JPH02101623U - - Google Patents
Info
- Publication number
- JPH02101623U JPH02101623U JP1090389U JP1090389U JPH02101623U JP H02101623 U JPH02101623 U JP H02101623U JP 1090389 U JP1090389 U JP 1090389U JP 1090389 U JP1090389 U JP 1090389U JP H02101623 U JPH02101623 U JP H02101623U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- substrate
- resin layer
- utility
- solid state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 1
Landscapes
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
第１図〜第２図は本考案に係る固体素子の実施
例を示し、第１図は上面図、第２図は側面図、第
３図〜第５図は従来の固体素子を示す図で、第１
図は上面図、第２図は側面図、第３図は固体素子
を複数箇設けたウエハーの概略上面図である。
１，１１……基板、２，１２……入力電極、３
，１３……出力電極、１５……樹脂層、６，７，
１６，１７……プロービングニードル。
1 to 2 show an embodiment of the solid-state device according to the present invention, FIG. 1 is a top view, FIG. 2 is a side view, and FIGS. 3 to 5 are views showing conventional solid-state devices. , 1st
The figure is a top view, FIG. 2 is a side view, and FIG. 3 is a schematic top view of a wafer provided with a plurality of solid-state devices. 1, 11...Substrate, 2, 12...Input electrode, 3
, 13... Output electrode, 15... Resin layer, 6, 7,
16, 17...probing needle.
Claims (1)
る固定素子において、該電極上に樹脂層が形成さ
れてなる構成の固体素子。 A fixed element having a probing electrode formed on a substrate, and a solid state element having a structure in which a resin layer is formed on the electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1090389U JPH02101623U (en) | 1989-01-31 | 1989-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1090389U JPH02101623U (en) | 1989-01-31 | 1989-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02101623U true JPH02101623U (en) | 1990-08-13 |
Family
ID=31218977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1090389U Pending JPH02101623U (en) | 1989-01-31 | 1989-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02101623U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS593943A (en) * | 1982-06-29 | 1984-01-10 | Fujitsu Ltd | Manufacture of semiconductor device |
| JPS63198346A (en) * | 1987-02-13 | 1988-08-17 | Matsushita Electronics Corp | Semiconductor integrated circuit |
-
1989
- 1989-01-31 JP JP1090389U patent/JPH02101623U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS593943A (en) * | 1982-06-29 | 1984-01-10 | Fujitsu Ltd | Manufacture of semiconductor device |
| JPS63198346A (en) * | 1987-02-13 | 1988-08-17 | Matsushita Electronics Corp | Semiconductor integrated circuit |