20.

FIG. 12 is a manufacturing step diagram showing a method for manufacturing an electronic component according to Example 21.

FIG. 13 is a sectional view showing an electronic component according to Example 22.

FIG. 14 is a manufacturing process diagram showing the method for manufacturing an electronic component according to Example 24.

FIG. 15 is a manufacturing step diagram showing an electronic component and a method for manufacturing the same according to Example 25.

FIG. 16 is a sectional configuration diagram showing an electronic component according to Example 28.

FIG. 17 is a manufacturing process diagram illustrating an example of a conventional electronic component and a method for manufacturing the same.

[Description of Signs] 1 Liquid crystal driving IC 2 Electrode terminal 3a Uncured ultraviolet curable resin 3b Uncured ultraviolet curable resin 4 Photomask 5 Exposure device 6 Conductive particle 7 Protruding electrode 8 Transfer substrate 9 Head 10 Air nozzle 11 Liquid crystal display Panel 12 Output wiring pattern 13 Flexible substrate 14 Input wiring pattern 15 Projection formed on transfer substrate 16 IC mounting table 17a Depression 17b Convex 18 Volatile solvent 19 Insulating resin 20 Rubber pad 21 Metal blade 22 Squeegee 23 Resin Coating substrate 24 Projection formed on resin coating substrate

Continued on the front page (72) Inventor Mitsuyuki Takada 8-1-1 Tsukaguchi Honcho, Amagasaki City Inside Mitsubishi Materials Corporation Materials and Devices Laboratory (72) Inventor Tomio Kawado 8-1-1 Tsukaguchi Honcho Amagasaki City Mitsubishi Electric Corporation (56) References JP-A-1-227444 (JP, A) JP-A-5-74846 (JP, A) JP-A-6-252148 (JP, A) JP-A-4- 116944 (JP, A) JP-A-4-323384 (JP, A) JP-A-5-297398 (JP, A) JP-A-6-51337 (JP, A) JP-A-6-69278 (JP, A) JP-A-6-96826 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/60 G02F 1/1345

Claims (12)

(57) [Claims] At least two protrusions having different heights from each other.
Having a protruding electrode or electrode terminal;
Conductive particles are press-fitted into the terminals, and
When the protruding electrode or electrode terminal is connected to the wiring pattern
In the child component, press-fit the higher protruding electrode or electrode terminal.
Press-fitting the protruding electrode or electrode terminal with the lower depth
Be formed deeper than the depth by the difference in height
Electronic components characterized by the following. 2. At least two protruding electrodes or electrode terminals, wherein conductive particles are press-fitted into each of the protruding electrodes or electrode terminals, and the protruding electrodes or electrodes are inserted through the conductive particles.
Terminals connected to wiring patterns of different heights
In the sub component, the protrusion connected to the higher wiring pattern
The protrusion in which the press-fit depth of the electrode or the electrode terminal is connected to the wiring pattern having the lower height.
The difference between the above heights from the press-fit depth of the electrode or electrode terminal
An electronic component characterized by being formed deeply. 3. At least a projection electrode or an electrode terminal is provided.
Also have plasticity on these protruding electrodes or electrode terminals
Characterized in that a cured insulating resin layer is formed.
Electronic components. 4. The method according to claim 1, wherein the electrode is formed on a protruding electrode or an electrode terminal.
The conductive particles are pressed into the insulating resin layer.
The electronic component according to claim 3, wherein 5. The insulating resin layer is made of a photosensitive resist, silicon
Resin, acrylic resin, epoxy resin, or polyimide
4. The semiconductor device according to claim 3, wherein said resin is made of resin.
Or the electronic component according to 4. 6. The semiconductor device according to claim 1, wherein the protruding electrode or the electrode terminal is a chip component.
Or formed on an IC wafer.
Item 6. The electronic component according to any one of Items 3 to 5. 7. The method according to claim 7, wherein the conductive particles dispersed on the transfer substrate are projected.
Electrodes, electrode terminals, or formed on these electrodes
Press-fit into the hardened insulating resin layer with plasticity
A method for manufacturing an electronic component. 8. The pressure is applied to a protruding electrode or an electrode terminal, and
The method is performed while heating at least one of the conductive particles.
The method for manufacturing an electronic component according to claim 7, wherein: 9. The pressure is applied to a protruding electrode or an electrode terminal, and
Performed while applying ultrasonic waves to at least one of the conductive particles
9. The electronic component according to claim 7, wherein:
Construction method. 10. A protruding electrode or electrode after press-fitting of conductive particles.
Blow air around the pole terminals to remove excess conductive particles.
The method according to any one of claims 7 to 9, wherein
Method for manufacturing the electronic components described above. 11. A protruding electrode or electrode after press-fitting of conductive particles.
Apply extra vibration to the pole terminals to remove excess conductive particles.
The electronic part according to any one of claims 7 to 10, wherein:
Product manufacturing method. 12. A press-fit direction is applied to a substrate on which conductive particles are dispersed.
8. The method according to claim 7, wherein a difference is used.
12. The method for manufacturing an electronic component according to any one of claims 11 to 11.