JPH0290543A - Metal tape for semiconductor - Google Patents
Metal tape for semiconductorInfo
- Publication number
- JPH0290543A JPH0290543A JP24103088A JP24103088A JPH0290543A JP H0290543 A JPH0290543 A JP H0290543A JP 24103088 A JP24103088 A JP 24103088A JP 24103088 A JP24103088 A JP 24103088A JP H0290543 A JPH0290543 A JP H0290543A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- tape
- metal tape
- lead
- shape memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 7
- 239000004065 semiconductor Substances 0.000 title claims abstract description 4
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 abstract description 9
- 239000000956 alloy Substances 0.000 abstract description 4
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体用リードテープに係り、特にＴＡＢ実装
に好適なメタルテープの構成に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead tape for semiconductors, and particularly to a structure of a metal tape suitable for TAB mounting.
従来の１層メタルテープは、電子材料、１９８５年５月
号、７２頁から７６頁に記載されているように、材料と
しては純銅を用いていた。これは。The conventional single-layer metal tape uses pure copper as a material, as described in Electronic Materials, May 1985 issue, pages 72 to 76. this is.
電気伝導度、熱伝導度等に優れた銅が、入手し易さ、コ
スト安の利点を生かして好んで使用されている為である
。This is because copper, which has excellent electrical conductivity and thermal conductivity, is preferred because of its easy availability and low cost.
一方一般のリードフレーム材料は、パッケージ成形後の
リードの変形を防ぐため、従来より、鉄系材料（コバー
ル、４２７０イ等）が用いられており、最近低コスト化
を狙った銅合金系リードフレームが用いられるようにな
ってきた。しかし、これらのリードフレームは最低でも
厚さが０．１５ｍｍ以上あり、このため、数十μｍ厚さ
のＴＡＢ用テープと比較すると変形に対する抵抗力が強
かった。On the other hand, general lead frame materials have traditionally been made of iron-based materials (Kovar, 4270I, etc.) in order to prevent leads from deforming after package molding, and copper alloy lead frames have recently been used to reduce costs. has come to be used. However, these lead frames had a minimum thickness of 0.15 mm or more, and therefore had stronger resistance to deformation than TAB tapes having a thickness of several tens of micrometers.
上記従来技術はリードの変形に対しては材料面からの配
慮がなされておらず、ボンディング時にリードが変形し
ていることが、歩留り上大きな問題となっていた。In the above-mentioned conventional technology, no consideration was given to the deformation of the leads from the viewpoint of materials, and the deformation of the leads during bonding caused a major problem in terms of yield.
本発明の目的はこのリードの変形をテープ材料面から解
決しようとしたものである。The object of the present invention is to solve this problem of lead deformation from the viewpoint of the tape material.
上記目的は、材料として一方向性の形状記憶合金を用い
、あらかじめボンディング温度近傍で、形状を記憶させ
ることにより、達成される。The above object is achieved by using a unidirectional shape memory alloy as a material and memorizing the shape in advance near the bonding temperature.
以下本発明の実施例を第１図と第２図、第３図により説
明する。Embodiments of the present invention will be described below with reference to FIGS. 1, 2, and 3.
実施例１゜
テープ材料１は、形状記憶合金としては一般的な銅系合
金材料を使用した。厚さは７５μｍとして表面には０．
５μｍのＳｕめっきを殆した６変態点は１３５℃に調整
したく合金組成、熱処理条件によりメーカで調’１ｍ）
。第１図は本実施例の為に試作したＴＥＧパターンであ
る。Example 1 As tape material 1, a copper-based alloy material that is commonly used as a shape memory alloy was used. The thickness is 75μm and the surface is 0.
The 6th transformation point of most of the 5μm Su plating is adjusted to 135℃ by the manufacturer depending on the alloy composition and heat treatment conditions.
. FIG. 1 shows a TEG pattern prototyped for this example.
第２図は、形状を記憶せしめた形状を示す断面図であり
、プレス成形により、１５０℃で記憶せしめた。FIG. 2 is a sectional view showing a shape whose shape was memorized, and was memorized at 150° C. by press molding.
第３図は形状の復元性を調べるため人為的に室温で変形
せしめた例を示した。FIG. 3 shows an example in which the shape was artificially deformed at room temperature in order to examine the restorability of the shape.
これとボンディング予熱条件１５０℃、ツール温度５０
０℃にてボンディングした結果、満足すべき復元性が得
られ、５０サンプル中不良は０であった。尚第３図のま
まで形状が復元しない場合には１００％ボンディング不
良（位置ずれ）となり、ボンディングは不可能である。This and bonding preheating conditions 150℃, tool temperature 50℃
As a result of bonding at 0° C., satisfactory restorability was obtained, and there were no defects out of 50 samples. If the shape is not restored as shown in FIG. 3, there will be a 100% bonding failure (positional deviation), and bonding will not be possible.
実施例２゜
実施例１と同内容の試作を、もう１つの代表的合金であ
るＴ ｉ ／ Ｎ ｉ合金についても実施した。Example 2 The same trial production as in Example 1 was carried out using another typical alloy, Ti/Ni alloy.
結果は実施例１と全く同様であり、５０サンプル中、ボ
ンディング不良０の結果を得た。The results were exactly the same as in Example 1, with zero bonding defects out of 50 samples.
本発明によれば、リードの変形し易いメタル−層テープ
のリード変形がボンディング時自己矯正されるので、ボ
ンディング不良と防止できる効果がある。また一連の工
程でのハンドリング等が簡便となる効果がある。According to the present invention, lead deformation of the metal-layer tape, which tends to be easily deformed, is self-corrected during bonding, so that bonding defects can be prevented. It also has the effect of simplifying handling in a series of steps.
第１図は本発明の一実施例のＴＥＧパターンの上面図、
第２図は第１図のＡ−Ａ′線断面図、第３図は第２図と
同じ断面で故意にリードを変形せしめたことを示す断面
図である。
１・・・メタルテープ、２・・・リード。FIG. 1 is a top view of a TEG pattern according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view taken along the line A-A' in FIG. 1, and FIG. 3 is a cross-sectional view of the same cross-section as FIG. 2, showing that the lead has been intentionally deformed. 1...Metal tape, 2...Lead.
Claims (1)
プにおいて、該テープの一部又は全部が形状記憶合金よ
りなることを特徴とする半導体用メタルテープ。1. A metal tape for semiconductor leads having a thickness of 10 to 100 μm, characterized in that part or all of the tape is made of a shape memory alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24103088A JPH0290543A (en) | 1988-09-28 | 1988-09-28 | Metal tape for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24103088A JPH0290543A (en) | 1988-09-28 | 1988-09-28 | Metal tape for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0290543A true JPH0290543A (en) | 1990-03-30 |
Family
ID=17068282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24103088A Pending JPH0290543A (en) | 1988-09-28 | 1988-09-28 | Metal tape for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0290543A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09283567A (en) * | 1996-04-15 | 1997-10-31 | Nec Corp | Tab type semiconductor device and lead positioning method |
-
1988
- 1988-09-28 JP JP24103088A patent/JPH0290543A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09283567A (en) * | 1996-04-15 | 1997-10-31 | Nec Corp | Tab type semiconductor device and lead positioning method |
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