JP2904785B2 - IC module with built-in card - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC module, and more particularly, to a card built-in IC module built in an IC card. [Related Art] In recent years, chip cards, memory cards, microcomputer cards, or cards called electronic cards equipped with IC chips such as microcomputers and memories (hereinafter simply referred to as ICs)
Various researches have been carried out. Such an IC card, compared to a conventional magnetic card,
Because of its large storage capacity, it has been considered to store the history of savings and deposits instead of the bankbook in the banking relationship and the transaction history of shopping and the like in the credit relationship. Such an IC card is generally configured such that a card-shaped center core in which an IC module is embedded and an oversheet for increasing the mechanical strength of the card are laminated on both sides or one side of the center core. Fig. 3 shows a conventional IC embedded in such an IC card.
It is sectional drawing of a module. That is, as shown in this drawing, an IC module for a built-in card which is conventionally used in a conventional manner has, for example, an IC chip 24 arranged in a laminate of a contact substrate 22 having patterned terminals 21 and a bonding substrate 23. And a dam through the circuit pattern layer 25
The module is sealed with a sealing resin 27. The wiring from the IC chip 24 is bonded to the circuit pattern layer 25, and conduction between the terminal 21 and the IC chip 25 is established via a through hole 28 provided in the substrate. [Problems to be Solved by the Invention] However, the conventional IC modules as described above have the following problems. (A) The layer structure of the base material that composes the module is complicated, and the conduction between the terminal and the IC chip is established through through holes, which complicates the manufacturing process and increases the manufacturing cost. I do. (B) Because of the through-holes, when the sealing resin is filled, the resin seeps to the terminal surface side, which tends to cause poor conduction, resulting in reduced yield and reliability. (C) Due to its structure, the size of an IC chip that can be embedded in a substrate is limited, and conventional IC modules are still not sufficiently satisfactory in strength or flexibility against bending and twisting of a card. The present invention has been made in view of the above-described problems of the related art, and has as its object to provide an IC module with a built-in card in which a manufacturing process is simple and reliability is improved. [Means for Solving the Problems] The card built-in IC module according to the present invention includes a terminal layer made of a patterned conductive material, and a support layer made of an insulating material provided with a through hole for bonding. And an IC module mounted on a support layer of the IC module substrate, and exposed through a through hole provided in the support layer. The wiring between the terminal and the IC chip is performed by directly wire bonding the terminal layer and the IC chip. In the IC module of the present invention, at least
The IC chip and the wiring portion may be further sealed with resin. Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. As shown in the sectional view of FIG. 1, the IC module for a built-in card according to the present invention comprises a support made of an insulating material provided with a terminal layer 1 made of a patterned conductive material and a through hole 2a for bonding. An IC module substrate 3 formed by laminating the layer 2 and an IC chip 4 mounted on the support layer 2 of the IC module substrate 3, and further provided on the support layer 2. Wiring between the terminal and the IC chip is performed by directly wire bonding the back surface of the terminal layer 1 exposed through the through hole 2a and the IC chip 4. In this example, the IC chip 4
Is mounted with a resin 5 so that the wiring portion and the IC chip are sufficiently covered and protected. The terminal layer 1 includes a copper foil layer 1a and a nickel plating layer 1a.
b, and a laminate with the gold plating layer 1c. In this case, it is preferable that the gold plating layer 1c is formed by hard gold plating on the surface side and soft gold plating on the inner side. As a material of the support layer 2, a material having excellent insulating properties, mechanical strength, and flexibility can be appropriately used. For example, the support layer is formed of a laminate of a resin film and an adhesive sheet. Is also good. In the present invention, the support layer 2 supports the IC chip 4 and also functions as an insulator between the terminal layer 1 and the IC chip 4. Further, by providing such a support layer, the size of the IC chip is not restricted, and an excellent reinforcing effect against bending of the card when the IC chip is incorporated is obtained. Furthermore, in the present invention, since the IC chip 4 and the terminal layer 1 can be directly wired through the bonding through holes 2a provided in the support layer 2,
Compared to the case of using a through-hole, the reliability of the wiring is superior, and it is also advantageous in that the sealing resin can be prevented from exuding to the terminal surface side as in the conventional case. Is excellent in both simplification. Next, an example of a method for manufacturing an IC module of the present invention will be described. FIG. 2 is an explanatory view showing a manufacturing process of the IC module of the present invention. As shown in this figure, for example, a thickness of 0.1 mm
A film (a film in which a resin is impregnated into a glass cloth) 2c such as a glass epoxy film, a polyester film, a polyimide film, and a bismaleide-triazine resin film is temporarily bonded to a thermosetting adhesive sheet 2d (see FIG. 2) Then, as shown in FIG. 2 (b), a bonding through hole 2a is formed at a desired portion. Next, as shown in the cross-sectional view of FIG. 2 (c), a copper foil 1a is bonded to one surface of the obtained support layer 2 by a heat press and integrated. Next, a resist is applied to the terminal side surface of the copper foil 1a, and photolithography is performed on the terminal pattern to perform patterning (FIG. 2 (d)). Further, FIG. 2 (e)
As shown in the cross-sectional view, the surface of the copper foil 1a Ni plating 1b, Au
The plating 1c is formed. Next, the thus obtained IC module substrate 3
Then, as shown in FIG.
After the IC chip 4 is fixed, the chip 4 and the terminal layer 1 are connected by wire bonding, further sealed with a resin 5 by a transfer molding method, casting, or the like, and further polished on the back side if necessary. Then, the thickness is adjusted to obtain the IC module for the built-in IC card. [Effects of the Invention] The IC module with a built-in card according to the present invention has the following effects. (1) Since the structure is simple and there is no need to provide a through hole, the manufacturing process is significantly simplified as compared with the conventional one, and furthermore, the exudation of the sealing resin can be prevented, and the cost can be reduced. it can. (2) The reliability of the function as the IC module is improved, and the yield can be further improved. (3) The IC module of the present invention, when embedded in a card, has excellent strength against bending and flexibility of the card.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of an IC module of the present invention, FIG. 2 is an explanatory view showing a manufacturing process of the IC module, and FIG. 3 is a cross-sectional view of a conventional IC module. DESCRIPTION OF SYMBOLS 1 ... Terminal layer, 2 ... Support layer, 3 ... IC module base material, 4
... IC chips, 5 ... Resin.

Claims (1)

(57) [Claims] A support layer made of an insulating material provided with a through hole for bonding; a terminal layer made of a patterned conductive material provided on the entire surface of the support; and an IC chip fixed on the support layer An IC module having a structure in which the support layer and the terminal layer are formed in the IC chip arrangement portion, wherein the IC module is exposed through a bonding through hole provided in the support layer. An IC module with a built-in card, wherein the wiring between the terminal and the IC chip is performed by directly wire-bonding a terminal layer and the IC chip. 2. 2. The IC module according to claim 1, wherein at least the IC chip and the wiring portion are resin-sealed.