JPH027466Y2 - - Google Patents

Info

Publication number
JPH027466Y2
JPH027466Y2 JP1983022605U JP2260583U JPH027466Y2 JP H027466 Y2 JPH027466 Y2 JP H027466Y2 JP 1983022605 U JP1983022605 U JP 1983022605U JP 2260583 U JP2260583 U JP 2260583U JP H027466 Y2 JPH027466 Y2 JP H027466Y2
Authority
JP
Japan
Prior art keywords
adhesive
semiconductor chip
mounting table
application
chip mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983022605U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59128735U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2260583U priority Critical patent/JPS59128735U/ja
Publication of JPS59128735U publication Critical patent/JPS59128735U/ja
Application granted granted Critical
Publication of JPH027466Y2 publication Critical patent/JPH027466Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP2260583U 1983-02-17 1983-02-17 半導体チツプの接着装置 Granted JPS59128735U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2260583U JPS59128735U (ja) 1983-02-17 1983-02-17 半導体チツプの接着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2260583U JPS59128735U (ja) 1983-02-17 1983-02-17 半導体チツプの接着装置

Publications (2)

Publication Number Publication Date
JPS59128735U JPS59128735U (ja) 1984-08-30
JPH027466Y2 true JPH027466Y2 (enrdf_load_stackoverflow) 1990-02-22

Family

ID=30153698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2260583U Granted JPS59128735U (ja) 1983-02-17 1983-02-17 半導体チツプの接着装置

Country Status (1)

Country Link
JP (1) JPS59128735U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220016669A1 (en) * 2016-07-08 2022-01-20 Macdonald, Dettwiler And Associates Inc. System and Method for Automated Artificial Vision Guided Dispensing Viscous Fluids for Caulking and Sealing Operations

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01135561A (ja) * 1987-08-27 1989-05-29 Fuji Kikai Seizo Kk 接着剤塗布装置
JP2535474B2 (ja) * 1987-08-27 1996-09-18 富士機械製造株式会社 試し打ち機能を備えた高粘性流体塗布装置
JP2535473B2 (ja) * 1987-08-27 1996-09-18 富士機械製造株式会社 プリント基板用高粘性流体塗布装置
JP2539015B2 (ja) * 1988-11-18 1996-10-02 株式会社日立製作所 ペレットボンディング方法およびその装置
JP2741505B2 (ja) * 1996-10-25 1998-04-22 東芝メカトロニクス株式会社 ペレットボンディング用ペースト塗布装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164545A (en) * 1980-05-21 1981-12-17 Hitachi Ltd Pellet bonding inspection and device therefor
JPS5732587U (enrdf_load_stackoverflow) * 1980-08-01 1982-02-20
JPS5839019A (ja) * 1981-08-31 1983-03-07 Toshiba Corp 半導体ダイボンデイング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220016669A1 (en) * 2016-07-08 2022-01-20 Macdonald, Dettwiler And Associates Inc. System and Method for Automated Artificial Vision Guided Dispensing Viscous Fluids for Caulking and Sealing Operations
US11969751B2 (en) * 2016-07-08 2024-04-30 Macdonald, Dettwiler And Associates Inc. System and method for automated artificial vision guided dispensing viscous fluids for caulking and sealing operations

Also Published As

Publication number Publication date
JPS59128735U (ja) 1984-08-30

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