JPS6282745U - - Google Patents
Info
- Publication number
- JPS6282745U JPS6282745U JP1985173351U JP17335185U JPS6282745U JP S6282745 U JPS6282745 U JP S6282745U JP 1985173351 U JP1985173351 U JP 1985173351U JP 17335185 U JP17335185 U JP 17335185U JP S6282745 U JPS6282745 U JP S6282745U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor element
- recess
- die attach
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/073—
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- H10W72/075—
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- H10W72/884—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985173351U JPS6282745U (enExample) | 1985-11-11 | 1985-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985173351U JPS6282745U (enExample) | 1985-11-11 | 1985-11-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6282745U true JPS6282745U (enExample) | 1987-05-27 |
Family
ID=31110731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985173351U Pending JPS6282745U (enExample) | 1985-11-11 | 1985-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6282745U (enExample) |
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1985
- 1985-11-11 JP JP1985173351U patent/JPS6282745U/ja active Pending