JPH026190A - Ic card and ic module - Google Patents

Abstract

PURPOSE:To prevent the break of bonding wires due to a bending action in the longitudinal direction of a card base material by disposing the bonding wires orthogonally to the longitudinal direction of the card base material. CONSTITUTION:Electrode parts 25 provided on the lower surface of a pattern layer 15 are disposed from respective through holes 14 to the vicinity of an IC chip 17. The electrode parts 25 are connected to the IC chip 17 with bonding wires 18 disposed orthogonally to the longitudinal direction of a card base material 30. An IC card 10 in use is subjected to a longitudinally bending action as shown by an arrow R ; due to this longitudinally bending action, an IC module 11 is subjected to a similar bending action. In this case, since the bonding wires 18 are disposed orthogonally to the longitudinal direction of the card base material 30 shown by an arrow L, there is no possibility that the bonding wires 18 are broken due to the bending action to the IC card.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to an IC card and an IC mounted on an IC card.
Regarding modules.

(Prior Art) In recent years, cards called chip cards, memory cards, microcomputer cards, or electronic cards (hereinafter simply referred to as I/O cards) equipped with IC chips such as microcomputers and memory
A variety of research is underway regarding the C-card.

Compared to conventional magnetic cards, such IC cards have
Because of its large storage capacity, banks are considering using it to store the history of deposits and savings in place of passbooks, and credit cards are considering storing transaction history such as shopping.

This kind of IC card is an IC equipped with an IC chip.
It consists of a module and a card base material in which a recessed portion for mounting the IC module is formed.

Among these, an IC module has an external terminal provided on one side of a substrate, and a pattern layer and an IC chip provided on the other side of the substrate, and wires are connected between the electrode portion of the pattern layer and the IC chip using bonding wires. ing. Also this I
The periphery of the C chip and the wiring section is molded with resin.

Furthermore, multiple through holes are provided through the board and pattern layer, and conductive plating (for example, copper plating - nickel plating + gold plating) formed on the inner surface of the through holes connects the external terminals and the pattern layer. The electrode section is electrically connected.

(Problem to be Solved by the Invention) As described above, the electrode portion of the pattern layer of the IC module and the I
Wiring is provided between the C chip and the C chip using bonding wires.

By the way, an IC card in use is susceptible to bending action in the longitudinal direction of the card base, but due to this longitudinal bending action, the IC module is also subjected to a bending action in the same direction.
Bonding wires may break.

In such a case, it would be convenient if the bonding wire could be prevented from breaking by appropriately determining the wiring direction of the bonding wire.

The present invention has been made in consideration of these points,
IC that can prevent bonding wire breakage
Its purpose is to provide cards and IC modules.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides an external terminal on one side of a substrate, an IC chip and a pattern layer on the other side of the substrate,
An IC module is formed in which the C chip and the electrode portions of the pattern layer are wired and connected by bonding wires, and the external terminals and the electrode portions are electrically connected, and a recessed portion is formed in which the IC module is mounted via an adhesive. an IC card comprising a rectangular card base material, wherein the bonding wires connecting the IC chip and the electrode portions of the pattern layer are arranged in a direction perpendicular to the longitudinal direction of the card base material. An IC card characterized in that an external terminal is provided on one surface of a substrate, an IC chip and a pattern layer are provided on the other surface of the substrate,
An IC that is formed by wiring and connecting a chip and an electrode part of the pattern layer with a bonding wire, and also electrically connecting the external terminal and the electrode part, and is mounted in a recessed part of a rectangular card base material through an adhesive. The IC module is characterized in that the bonding wires connecting the IC chip and the electrode portions of the pattern layer are arranged in a direction perpendicular to the longitudinal direction of the card base material.

(Function) Since the bonding wire is arranged in a direction perpendicular to the longitudinal direction of the card base material, the bonding wire will not break due to the bending action in the longitudinal direction of the card base material.

