JPH0288235U - - Google Patents
Info
- Publication number
- JPH0288235U JPH0288235U JP16679488U JP16679488U JPH0288235U JP H0288235 U JPH0288235 U JP H0288235U JP 16679488 U JP16679488 U JP 16679488U JP 16679488 U JP16679488 U JP 16679488U JP H0288235 U JPH0288235 U JP H0288235U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- gas
- nozzle
- vacuum chuck
- spraying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
Landscapes
- Weting (AREA)
Description
第１図は本考案の実施例を示す図、第２図は従
来のウエハー裏面のエツチングを行なう装置を示
す図である。
図において、１０はウエハー支持部、１１はウ
エハー、１２は真空チヤツク、１３はガス吹き出
し手段、１４はウエハーロード部、１５はウエハ
ーアンロード部、１６は搬送手段、１７はエツチ
ング液受け槽、１８はエツチング液吹き付け用ノ
ズル、１９，２２はガス吹き付け用ノズル、２０
は純水受け槽、２１は純水吹き付け用ノズル、２
３はエツチング液循環装置、を示す。
FIG. 1 shows an embodiment of the present invention, and FIG. 2 shows a conventional apparatus for etching the back surface of a wafer. In the figure, 10 is a wafer support part, 11 is a wafer, 12 is a vacuum chuck, 13 is a gas blowing means, 14 is a wafer loading part, 15 is a wafer unloading part, 16 is a transport means, 17 is an etching liquid receiving tank, 18 is an etching liquid spray nozzle, 19 and 22 are gas spray nozzles, and 20
is a pure water receiving tank, 21 is a nozzle for spraying pure water, 2
3 indicates an etching liquid circulation device.
Claims (1)
２と該真空チヤツク１２に吸着されたウエハー１
１の周囲からガスを吹き出すガス吹き出し手段１
３とを有するウエハー支持部１０を懸吊して搬送
する搬送手段１６と、該搬送手段１６により搬送
されるウエハー１１の裏面にエツチング液を吹き
付けるノズル１８とガスを吹き付けるノズル１９
とが交互に該搬送手段１６の下方に配設されて成
ることを特徴とするウエハーエツチング装置。 Vacuum chuck 1 that attracts the wafer 11 to the bottom surface
2 and the wafer 1 attracted to the vacuum chuck 12
Gas blowing means 1 for blowing out gas from around 1
3, a nozzle 18 for spraying etching liquid on the back surface of the wafer 11 transported by the transport means 16, and a nozzle 19 for spraying gas.
A wafer etching apparatus characterized in that: and are alternately arranged below the conveying means 16.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16679488U JPH0288235U (en) | 1988-12-26 | 1988-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16679488U JPH0288235U (en) | 1988-12-26 | 1988-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0288235U true JPH0288235U (en) | 1990-07-12 |
Family
ID=31454496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16679488U Pending JPH0288235U (en) | 1988-12-26 | 1988-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0288235U (en) |
-
1988
- 1988-12-26 JP JP16679488U patent/JPH0288235U/ja active Pending