JPH0279384A - 電子素子用パッケージの半田付け方法 - Google Patents

電子素子用パッケージの半田付け方法

Info

Publication number
JPH0279384A
JPH0279384A JP23061188A JP23061188A JPH0279384A JP H0279384 A JPH0279384 A JP H0279384A JP 23061188 A JP23061188 A JP 23061188A JP 23061188 A JP23061188 A JP 23061188A JP H0279384 A JPH0279384 A JP H0279384A
Authority
JP
Japan
Prior art keywords
solder
printed circuit
terminal pin
circuit board
electrical connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23061188A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0514391B2 (enrdf_load_stackoverflow
Inventor
Tsukuo Wada
津久生 和田
Toru Higuchi
徹 樋口
Toshiyuki Yamaguchi
敏行 山口
Takeshi Kano
武司 加納
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP23061188A priority Critical patent/JPH0279384A/ja
Publication of JPH0279384A publication Critical patent/JPH0279384A/ja
Publication of JPH0514391B2 publication Critical patent/JPH0514391B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
JP23061188A 1988-09-14 1988-09-14 電子素子用パッケージの半田付け方法 Granted JPH0279384A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23061188A JPH0279384A (ja) 1988-09-14 1988-09-14 電子素子用パッケージの半田付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23061188A JPH0279384A (ja) 1988-09-14 1988-09-14 電子素子用パッケージの半田付け方法

Publications (2)

Publication Number Publication Date
JPH0279384A true JPH0279384A (ja) 1990-03-19
JPH0514391B2 JPH0514391B2 (enrdf_load_stackoverflow) 1993-02-24

Family

ID=16910476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23061188A Granted JPH0279384A (ja) 1988-09-14 1988-09-14 電子素子用パッケージの半田付け方法

Country Status (1)

Country Link
JP (1) JPH0279384A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002344230A (ja) * 2001-05-11 2002-11-29 Furukawa Electric Co Ltd:The 小型アンテナ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056472A (ja) * 1983-09-09 1985-04-02 Mitsubishi Heavy Ind Ltd メタルコンセントのハンダ付け方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056472A (ja) * 1983-09-09 1985-04-02 Mitsubishi Heavy Ind Ltd メタルコンセントのハンダ付け方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002344230A (ja) * 2001-05-11 2002-11-29 Furukawa Electric Co Ltd:The 小型アンテナ

Also Published As

Publication number Publication date
JPH0514391B2 (enrdf_load_stackoverflow) 1993-02-24

Similar Documents

Publication Publication Date Title
US6028358A (en) Package for a semiconductor device and a semiconductor device
US6358630B1 (en) Soldering member for printed wiring boards
US6943100B2 (en) Method of fabricating a wiring board utilizing a conductive member having a reduced thickness
JP3294740B2 (ja) 半導体装置
US3541225A (en) Electrical conductor with improved solder characteristics
US6465082B1 (en) Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body
KR100226335B1 (ko) 플라스틱 성형회로 패키지
KR101951732B1 (ko) 측면 접촉이 가능한 기판 표면 실장용 도전성 접촉단자 및 그 제조방법
JPH0279384A (ja) 電子素子用パッケージの半田付け方法
JP2926902B2 (ja) プリント配線基板
JPH1074859A (ja) Ｑｆｎ半導体パッケージ
WO2018052081A1 (ja) 高周波モジュール
JP3027269U (ja) 電子部品用パッケージ
JPH02135764A (ja) 電子部品搭載用基板
JP2652222B2 (ja) 電子部品搭載用基板
EP0335420A2 (en) Electrical and mechanical joint construction between a printed wiring board and a lead pin
JPS6153852B2 (enrdf_load_stackoverflow)
JP2000200848A (ja) 電子部品実装用回路基板及び半導体装置
JP2580607B2 (ja) 回路基板及び回路基板の製造方法
KR20250115068A (ko) 인쇄회로기판, 이를 포함하는 소켓 및 그 제조방법
KR200147513Y1 (ko) 표면 실장형 반도체 패키지
EP0620594A2 (en) Semiconductor device having mounting terminals
JPH03262186A (ja) 印刷配線基板
JPH0427131A (ja) 電子部品搭載用基板
JP2003224356A (ja) 端面カットスルーホールを有するプリント配線板及び電子部品