JPH028033U - - Google Patents
Info
- Publication number
- JPH028033U JPH028033U JP8296188U JP8296188U JPH028033U JP H028033 U JPH028033 U JP H028033U JP 8296188 U JP8296188 U JP 8296188U JP 8296188 U JP8296188 U JP 8296188U JP H028033 U JPH028033 U JP H028033U
- Authority
- JP
- Japan
- Prior art keywords
- silver paste
- lead frame
- heat block
- heated
- conveying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988082961U JPH0720915Y2 (ja) | 1988-06-24 | 1988-06-24 | 銀ペーストキュア炉 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988082961U JPH0720915Y2 (ja) | 1988-06-24 | 1988-06-24 | 銀ペーストキュア炉 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH028033U true JPH028033U (cs) | 1990-01-18 |
| JPH0720915Y2 JPH0720915Y2 (ja) | 1995-05-15 |
Family
ID=31307696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988082961U Expired - Lifetime JPH0720915Y2 (ja) | 1988-06-24 | 1988-06-24 | 銀ペーストキュア炉 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0720915Y2 (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0454562U (cs) * | 1990-09-11 | 1992-05-11 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5925233A (ja) * | 1982-08-02 | 1984-02-09 | Hitachi Ltd | ペレツトボンダ |
| JPS59131154U (ja) * | 1983-02-22 | 1984-09-03 | 株式会社東芝 | マウントキユア装置 |
| JPS605125U (ja) * | 1983-05-31 | 1985-01-14 | ロ−ム株式会社 | 半導体装置組み立て用ヒ−タブロツク |
| JPS63144528A (ja) * | 1986-12-09 | 1988-06-16 | Nec Corp | 半導体装置の製造装置 |
-
1988
- 1988-06-24 JP JP1988082961U patent/JPH0720915Y2/ja not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5925233A (ja) * | 1982-08-02 | 1984-02-09 | Hitachi Ltd | ペレツトボンダ |
| JPS59131154U (ja) * | 1983-02-22 | 1984-09-03 | 株式会社東芝 | マウントキユア装置 |
| JPS605125U (ja) * | 1983-05-31 | 1985-01-14 | ロ−ム株式会社 | 半導体装置組み立て用ヒ−タブロツク |
| JPS63144528A (ja) * | 1986-12-09 | 1988-06-16 | Nec Corp | 半導体装置の製造装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0454562U (cs) * | 1990-09-11 | 1992-05-11 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0720915Y2 (ja) | 1995-05-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6418246A (en) | Lead frame for semiconductor device | |
| JPH028033U (cs) | ||
| JPS62140742U (cs) | ||
| JPH0470737U (cs) | ||
| JPH0446544U (cs) | ||
| JP2677335B2 (ja) | キュア装置 | |
| JPH0350U (cs) | ||
| JPS6316448U (cs) | ||
| JPS61155115U (cs) | ||
| JPS62188140U (cs) | ||
| JPS6241549U (cs) | ||
| JPS57192042A (en) | Fixing method for semiconductor element | |
| JPH02132949U (cs) | ||
| JPH0229526U (cs) | ||
| JPH0236053U (cs) | ||
| JPS6469362A (en) | Production of thermal head | |
| JPH01143673U (cs) | ||
| JPS6380092U (cs) | ||
| JPS61182036U (cs) | ||
| JPS6457995A (en) | Soldering device | |
| JPH0498857A (ja) | 半導体装置用パッケージ | |
| JPS6256273U (cs) | ||
| JPH01123356U (cs) | ||
| JPH0273743U (cs) | ||
| JPH0179846U (cs) |