JPH028033U - - Google Patents
Info
- Publication number
- JPH028033U JPH028033U JP8296188U JP8296188U JPH028033U JP H028033 U JPH028033 U JP H028033U JP 8296188 U JP8296188 U JP 8296188U JP 8296188 U JP8296188 U JP 8296188U JP H028033 U JPH028033 U JP H028033U
- Authority
- JP
- Japan
- Prior art keywords
- silver paste
- lead frame
- heat block
- heated
- conveying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000012840 feeding operation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Description
第１図は本考案の一実施例の銀ペーストキユア
炉の斜視図、第２図イ〜ニは本考案のワイヤコン
ベアのタクト送り動作を説明する側面図、第３図
はＩＣ組立工程のフローチヤート、第４図は従来
例の銀ペーストキユア炉の斜視図である。
１……銀ペーストキユア炉、２ａ，２ｂ……ヒ
ートブロツク、３……微小突起、４……ワイヤコ
ンベア、５……トーチ、６……下部カバー、７…
…排気パイプ、８……ＩＣチツプ、９……リード
フレーム。
Fig. 1 is a perspective view of a silver paste curing furnace according to an embodiment of the present invention, Fig. 2 A to D are side views illustrating the tact feeding operation of the wire conveyor of the present invention, and Fig. 3 is a flowchart of the IC assembly process. , FIG. 4 is a perspective view of a conventional silver paste curing furnace. DESCRIPTION OF SYMBOLS 1...Silver paste curing furnace, 2a, 2b...Heat block, 3...Minute protrusion, 4...Wire conveyor, 5...Torch, 6...Lower cover, 7...
...Exhaust pipe, 8...IC chip, 9...Lead frame.
Claims (1)
デイングしたリードフレームを、ヒートブロツク
上を搬送しながら加熱して前記銀ペーストを硬化
させる銀ペーストキユア炉において、 前記ヒートブロツクの上面に前記リードフレー
ムの搬送方向に連続する微小突起と、前記ヒート
ブロツクの上方にトーチ、下方に排気パイプと、
タクト送りの前記リードフレームの搬送手段と、
を設けたことを特徴とする銀ペーストキユア炉。[Scope of Claim for Utility Model Registration] In a silver paste curing furnace in which a lead frame in which a semiconductor integrated circuit chip is die-bonded with silver paste is heated while being conveyed over a heat block to harden the silver paste, the top surface of the heat block is heated. a minute protrusion continuous in the conveying direction of the lead frame; a torch above the heat block; and an exhaust pipe below;
A means for conveying the lead frame by tact feeding;
A silver paste cure furnace characterized by being provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988082961U JPH0720915Y2 (en) | 1988-06-24 | 1988-06-24 | Silver paste cure furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988082961U JPH0720915Y2 (en) | 1988-06-24 | 1988-06-24 | Silver paste cure furnace |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH028033U true JPH028033U (en) | 1990-01-18 |
| JPH0720915Y2 JPH0720915Y2 (en) | 1995-05-15 |
Family
ID=31307696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988082961U Expired - Lifetime JPH0720915Y2 (en) | 1988-06-24 | 1988-06-24 | Silver paste cure furnace |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0720915Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0454562U (en) * | 1990-09-11 | 1992-05-11 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5925233A (en) * | 1982-08-02 | 1984-02-09 | Hitachi Ltd | Bonder for pellet |
| JPS59131154U (en) * | 1983-02-22 | 1984-09-03 | 株式会社東芝 | mount cure device |
| JPS605125U (en) * | 1983-05-31 | 1985-01-14 | ロ−ム株式会社 | Heater block for semiconductor device assembly |
| JPS63144528A (en) * | 1986-12-09 | 1988-06-16 | Nec Corp | Device for manufacture of semiconductor device |
-
1988
- 1988-06-24 JP JP1988082961U patent/JPH0720915Y2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5925233A (en) * | 1982-08-02 | 1984-02-09 | Hitachi Ltd | Bonder for pellet |
| JPS59131154U (en) * | 1983-02-22 | 1984-09-03 | 株式会社東芝 | mount cure device |
| JPS605125U (en) * | 1983-05-31 | 1985-01-14 | ロ−ム株式会社 | Heater block for semiconductor device assembly |
| JPS63144528A (en) * | 1986-12-09 | 1988-06-16 | Nec Corp | Device for manufacture of semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0454562U (en) * | 1990-09-11 | 1992-05-11 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0720915Y2 (en) | 1995-05-15 |
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