JPH029907B2 - - Google Patents
Info
- Publication number
- JPH029907B2 JPH029907B2 JP930386A JP930386A JPH029907B2 JP H029907 B2 JPH029907 B2 JP H029907B2 JP 930386 A JP930386 A JP 930386A JP 930386 A JP930386 A JP 930386A JP H029907 B2 JPH029907 B2 JP H029907B2
- Authority
- JP
- Japan
- Prior art keywords
- control member
- printed circuit
- molten solder
- circuit board
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 44
- 238000005476 soldering Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 6
- 230000000737 periodic effect Effects 0.000 claims 1
- 230000008878 coupling Effects 0.000 description 14
- 238000010168 coupling process Methods 0.000 description 14
- 238000005859 coupling reaction Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 5
- 230000004907 flux Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP930386A JPS62168665A (ja) | 1986-01-20 | 1986-01-20 | 自動半田付け方法及び装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP930386A JPS62168665A (ja) | 1986-01-20 | 1986-01-20 | 自動半田付け方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62168665A JPS62168665A (ja) | 1987-07-24 |
| JPH029907B2 true JPH029907B2 (enExample) | 1990-03-05 |
Family
ID=11716699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP930386A Granted JPS62168665A (ja) | 1986-01-20 | 1986-01-20 | 自動半田付け方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62168665A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0270862U (enExample) * | 1988-11-16 | 1990-05-30 |
-
1986
- 1986-01-20 JP JP930386A patent/JPS62168665A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62168665A (ja) | 1987-07-24 |
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