JPH0286134U - - Google Patents
Info
- Publication number
- JPH0286134U JPH0286134U JP1988165545U JP16554588U JPH0286134U JP H0286134 U JPH0286134 U JP H0286134U JP 1988165545 U JP1988165545 U JP 1988165545U JP 16554588 U JP16554588 U JP 16554588U JP H0286134 U JPH0286134 U JP H0286134U
- Authority
- JP
- Japan
- Prior art keywords
- pad body
- bonded
- aluminum
- laminating
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/90—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/5363—
-
- H10W72/5434—
-
- H10W72/5524—
-
- H10W72/59—
-
- H10W72/923—
-
- H10W72/934—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165545U JPH0286134U (enExample) | 1988-12-21 | 1988-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165545U JPH0286134U (enExample) | 1988-12-21 | 1988-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0286134U true JPH0286134U (enExample) | 1990-07-09 |
Family
ID=31452130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988165545U Pending JPH0286134U (enExample) | 1988-12-21 | 1988-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0286134U (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63185048A (ja) * | 1986-10-17 | 1988-07-30 | コミンコ・エレクトロニック・マテリアルズ・インコーポレーテッド | 半導体デバイス用ジャンパチップおよびその製造方法 |
-
1988
- 1988-12-21 JP JP1988165545U patent/JPH0286134U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63185048A (ja) * | 1986-10-17 | 1988-07-30 | コミンコ・エレクトロニック・マテリアルズ・インコーポレーテッド | 半導体デバイス用ジャンパチップおよびその製造方法 |
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