JPH0273083U - - Google Patents
Info
- Publication number
- JPH0273083U JPH0273083U JP15255388U JP15255388U JPH0273083U JP H0273083 U JPH0273083 U JP H0273083U JP 15255388 U JP15255388 U JP 15255388U JP 15255388 U JP15255388 U JP 15255388U JP H0273083 U JPH0273083 U JP H0273083U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- plating layer
- receiver
- holes
- insulating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims 6
- 239000011810 insulating material Substances 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000005553 drilling Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
Description
第１図は第一実施例における受体の断面図、第
２図は挿入体の側面図、第３図は組立状態の断面
図、第４図は使用状態の斜視図、第５図は第２実
施例の斜視図、第６図は同上の使用状態の斜視図
、第７図は従来のコネクタの平面図である。
１……受体、１ａ……穴、１ｂ……メツキ層、
１ｃ，１ｄ……電極、１ｅ……折れ線部分、２…
…挿入体、２ａ……隙間、２ｂ……切り込み、２
ｃ……円錐形部、２ｄ……開口、２ｅ……円筒部
、３……プリント基板、３ａ……ランド、４……
リード線、５……チツプ部品、６……ＩＣ。
Fig. 1 is a sectional view of the receiver in the first embodiment, Fig. 2 is a side view of the insert, Fig. 3 is a sectional view of the assembled state, Fig. 4 is a perspective view of the in-use state, and Fig. 5 is a side view of the insert. FIG. 6 is a perspective view of the second embodiment, FIG. 6 is a perspective view of the same in use, and FIG. 7 is a plan view of the conventional connector. 1... Receptor, 1a... Hole, 1b... Metsuki layer,
1c, 1d... Electrode, 1e... Broken line portion, 2...
...insert body, 2a...gap, 2b...notch, 2
c... Conical part, 2d... Opening, 2e... Cylindrical part, 3... Printed circuit board, 3a... Land, 4...
Lead wire, 5... Chip parts, 6... IC.
Claims (1)
を穿設し、かつ、この穴の内面にメツキ層を形成
すると共に、このメツキ層と電気的に導通するメ
ツキ層を表面にも形成して電極となした受体と、
該受体の前記穴内に嵌合される大きさの円筒形の
導電材を一端に向かつて円錐形に絞り込まれると
共に、複数の軸心方向の切り込みが形成された挿
入体とを具備したことを特徴とする表面実装用コ
ネクタ。 (2) 前記受体の絶縁材を直方体に形成すると共
に、内面にメツキ層が形成された穴を複数個形成
し、かつ、夫々の穴のメツキ層と電気的に導通す
る帯状のメツキを表面にも形成し、さらに、前記
各穴内に前記挿入体を嵌合したことを特徴とする
請求項１記載の表面実装用コネクタ。[Claims for Utility Model Registration] (1) Drilling a hole in an insulating material such as ceramics having a rectangular cross section, forming a plating layer on the inner surface of the hole, and electrically conducting with the plating layer. A receptor with a plating layer also formed on the surface and used as an electrode,
The insert includes a cylindrical conductive material having a size to fit into the hole of the receiver, which is narrowed into a conical shape toward one end, and has a plurality of axial notches formed therein. Features of surface mount connector. (2) Form the insulating material of the receiver into a rectangular parallelepiped, form a plurality of holes with a plating layer formed on the inner surface, and add a strip-shaped plating on the surface that is electrically conductive to the plating layer of each hole. 2. The surface mount connector according to claim 1, further comprising: a hole formed therein, and said insert body being fitted into each of said holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988152553U JPH0542632Y2 (en) | 1988-11-25 | 1988-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988152553U JPH0542632Y2 (en) | 1988-11-25 | 1988-11-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0273083U true JPH0273083U (en) | 1990-06-04 |
| JPH0542632Y2 JPH0542632Y2 (en) | 1993-10-27 |
Family
ID=31427585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988152553U Expired - Lifetime JPH0542632Y2 (en) | 1988-11-25 | 1988-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0542632Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009031211A1 (en) * | 2007-09-05 | 2009-03-12 | Bosch Corporation | High mounting density circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61112587U (en) * | 1984-12-25 | 1986-07-16 | ||
| JPS6296284U (en) * | 1985-12-09 | 1987-06-19 |
-
1988
- 1988-11-25 JP JP1988152553U patent/JPH0542632Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61112587U (en) * | 1984-12-25 | 1986-07-16 | ||
| JPS6296284U (en) * | 1985-12-09 | 1987-06-19 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009031211A1 (en) * | 2007-09-05 | 2009-03-12 | Bosch Corporation | High mounting density circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0542632Y2 (en) | 1993-10-27 |