JPH0282037U - - Google Patents
Info
- Publication number
- JPH0282037U JPH0282037U JP1988161926U JP16192688U JPH0282037U JP H0282037 U JPH0282037 U JP H0282037U JP 1988161926 U JP1988161926 U JP 1988161926U JP 16192688 U JP16192688 U JP 16192688U JP H0282037 U JPH0282037 U JP H0282037U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- suspender
- device hole
- hole
- carrier tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Description
第１図ａ及びｂは本考案の一実施例を示す平面
図及び縦断面図、第２図ａ〜ｃはこの実施例を使
用する半導体装置の製造方法を説明するための工
程順に示す平面図、第３図及び第４図はそれぞれ
従来のフイルムキヤリアテープの構造を示す平面
図である。
１，１１……樹脂フイルム、２，１２……スプ
ロケツトホール、３，１３……デバイスホール、
４，１４……リード、５，１５……サスペンダ、
１６……切断部、７，１７……電気選別用パツド
、８，１８……半導体チツプ、１９……実装基板
、２０……アウターリード。
1A and 1B are plan views and vertical sectional views showing one embodiment of the present invention, and FIGS. 2A to 2C are plan views showing the order of steps for explaining a method of manufacturing a semiconductor device using this embodiment. , 3 and 4 are plan views showing the structure of a conventional film carrier tape, respectively. 1, 11... Resin film, 2, 12... Sprocket hole, 3, 13... Device hole,
4,14...lead, 5,15...suspenders,
16... Cutting portion, 7, 17... Electrical selection pad, 8, 18... Semiconductor chip, 19... Mounting board, 20... Outer lead.
Claims (1)
フイルムの一こま毎に設けられたデバイスホール
と、前記デバイスホール側へ張り出した枠状のサ
スペンダと、先端側を前記サスペンダに支えられ
た複数のリードとを含むフイルムキヤリアテープ
において、前記サスペンダは枠の少なくとも一箇
所で切断されていることを特徴とするフイルムキ
ヤリアテープ。 A device hole is provided for each frame of a resin film with a sprocket hole provided at the periphery, a frame-shaped suspender protrudes toward the device hole, and a plurality of leads whose tips are supported by the suspender. 1. A film carrier tape comprising a frame, wherein the suspender is cut at at least one point of the frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988161926U JPH0282037U (en) | 1988-12-13 | 1988-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988161926U JPH0282037U (en) | 1988-12-13 | 1988-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282037U true JPH0282037U (en) | 1990-06-25 |
Family
ID=31445291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988161926U Pending JPH0282037U (en) | 1988-12-13 | 1988-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282037U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08330354A (en) * | 1995-06-05 | 1996-12-13 | Nec Corp | Semiconductor device |
-
1988
- 1988-12-13 JP JP1988161926U patent/JPH0282037U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08330354A (en) * | 1995-06-05 | 1996-12-13 | Nec Corp | Semiconductor device |
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