JPH0345641U - - Google Patents
Info
- Publication number
- JPH0345641U JPH0345641U JP1989106076U JP10607689U JPH0345641U JP H0345641 U JPH0345641 U JP H0345641U JP 1989106076 U JP1989106076 U JP 1989106076U JP 10607689 U JP10607689 U JP 10607689U JP H0345641 U JPH0345641 U JP H0345641U
- Authority
- JP
- Japan
- Prior art keywords
- electrode metal
- metal film
- metal plate
- area
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W72/381—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989106076U JPH0345641U (enExample) | 1989-09-08 | 1989-09-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989106076U JPH0345641U (enExample) | 1989-09-08 | 1989-09-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0345641U true JPH0345641U (enExample) | 1991-04-26 |
Family
ID=31654823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989106076U Pending JPH0345641U (enExample) | 1989-09-08 | 1989-09-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0345641U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100684496B1 (ko) * | 2006-11-22 | 2007-02-22 | 비엠케이 주식회사 | 튜브 어셈블리 분말 충진장치 |
| KR101009098B1 (ko) * | 2008-05-08 | 2011-01-18 | 주식회사 에스디티 | 대용량 정제저장호퍼 리프터 |
| JP2012182253A (ja) * | 2011-02-28 | 2012-09-20 | Sanken Electric Co Ltd | 半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6066847A (ja) * | 1983-09-24 | 1985-04-17 | Nippon Denso Co Ltd | 半導体整流装置 |
-
1989
- 1989-09-08 JP JP1989106076U patent/JPH0345641U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6066847A (ja) * | 1983-09-24 | 1985-04-17 | Nippon Denso Co Ltd | 半導体整流装置 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100684496B1 (ko) * | 2006-11-22 | 2007-02-22 | 비엠케이 주식회사 | 튜브 어셈블리 분말 충진장치 |
| KR101009098B1 (ko) * | 2008-05-08 | 2011-01-18 | 주식회사 에스디티 | 대용량 정제저장호퍼 리프터 |
| JP2012182253A (ja) * | 2011-02-28 | 2012-09-20 | Sanken Electric Co Ltd | 半導体装置 |