JPH0265475U - - Google Patents
Info
- Publication number
- JPH0265475U JPH0265475U JP1988144067U JP14406788U JPH0265475U JP H0265475 U JPH0265475 U JP H0265475U JP 1988144067 U JP1988144067 U JP 1988144067U JP 14406788 U JP14406788 U JP 14406788U JP H0265475 U JPH0265475 U JP H0265475U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- terminal
- main body
- body portion
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａ，ｂは本考案の一実施例を示す上面図
および正面図である。
１……プリント基板、２……フラツトパツケー
ジＩＣ、３……遮光マスク、３ａ……金属板、３
ｂ……金属片。
FIGS. 1a and 1b are a top view and a front view showing an embodiment of the present invention. 1... Printed circuit board, 2... Flat package IC, 3... Light shielding mask, 3a... Metal plate, 3
b...Metal piece.
Claims (1)
けされる部品の前記本体部分を覆う大きさの金属
板と、この金属板と一体に作られ前記端子のうち
の所定の端子を覆う少くとも１個の金属片とを有
するレーザ半田付け用遮光マスク。 a metal plate consisting of a main body portion and a terminal and having a size to cover the main body portion of the component to which the terminal is soldered; and at least one metal plate made integrally with the metal plate and covering a predetermined terminal of the terminals. A light-shielding mask for laser soldering, which includes metal pieces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988144067U JPH0265475U (en) | 1988-11-02 | 1988-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988144067U JPH0265475U (en) | 1988-11-02 | 1988-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0265475U true JPH0265475U (en) | 1990-05-17 |
Family
ID=31411447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988144067U Pending JPH0265475U (en) | 1988-11-02 | 1988-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0265475U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0425270U (en) * | 1990-06-21 | 1992-02-28 | ||
| JP2015056442A (en) * | 2013-09-10 | 2015-03-23 | 株式会社ジャパンユニックス | Laser scanning reflow soldering method and device |
-
1988
- 1988-11-02 JP JP1988144067U patent/JPH0265475U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0425270U (en) * | 1990-06-21 | 1992-02-28 | ||
| JP2015056442A (en) * | 2013-09-10 | 2015-03-23 | 株式会社ジャパンユニックス | Laser scanning reflow soldering method and device |