JPH0262784U - - Google Patents

Info

Publication number
JPH0262784U
JPH0262784U JP14101888U JP14101888U JPH0262784U JP H0262784 U JPH0262784 U JP H0262784U JP 14101888 U JP14101888 U JP 14101888U JP 14101888 U JP14101888 U JP 14101888U JP H0262784 U JPH0262784 U JP H0262784U
Authority
JP
Japan
Prior art keywords
hole
board
case
electronic components
modular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14101888U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14101888U priority Critical patent/JPH0262784U/ja
Publication of JPH0262784U publication Critical patent/JPH0262784U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Casings For Electric Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例に係るモジユール部
品用パツケージを組立てた状態を示す側面断面図
、第2図は本考案の要部である孔をすり鉢状にし
た状態を示す拡大断面図、第3図は同じく孔のケ
ース内部にリブを設けた状態を示す拡大断面図、
第4図は従来のモジユール部品用パツケージを組
立てた状態を示す側面断面図である。 1:基板、2:電子部品、3:金属ケース、4
:孔、5:半田。
FIG. 1 is a side cross-sectional view showing an assembled state of a modular component package according to an embodiment of the present invention, and FIG. 2 is an enlarged cross-sectional view showing a state in which the hole, which is the main part of the present invention, is shaped like a mortar. Figure 3 is an enlarged sectional view showing the state in which ribs are provided inside the case of the hole.
FIG. 4 is a side sectional view showing an assembled state of a conventional package for modular parts. 1: Board, 2: Electronic components, 3: Metal case, 4
: hole, 5: solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品を搭載する基板と、この基板の電子部
品を搭載した面を覆うケースからなるモジユール
部品用パツケージにおいて、前記ケースの任意の
箇所に孔を設け、所定の作業後前記孔を閉塞して
構成したことを特徴としたモジユール部品用パツ
ケージ。
In a modular component package consisting of a board on which electronic components are mounted and a case that covers the surface of this board on which the electronic components are mounted, a hole is provided at an arbitrary location in the case, and the hole is closed after a predetermined operation. A package cage for modular parts that is characterized by:
JP14101888U 1988-10-31 1988-10-31 Pending JPH0262784U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14101888U JPH0262784U (en) 1988-10-31 1988-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14101888U JPH0262784U (en) 1988-10-31 1988-10-31

Publications (1)

Publication Number Publication Date
JPH0262784U true JPH0262784U (en) 1990-05-10

Family

ID=31405712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14101888U Pending JPH0262784U (en) 1988-10-31 1988-10-31

Country Status (1)

Country Link
JP (1) JPH0262784U (en)

Similar Documents

Publication Publication Date Title
JPH0262784U (en)
JPH0236073U (en)
JPH0263590U (en)
JPH0454153U (en)
JPH02113361U (en)
JPH01171063U (en)
JPS6179568U (en)
JPH0298676U (en)
JPS6326114U (en)
JPS63137954U (en)
JPH02146867U (en)
JPH0390496U (en)
JPH0415267U (en)
JPH0373492U (en)
JPH01107145U (en)
JPH034065U (en)
JPH0381679U (en)
JPH0316375U (en)
JPS61165926U (en)
JPS63200379U (en)
JPS6371578U (en)
JPS6311856U (en)
JPH0423184U (en)
JPS62160572U (en)
JPH0238788U (en)