(implementation full) Hereinafter, implementation of the present invention will be described with reference to the drawings.

FIGS. 1 and 2 show an IC card and an IC card according to the present invention.
It is a figure which shows the 1st Example of a C module. Of these, Figure 1 is a side sectional view of the IC card, and Figure 2 is a side sectional view of the IC card.
FIG. 3 is a bottom view of the module.

In FIG. 1, an IC card 10 is an IC module 11.
is attached to the recess 35 of the card base material 30.

Next, the IC module 11 will be explained in detail.

As shown in FIG. 1, an external terminal 13 is provided on one side of a substrate 12 made of a material with excellent flexibility and strength (for example, glass epoxy, glass BT resin, polyimide, etc.), and an adhesive is applied on the other side. Pattern layer 15 via 24
is provided. Further, an electrode portion 25 is provided on the lower surface of this pattern layer 15.

Both the external terminal 13 and the electrode section 25 are formed by applying copper plating, nickel plating, and gold plating to copper foil.

Further, as shown in FIG. 2, an IC chip 17 is mounted on the surface of the substrate 12 on the pattern layer 15 side, and necessary wiring is performed between it and the electrode section 25 of the pattern layer 15 using bonding wires 18. There is. Further, the periphery of the wiring section including the IC chip 17 and the bonding wires 18 is resin-molded with a molding resin to form a resin mold section 19.

Furthermore, a reinforcing sealing frame layer 20 is provided around the outer periphery of the resin molded part 19, and the lower surface of this sealing frame layer 20 is located on the same plane as the lower surface of the resin molded part 19. Note that this sealing frame layer 20 is shown in a transparent state in FIG. 2 for convenience.

In addition, a plurality of through holes 14 are formed through the external terminal 13, the substrate 12, the pattern layer 15, and the electrode section 25,
A conductive plating 14a is formed on the inner surface of the through hole 14 to connect the external terminal 13 and the electrode portion 25 of the pattern layer 15.

Note that the outer periphery of the sealing frame 20 is connected to the substrate 12 and the pattern layer 1.
It protrudes outward from the outer periphery of IC module 1.
1 has a convex cross section as a whole.

By the way, the IC chip 17 and the electrode portion 25 of the pattern layer 15
The bonding wire 18 that connects the card base material 30 is arranged in a direction perpendicular to the longitudinal direction of the card base material 30 (the direction of the arrow in FIGS. 1 and 2). That is, as shown in FIG. 2, an electrode part 25 provided on the lower surface of the pattern layer 15 is arranged from each through hole 14 to the vicinity of the IC chip 17, and from this electrode part 25 to the IC chip 17, They are connected by bonding wires 18 arranged in a direction perpendicular to the longitudinal direction of the base material 30.

On the other hand, a recess 35 is formed in the card base material 30, and the IC card 10 is constructed by mounting an IC module in the recess 35 via an adhesive 36.

Note that the card base material 30 includes a first oversheet 31, a first
Core 32, second core 33 and second oversheet 34
It is constructed by sequentially laminating layers.

Further, openings are previously formed in the first oversheet 31, the first core 32, and the second core 33, and a recess 35 is formed by these openings.

Further, the recess 35 formed in the card base material 30 is formed so that the IC module 11 to be buried therein can be easily inserted.
It is desirable that it be equal to or slightly larger than the C module 11 (about 0.05 to 0.1 mm).

Next, the operation of this embodiment having such a configuration will be explained.

First, a method for manufacturing the IC card 10 will be explained.

The first oversheet 31, the first core 32, and the second core 33, in which openings have been previously formed, are aligned so that the centers of their openings coincide. In this case, the openings of the first oversheet 31 and the first core 32 have shapes corresponding to the outer shapes of the substrate 12 and the pattern layer 15, and
The opening of the core 33 has a shape corresponding to the outer shape of the sealing frame layer 22. Furthermore, adhesive layers (not shown) are provided on both surfaces of the first core 32 and on the lower surface of the second core 33.

