JPH0312444U - - Google Patents
Info
- Publication number
- JPH0312444U JPH0312444U JP1989073845U JP7384589U JPH0312444U JP H0312444 U JPH0312444 U JP H0312444U JP 1989073845 U JP1989073845 U JP 1989073845U JP 7384589 U JP7384589 U JP 7384589U JP H0312444 U JPH0312444 U JP H0312444U
- Authority
- JP
- Japan
- Prior art keywords
- pin terminal
- housing
- pin
- electronic component
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図ないし第３図は本考案の一実施例を示し
、第１図はキヤンパツケージの斜視図、第２図は
外装体でモールドした状態の斜視図、第３図はプ
リント基板への実装時の断面図である。第４図は
従来の電子部品を裏から見た斜視図、第５図はそ
の電子部品をプリント基板へ実装したときの正面
図である。
１……絶縁性外装体、５……電磁シールド板、
１０……キヤンパツケージ、１１……ベース、１
３ａ〜１３ｄ……ピン端子、１３ａ′〜１３ｄ′
……折り曲げ部分、１５……チツプ、２０……プ
リント基板。
Figures 1 to 3 show an embodiment of the present invention, with Figure 1 being a perspective view of the package, Figure 2 being a perspective view of the package molded with an exterior body, and Figure 3 being mounted on a printed circuit board. FIG. FIG. 4 is a perspective view of a conventional electronic component seen from the back, and FIG. 5 is a front view of the electronic component mounted on a printed circuit board. 1... Insulating exterior body, 5... Electromagnetic shielding plate,
10...Campaign package, 11...Base, 1
3a to 13d...Pin terminals, 13a' to 13d'
...Bending portion, 15...Chip, 20...Printed circuit board.
Claims (1)
ン端子をキヤンパツケージのベースから突出させ
た電子部品において、 前記ピン端子をキヤンパツケージの側面に所定
の間隔を保持して沿わせると共に下部で外方に折
り曲げ、入力側ピン端子と出力側ピン端子との間
に電磁シールド板をキヤンパツケージの表面に沿
つて設ける一方、前記ピン端子と電磁シールド板
をキヤンパツケージの表面に設けた絶縁性外装体
にて少なくともピン端子の外方への折り曲げ部分
を残して埋設したこと、 を特徴とする表面実装用電子部品。[Claims for Utility Model Registration] An electronic component that houses an electronic element and has pin terminals connected to the electronic element protruding from the base of a housing package, the pin terminals being held at a predetermined distance from the side surface of the housing housing. An electromagnetic shield plate is provided along the surface of the can package cage between the input side pin terminal and the output side pin terminal, while the pin terminal and the electromagnetic shield plate are 1. A surface-mounted electronic component, characterized in that a pin terminal is buried in an insulating sheath provided on the surface, leaving at least an outwardly bent portion of the pin terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989073845U JPH0312444U (en) | 1989-06-22 | 1989-06-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989073845U JPH0312444U (en) | 1989-06-22 | 1989-06-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0312444U true JPH0312444U (en) | 1991-02-07 |
Family
ID=31613014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989073845U Pending JPH0312444U (en) | 1989-06-22 | 1989-06-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0312444U (en) |
-
1989
- 1989-06-22 JP JP1989073845U patent/JPH0312444U/ja active Pending
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