JPH027167B2 - - Google Patents
Info
- Publication number
- JPH027167B2 JPH027167B2 JP57144513A JP14451382A JPH027167B2 JP H027167 B2 JPH027167 B2 JP H027167B2 JP 57144513 A JP57144513 A JP 57144513A JP 14451382 A JP14451382 A JP 14451382A JP H027167 B2 JPH027167 B2 JP H027167B2
- Authority
- JP
- Japan
- Prior art keywords
- paste
- plating
- ceramic substrate
- electroless plating
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Ceramic Capacitors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57144513A JPS5933818A (ja) | 1982-08-19 | 1982-08-19 | セラミツク電子部品の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57144513A JPS5933818A (ja) | 1982-08-19 | 1982-08-19 | セラミツク電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5933818A JPS5933818A (ja) | 1984-02-23 |
JPH027167B2 true JPH027167B2 (en, 2012) | 1990-02-15 |
Family
ID=15364096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57144513A Granted JPS5933818A (ja) | 1982-08-19 | 1982-08-19 | セラミツク電子部品の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5933818A (en, 2012) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56125825A (en) * | 1980-03-07 | 1981-10-02 | Matsushita Electric Ind Co Ltd | Method of producing ceramic electronic part |
JPS5732507A (en) * | 1980-08-06 | 1982-02-22 | Tdk Electronics Co Ltd | Method of forming electrode for electronic part |
-
1982
- 1982-08-19 JP JP57144513A patent/JPS5933818A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5933818A (ja) | 1984-02-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR900003152B1 (ko) | 기판상의 전기회로 형성방법 | |
JPS5926662B2 (ja) | 無電解メッキ活性金属材料ペ−ストおよびそれを用いたメッキ方法 | |
JP2618019B2 (ja) | メッキ下地用導電性塗料およびそれを用いるメッキ方法 | |
JPH027167B2 (en, 2012) | ||
JPH0136243B2 (en, 2012) | ||
JPS634327B2 (en, 2012) | ||
JPS634332B2 (en, 2012) | ||
JPS634338B2 (en, 2012) | ||
JPH0237117B2 (ja) | Kibannidodenkairookeiseisuruhoho | |
JPS5926661B2 (ja) | 無電解メッキ活性金属材料ペ−ストおよびそれを用いたメッキ方法 | |
JPS5948950B2 (ja) | 無電解メッキ下地活性金属材料ペ−ストおよびそれによるメッキ方法 | |
JPS629204B2 (en, 2012) | ||
JPS62136501A (ja) | セラミツク用メタライズ粉およびこれを用いたセラミツク用メタライズペ−スト | |
JPS634329B2 (en, 2012) | ||
JPH0227832B2 (ja) | Seramitsukusukiban | |
JPS631730B2 (en, 2012) | ||
JPS634331B2 (en, 2012) | ||
JPS631729B2 (en, 2012) | ||
JPS582017A (ja) | 高電圧用セラミックコンデンサの製造方法 | |
JPS6225748B2 (en, 2012) | ||
JPS631726B2 (en, 2012) | ||
JPH05129105A (ja) | チツプ・バリスタ | |
JPH03215916A (ja) | 電極の形成方法およびそれを用いた電子部品 | |
JPS646530B2 (en, 2012) | ||
JPH02178910A (ja) | 積層型セラミックチップコンデンサーの製造方法 |