JPH0286132U - - Google Patents
Info
- Publication number
- JPH0286132U JPH0286132U JP1988166403U JP16640388U JPH0286132U JP H0286132 U JPH0286132 U JP H0286132U JP 1988166403 U JP1988166403 U JP 1988166403U JP 16640388 U JP16640388 U JP 16640388U JP H0286132 U JPH0286132 U JP H0286132U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- lead frame
- stand
- semiconductor chip
- collet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0711—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988166403U JPH0286132U (enExample) | 1988-12-22 | 1988-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988166403U JPH0286132U (enExample) | 1988-12-22 | 1988-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0286132U true JPH0286132U (enExample) | 1990-07-09 |
Family
ID=31453751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988166403U Pending JPH0286132U (enExample) | 1988-12-22 | 1988-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0286132U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ITTO20090581A1 (it) * | 2009-07-29 | 2011-01-30 | Osai A S S R L | Metodo e dispositivo di condizionamento in temperatura di un elemento |
-
1988
- 1988-12-22 JP JP1988166403U patent/JPH0286132U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ITTO20090581A1 (it) * | 2009-07-29 | 2011-01-30 | Osai A S S R L | Metodo e dispositivo di condizionamento in temperatura di un elemento |
| WO2011012976A1 (en) * | 2009-07-29 | 2011-02-03 | Osai A.S. S.R.L. | Method and device for temperature conditioning of an element |