Subsequently, the IC module 11 is fitted into the laminate of the first oversheet 31, the first core 32, and the second core 33, and
The IC card 10 is obtained by covering the second core 33 with the second oversheet 34 and press laminating (110° for 20 minutes, 20 kg/go).

During use of the IC card 10, the IC card 10 is subjected to a longitudinal bending action (arrow R in FIG. 1), and this longitudinal bending action also causes the IC module 11 to undergo a similar bending action.

In this case, since the bonding wire 18 is arranged in a direction perpendicular to the longitudinal direction (arrow direction) of the card base material 30, the bonding wire 18 will not break due to the bending action on the IC card 10.

Next, referring to FIG. 3, a second embodiment of the present invention will be described.

In FIG. 3, an IC module 11 is provided with an external terminal 13 on one side of a substrate 12, and an electrode section 2 on the other side.
5 is provided.

Further, an IC chip 17 is placed on the surface of the substrate 12 on the electrode section 25 side.
is mounted, and the bonding wire 1 is connected between it and the electrode part 25.
After performing the necessary wiring in step 8, the periphery of the wiring portion including the IC chip 17 and the bonding wires 18 is resin-molded with a molding resin to form a resin molded portion 19. Therefore, the IC module 11 as a whole has a convex cross-sectional shape in the opposite direction to that of the IC module 11 in FIG.

On the other hand, a recess 35 having a shape corresponding to the shape of the IC module 11 is formed in the card base material 30 by cutting. Place the IC module 11 into this recess 35 using adhesive 3.
6, the resin mold part 19 and the recess 3
A space is formed between the number 5 and the number 5.

Further, in FIG. 3, the bonding wires 18 are arranged in a direction perpendicular to the longitudinal direction of the card base material 30.

In this embodiment, even if the IC card 10 is subjected to a bending action in the longitudinal direction, the bonding wire 18 will not break.

〔Effect of the invention〕

As explained above, according to the present invention, since the bonding wire is arranged in a direction perpendicular to the longitudinal direction of the card base material, the bonding wire will not break due to the bending action in the longitudinal direction of the card base material. . For this reason I
The security and reliability of the C card can be improved.

[Brief explanation of the drawing]

1 and 2 are diagrams showing a first embodiment of an IC card and an IC module according to the present invention. FIG. 1 is a side sectional view of the IC card, and FIG. 2 is a bottom view of the IC module. 3 is a diagram showing a second embodiment of the present invention. 10...IC card, 11...IC module, 1
2... Substrate, 13... External terminal, 14... Through hole, 14a... Conductive plating, 15... Pattern layer, 17... IC chip, 18... Bonding wire, 19... ...Resin mold part, 20... Sealing frame layer,
3o...Card base material, 35...Recessed portion. Figure 3

Claims (2)

[Claims] 1. An external terminal is provided on one surface of the substrate, an IC chip and a pattern layer are provided on the other surface of the substrate, and the electrode portions of the IC chip and the pattern layer are wired and connected by bonding wires, and the external terminal and an IC module that is electrically connected to the electrode section;
In an IC card consisting of a rectangular card base material with a recessed portion for attaching a module via an adhesive, the bonding wire connecting the IC chip and the electrode portion of the pattern layer is connected along the longitudinal direction of the card base material. An IC card characterized in that it is arranged in a direction perpendicular to the direction. 2. An external terminal is provided on one surface of the substrate, an IC chip and a pattern layer are provided on the other surface of the substrate, and the electrode portions of the IC chip and the pattern layer are wired and connected by bonding wires, and the external terminal and In an IC module that is electrically connected to the electrode portion and is mounted in a recessed portion of a rectangular card base material via an adhesive, the bonding wire that connects the IC chip and the electrode portion of the pattern layer is connected to the card. An IC module characterized by being arranged in a direction perpendicular to the longitudinal direction of a base material.