JPH0173931U - - Google Patents
Info
- Publication number
- JPH0173931U JPH0173931U JP1987169556U JP16955687U JPH0173931U JP H0173931 U JPH0173931 U JP H0173931U JP 1987169556 U JP1987169556 U JP 1987169556U JP 16955687 U JP16955687 U JP 16955687U JP H0173931 U JPH0173931 U JP H0173931U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- metal
- soldering
- semiconductor
- main surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987169556U JPH0173931U (zh) | 1987-11-05 | 1987-11-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987169556U JPH0173931U (zh) | 1987-11-05 | 1987-11-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0173931U true JPH0173931U (zh) | 1989-05-18 |
Family
ID=31459726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987169556U Pending JPH0173931U (zh) | 1987-11-05 | 1987-11-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0173931U (zh) |
-
1987
- 1987-11-05 JP JP1987169556U patent/JPH0173931U/ja active Pending
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