WO2009031211A1 - High mounting density circuit board - Google Patents

High mounting density circuit board Download PDF

Info

Publication number
WO2009031211A1
WO2009031211A1 PCT/JP2007/067321 JP2007067321W WO2009031211A1 WO 2009031211 A1 WO2009031211 A1 WO 2009031211A1 JP 2007067321 W JP2007067321 W JP 2007067321W WO 2009031211 A1 WO2009031211 A1 WO 2009031211A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead
metal tool
circuit board
mounting density
holding metal
Prior art date
Application number
PCT/JP2007/067321
Other languages
French (fr)
Japanese (ja)
Inventor
Takashi Matsuoka
Original Assignee
Bosch Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Corporation filed Critical Bosch Corporation
Priority to PCT/JP2007/067321 priority Critical patent/WO2009031211A1/en
Publication of WO2009031211A1 publication Critical patent/WO2009031211A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10333—Individual female type metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Provided is a circuit board which can be manufactured easily, the cost of which is low, and which can certainly secure high component mounting density. In a high mounting density circuit board (S1), lead components (12a-12d) are mounted via a component boot (2) on a printed wiring board (1). The component boot (2) has a lead holding metal tool (3) in which lead lines (13a, 13b, 14a, 14b, 15a, 15b, 16a, 16b, 17a, 17b) of the lead components (12a-12d) can be inserted and a conductive member is used and a support body (4) in which the lead holding metal tool (3) can be housed and an insulating member is used. The lead holding metal tool (3) is housed in the support body (4) in such a manner that a part of the metal tool is exposed to a component mounting surface side of the print board (1). The lead holding metal tool (3) can be reflow soldered.
PCT/JP2007/067321 2007-09-05 2007-09-05 High mounting density circuit board WO2009031211A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/067321 WO2009031211A1 (en) 2007-09-05 2007-09-05 High mounting density circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/067321 WO2009031211A1 (en) 2007-09-05 2007-09-05 High mounting density circuit board

Publications (1)

Publication Number Publication Date
WO2009031211A1 true WO2009031211A1 (en) 2009-03-12

Family

ID=40428534

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/067321 WO2009031211A1 (en) 2007-09-05 2007-09-05 High mounting density circuit board

Country Status (1)

Country Link
WO (1) WO2009031211A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60127786A (en) * 1983-12-14 1985-07-08 富士ゼロックス株式会社 Mounting system of circuit part
JPH0273083U (en) * 1988-11-25 1990-06-04
JPH1032375A (en) * 1996-07-16 1998-02-03 Fuji Photo Film Co Ltd Socket for component with lead
JPH1064637A (en) * 1996-08-14 1998-03-06 Saitama Nippon Denki Kk Surface mount connector

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60127786A (en) * 1983-12-14 1985-07-08 富士ゼロックス株式会社 Mounting system of circuit part
JPH0273083U (en) * 1988-11-25 1990-06-04
JPH1032375A (en) * 1996-07-16 1998-02-03 Fuji Photo Film Co Ltd Socket for component with lead
JPH1064637A (en) * 1996-08-14 1998-03-06 Saitama Nippon Denki Kk Surface mount connector

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