JPS6183041U - - Google Patents
Info
- Publication number
- JPS6183041U JPS6183041U JP1984168804U JP16880484U JPS6183041U JP S6183041 U JPS6183041 U JP S6183041U JP 1984168804 U JP1984168804 U JP 1984168804U JP 16880484 U JP16880484 U JP 16880484U JP S6183041 U JPS6183041 U JP S6183041U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- sandwiched
- joined
- base material
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 238000005219 brazing Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984168804U JPS6183041U (zh) | 1984-11-07 | 1984-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984168804U JPS6183041U (zh) | 1984-11-07 | 1984-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6183041U true JPS6183041U (zh) | 1986-06-02 |
Family
ID=30726567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984168804U Pending JPS6183041U (zh) | 1984-11-07 | 1984-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6183041U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6420727U (zh) * | 1987-07-27 | 1989-02-01 |
-
1984
- 1984-11-07 JP JP1984168804U patent/JPS6183041U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6420727U (zh) * | 1987-07-27 | 1989-02-01 |