JPH0268445U - - Google Patents
Info
- Publication number
- JPH0268445U JPH0268445U JP1988148646U JP14864688U JPH0268445U JP H0268445 U JPH0268445 U JP H0268445U JP 1988148646 U JP1988148646 U JP 1988148646U JP 14864688 U JP14864688 U JP 14864688U JP H0268445 U JPH0268445 U JP H0268445U
- Authority
- JP
- Japan
- Prior art keywords
- container
- semiconductor element
- stepped part
- plating layer
- recessed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988148646U JPH0268445U (enExample) | 1988-11-14 | 1988-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988148646U JPH0268445U (enExample) | 1988-11-14 | 1988-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0268445U true JPH0268445U (enExample) | 1990-05-24 |
Family
ID=31420154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988148646U Pending JPH0268445U (enExample) | 1988-11-14 | 1988-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0268445U (enExample) |
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1988
- 1988-11-14 JP JP1988148646U patent/JPH0268445U/ja active Pending