JPH0297754U - - Google Patents
Info
- Publication number
- JPH0297754U JPH0297754U JP529589U JP529589U JPH0297754U JP H0297754 U JPH0297754 U JP H0297754U JP 529589 U JP529589 U JP 529589U JP 529589 U JP529589 U JP 529589U JP H0297754 U JPH0297754 U JP H0297754U
- Authority
- JP
- Japan
- Prior art keywords
- cut
- hole
- holding part
- pad
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図ａは本考案実施例のリード端子を示す正
面図、第１図ｂは同リード端子を示す側面図、第
１図ｃは本考案の他の実施例のリード端子を示す
正面図、第１図ｄは同リード端子を示す側面図、
第２図ａは本考案実施例の混成集積回路を示す側
面図、第２図ｂは第２図ａにおけるＡ部拡大断面
図、第３図は従来の混成集積回路を示す側面図、
第４図ａは従来の混成集積回路用リード端子を示
す正面図、第４図ｂは同リード端子を示す側面図
である。
１…プリント基板、２…リード端子、２ｅ…鍔
、２ｆ…弾力保持部、３…ケース、４…部品、５
…リード端子用パツド、６…半田、７…部品用パ
ツド。
FIG. 1a is a front view showing a lead terminal according to an embodiment of the present invention, FIG. 1b is a side view showing the same lead terminal, and FIG. 1c is a front view showing a lead terminal according to another embodiment of the present invention. Figure 1d is a side view showing the lead terminal;
FIG. 2a is a side view showing a hybrid integrated circuit according to an embodiment of the present invention, FIG. 2b is an enlarged sectional view of section A in FIG. 2a, and FIG. 3 is a side view showing a conventional hybrid integrated circuit.
FIG. 4a is a front view showing a conventional lead terminal for a hybrid integrated circuit, and FIG. 4b is a side view showing the same lead terminal. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Lead terminal, 2e... Flange, 2f... Elastic holding part, 3... Case, 4... Parts, 5
... Pad for lead terminal, 6... Solder, 7... Pad for parts.
Claims (1)
中央に縦の切目を入れ、該切目の両側部を互いに
反対側に突出するように曲げて形成された弾力保
持部を備えたリード端子。 ２ 部品を搭載するプリント基板の任意の位置に
透孔を設け該透孔の周囲に導電性のパツドを配置
し、細長薄板の縁を切曲げ鍔を形成し、かつほぼ
中央に縦の切目を入れ該切目の両側部を互いに反
対側に突出するように曲げて弾力保持部を形成し
たリード端子の該弾力保持部を前記プリント基板
の透孔に前記鍔が前記パツドに密着するまで挿入
し、透孔と弾力保持部が圧接状態にて前記鍔とパ
ツドを半田付けしてなる混成集積回路。[Claims for Utility Model Registration] 1. A tsuba is formed by cutting the edge of a long thin plate, making a vertical cut approximately in the center, and bending both sides of the cut so as to protrude in opposite directions. Lead terminal with elastic holding part. 2 A through hole is provided at any position on the printed circuit board on which the component is mounted, a conductive pad is placed around the through hole, the edge of the thin thin plate is cut to form a collar, and a vertical cut is made approximately in the center. Insert the elastic holding part of the lead terminal, which is formed by bending both sides of the cut so as to protrude in opposite directions from each other, into the through hole of the printed circuit board until the collar comes into close contact with the pad, A hybrid integrated circuit in which the flange and pad are soldered while the through hole and the resilient holding part are in pressure contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP529589U JPH0297754U (en) | 1989-01-20 | 1989-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP529589U JPH0297754U (en) | 1989-01-20 | 1989-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0297754U true JPH0297754U (en) | 1990-08-03 |
Family
ID=31208548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP529589U Pending JPH0297754U (en) | 1989-01-20 | 1989-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0297754U (en) |
-
1989
- 1989-01-20 JP JP529589U patent/JPH0297754U/ja active Pending