JPH0288268U - - Google Patents
Info
- Publication number
- JPH0288268U JPH0288268U JP16730088U JP16730088U JPH0288268U JP H0288268 U JPH0288268 U JP H0288268U JP 16730088 U JP16730088 U JP 16730088U JP 16730088 U JP16730088 U JP 16730088U JP H0288268 U JPH0288268 U JP H0288268U
- Authority
- JP
- Japan
- Prior art keywords
- substrates
- hole
- printed circuit
- terminal portion
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims 8
- 238000005476 soldering Methods 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16730088U JPH0288268U (US06168655-20010102-C00055.png) | 1988-12-23 | 1988-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16730088U JPH0288268U (US06168655-20010102-C00055.png) | 1988-12-23 | 1988-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0288268U true JPH0288268U (US06168655-20010102-C00055.png) | 1990-07-12 |
Family
ID=31455466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16730088U Pending JPH0288268U (US06168655-20010102-C00055.png) | 1988-12-23 | 1988-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0288268U (US06168655-20010102-C00055.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020174941A1 (ja) * | 2019-02-28 | 2020-09-03 | ソニー株式会社 | 電子機器及び基板 |
-
1988
- 1988-12-23 JP JP16730088U patent/JPH0288268U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020174941A1 (ja) * | 2019-02-28 | 2020-09-03 | ソニー株式会社 | 電子機器及び基板 |
| JPWO2020174941A1 (ja) * | 2019-02-28 | 2021-12-23 | ソニーグループ株式会社 | 電子機器及び基板 |
| US12101886B2 (en) | 2019-02-28 | 2024-09-24 | Sony Group Corporation | Electronic apparatus and substrate |
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