JPH03102752U - - Google Patents
Info
- Publication number
- JPH03102752U JPH03102752U JP1990011022U JP1102290U JPH03102752U JP H03102752 U JPH03102752 U JP H03102752U JP 1990011022 U JP1990011022 U JP 1990011022U JP 1102290 U JP1102290 U JP 1102290U JP H03102752 U JPH03102752 U JP H03102752U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- semiconductor light
- adhesive layer
- submount
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims 6
- 238000005219 brazing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990011022U JPH03102752U (zh) | 1990-02-08 | 1990-02-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990011022U JPH03102752U (zh) | 1990-02-08 | 1990-02-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03102752U true JPH03102752U (zh) | 1991-10-25 |
Family
ID=31514566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990011022U Pending JPH03102752U (zh) | 1990-02-08 | 1990-02-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03102752U (zh) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6052079A (ja) * | 1983-09-01 | 1985-03-23 | Matsushita Electric Ind Co Ltd | 半導体レ−ザ装置 |
JPS6210461B2 (zh) * | 1979-04-11 | 1987-03-06 | Nippon Electric Co |
-
1990
- 1990-02-08 JP JP1990011022U patent/JPH03102752U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6210461B2 (zh) * | 1979-04-11 | 1987-03-06 | Nippon Electric Co | |
JPS6052079A (ja) * | 1983-09-01 | 1985-03-23 | Matsushita Electric Ind Co Ltd | 半導体レ−ザ装置 |
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