JPS61134035U - - Google Patents
Info
- Publication number
- JPS61134035U JPS61134035U JP1985015824U JP1582485U JPS61134035U JP S61134035 U JPS61134035 U JP S61134035U JP 1985015824 U JP1985015824 U JP 1985015824U JP 1582485 U JP1582485 U JP 1582485U JP S61134035 U JPS61134035 U JP S61134035U
- Authority
- JP
- Japan
- Prior art keywords
- diode chip
- nickel plating
- plating layer
- soldered
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/30—
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- H10W72/07551—
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- H10W72/381—
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- H10W72/50—
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- H10W72/5363—
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- H10W72/5434—
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- H10W72/5524—
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- H10W72/59—
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- H10W72/884—
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- H10W72/923—
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- H10W72/934—
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- H10W90/734—
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- H10W90/753—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985015824U JPS61134035U (enExample) | 1985-02-08 | 1985-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985015824U JPS61134035U (enExample) | 1985-02-08 | 1985-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61134035U true JPS61134035U (enExample) | 1986-08-21 |
Family
ID=30502020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985015824U Pending JPS61134035U (enExample) | 1985-02-08 | 1985-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61134035U (enExample) |
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1985
- 1985-02-08 JP JP1985015824U patent/JPS61134035U/ja active Pending