JPH0273746U - - Google Patents
Info
- Publication number
- JPH0273746U JPH0273746U JP15370188U JP15370188U JPH0273746U JP H0273746 U JPH0273746 U JP H0273746U JP 15370188 U JP15370188 U JP 15370188U JP 15370188 U JP15370188 U JP 15370188U JP H0273746 U JPH0273746 U JP H0273746U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- conductive material
- circuit chips
- semiconductor device
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図は本考案の第１の実施例を示す断面図で
ある。第２図は本考案の第２の実施例を示す断面
図である。
FIG. 1 is a sectional view showing a first embodiment of the present invention. FIG. 2 is a sectional view showing a second embodiment of the present invention.
Claims (1)
数個置き、相互を導電性物質で接続し、又、同一
基板の裏側に他の機能を持つ半導体集積回路のチ
ツプを複数個置き、導電性物質で接続し、一つの
ケースに収める構造をした事を特徴とする半導体
装置。 A plurality of semiconductor integrated circuit chips are placed on one substrate and connected to each other with a conductive material, and a plurality of semiconductor integrated circuit chips with other functions are placed on the back side of the same substrate and connected with a conductive material. A semiconductor device characterized by a structure in which the semiconductor device is connected to each other and housed in a single case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15370188U JPH0273746U (en) | 1988-11-25 | 1988-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15370188U JPH0273746U (en) | 1988-11-25 | 1988-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0273746U true JPH0273746U (en) | 1990-06-05 |
Family
ID=31429778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15370188U Pending JPH0273746U (en) | 1988-11-25 | 1988-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0273746U (en) |
-
1988
- 1988-11-25 JP JP15370188U patent/JPH0273746U/ja active Pending