JPH0276077U - - Google Patents
Info
- Publication number
- JPH0276077U JPH0276077U JP15485288U JP15485288U JPH0276077U JP H0276077 U JPH0276077 U JP H0276077U JP 15485288 U JP15485288 U JP 15485288U JP 15485288 U JP15485288 U JP 15485288U JP H0276077 U JPH0276077 U JP H0276077U
- Authority
- JP
- Japan
- Prior art keywords
- double
- conductor layer
- module
- portable medium
- external terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Description
第１図ないし第３図はこの考案に係る携帯可能
媒体の実施例を示すもので、第１図はＩＣカード
モジユール部分の平面図、第２図は第１図のＡ―
Ａ線断面図、第３図は同上ＩＣカードモジユール
の製造方法を説明するための図、第４図は従来の
ＩＣカードにおけるＩＣカードモジユールを示す
平面図、第５図は第４図のＢ―Ｂ線断面図、第６
図は外部端子のＩＳＯ規格を説明するための図で
ある。
１：両面基板、２：外部端子、３：導体層、４
：スルーホール、５：ＩＣチツプ（電子部品）、
１０：ＩＣカードモジユール、Ｃ１〜Ｃ６：最小
規定寸法の外部端子。
1 to 3 show an embodiment of the portable medium according to this invention. FIG. 1 is a plan view of the IC card module portion, and FIG.
3 is a diagram for explaining the manufacturing method of the same IC card module as above, FIG. 4 is a plan view showing the IC card module in a conventional IC card, and FIG. 5 is the same as that of FIG. BB line sectional view, 6th
The figure is a diagram for explaining the ISO standard for external terminals. 1: Double-sided board, 2: External terminal, 3: Conductor layer, 4
:Through hole, 5:IC chip (electronic component),
10: IC card module, C1 to C6 : External terminals with minimum specified dimensions.
Claims (1)
層との間をスルーホールで接続した両面基板にお
ける当該導体層側に所要の電子部品を実装してモ
ジユールを構成し、該モジユールを前記外部端子
が表出するようにカード基体に組込んでなる携帯
可能媒体において、 前記スルーホールは前記両面基板の端面位置で
且つ前記外部端子の規定寸法外の位置に形成して
なることを特徴とする携帯可能媒体。[Scope of claim for utility model registration] A module is constructed by mounting necessary electronic components on the conductor layer side of a double-sided board in which external terminals formed on one side and a conductor layer formed on the other side are connected by through holes. In a portable medium in which the module is assembled into a card base so that the external terminal is exposed, the through hole is formed at an end surface position of the double-sided board and at a position outside the specified dimension of the external terminal. A portable medium characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15485288U JPH0276077U (en) | 1988-11-30 | 1988-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15485288U JPH0276077U (en) | 1988-11-30 | 1988-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0276077U true JPH0276077U (en) | 1990-06-11 |
Family
ID=31431957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15485288U Pending JPH0276077U (en) | 1988-11-30 | 1988-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0276077U (en) |
-
1988
- 1988-11-30 JP JP15485288U patent/JPH0276077U/ja active Pending
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