JPH06239076A - Ic card and ic module - Google Patents

Abstract

PURPOSE:To reduce stress concentration exerted on a substrate near an insulating groove when a bending action is applied to an IC card from the outside. CONSTITUTION:An external terminal 13 is provided on one surface of a substrate 12 of an IC module 11, while an IC chip 17 and an electrode element 25 are provided on the other surface of the substrate 12. The external terminal 13 is divided into a plurality of regions by insulating grooves 28a, 28b and the electrode element 25 is disposed so as to cover the whole area corresponding to the groves 28a, 28b.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to an IC card and an IC.
The present invention relates to an IC module mounted on a card.

[0002]

2. Description of the Related Art In recent years, various studies have been conducted on a card called a chip card, a memory card, a microcomputer card, or an electronic card (hereinafter, simply referred to as an IC card) on which an IC chip such as a microcomputer or a memory is mounted.

Since such an IC card has a larger storage capacity than a conventional magnetic card, a banking history is stored instead of a passbook, and a crediting history of transactions such as shopping is stored. I am thinking.

Such an IC card is composed of an IC module on which an IC chip is mounted and a card substrate on which a recess for mounting the IC module is formed.

Of these, the IC module is provided with an external terminal on one surface of the substrate, an IC chip and a metal electrode portion are provided on the other surface of the substrate, and the IC chip and wiring for connecting the IC chip and the electrode portion. It is formed by molding the periphery of the portion with resin.

Further, a plurality of through holes are provided through the substrate, and the external terminals and the electrode portions are separated by conductive plating (for example, copper plating + nickel plating + gold plating) formed on the inner surface of the through holes. It is conducted.

Further, the external terminals provided on the surface of the IC module are divided into a plurality of regions by insulating grooves.

[0008]

As described above, the metallic external terminal provided on one surface of the substrate of the IC module is divided into a plurality of regions by a plurality of insulating grooves.

However, while the IC card is subjected to a bending action from the outside during use, this bending action may cause stress concentration on the substrate near the insulating groove. The stress concentration on the substrate is due to the notch of the insulating groove. If the IC chip is placed near the insulation groove,
If the stress concentration applied to the substrate increases, the IC chip may be damaged due to the stress concentration of the substrate.

The present invention has been made in consideration of the above points, and even when the IC card is externally bent during use, the IC chip is not damaged by the bending action. And an IC module.

[0011]

SUMMARY OF THE INVENTION The present invention provides an IC module in which external terminals are provided on one surface of a substrate and an IC chip and an electrode portion are provided on the other surface of the substrate, and this IC module.
In an IC card comprising a card base material in which a recess is formed for mounting a module via an adhesive, the external terminal is divided into a plurality of regions by an insulating groove, and the other surface corresponds to the insulating groove. An IC characterized in that a metal foil pattern is arranged so as to cover substantially the entire area.
In a card and an IC module in which an external terminal is provided on one surface of a substrate and an IC chip and an electrode portion are provided on the other surface of the substrate, the external terminal is divided into a plurality of regions by an insulating groove, and The IC module is characterized in that a metal foil pattern is arranged on the other surface so as to cover substantially the entire area corresponding to the insulating groove.

[0012]

Since the metal foil pattern is arranged so as to cover almost the entire area corresponding to the insulating groove, the stress concentration applied to the substrate in the vicinity of the insulating groove is reduced when the IC card receives a bending action from the outside. can do.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 are views showing an embodiment of the present invention. In FIG. 1, an IC card 10 is configured by mounting an IC module 11 in a recess 35 of a rectangular card substrate 30. In this case, the IC module 11 has a rectangular shape, and its longitudinal direction (direction of arrow L) coincides with the longitudinal direction of the card base material 30.

Next, the IC module will be described in detail. As shown in FIG. 1, a metal external terminal 1 is formed on one surface of a substrate (eg, glass epoxy, glass BT resin, polyimide, etc.) 12 made of a material having excellent flexibility and strength.
3 is provided, and the metal electrode part 25 is provided on the other surface. Each of the external terminal 13 and the electrode portion 25 is formed by applying copper plating, nickel plating, and gold plating to a copper foil.

On the surface of the substrate 12 on the electrode portion 25 side, I
A C chip 17 is mounted. After performing necessary wiring between the IC chip 17 and the electrode portion 25 with the bonding wire 18, the periphery of the wiring portion including the IC chip 17 and the bonding wire 18 is resin-molded with a molding resin to form the resin mold portion 19. Has been formed.

Further, a plurality of through holes 14 are formed, for example, 8 through the external terminals 13, the substrate 12 and the electrode portions 25.
The external terminals 1 are provided on the inner surface of the through hole 14.
Conductive plating 14a is formed to electrically connect 3 and the electrode portion 25.

By the way, as shown in FIG.
Are divided into a plurality of regions 13a, 13b ... By an insulating groove 28a extending in the longitudinal direction of the card substrate 30 (direction of arrow L) and an insulating groove 28b extending in a direction orthogonal to the insulating groove 28a. Further, the plurality of regions 13a, 13b ... Of the external terminals 13 include a wide region (ground portion) 13a located substantially in the center and seven regions 13b, 13c, 13d ..., Which are located on both sides of the ground portion 13a. It consists of 13n.

Next, the electrode portion 25 will be described in detail with reference to FIG. As shown in FIG. 3, an electrode 25 extends from the through hole 14 to the vicinity of the IC chip 17, and the electrode portion 25 and the IC chip 17 are connected by a bonding wire 18. Among them, the IC chip 17 is arranged in a region corresponding to the ground portion 13a of the external terminal 13 (see FIG. 2), and the electrode portion 25 is formed in the insulating grooves 28a and 28b together with the reinforcing patterns 26a and 26b. Corresponding part (insulating grooves 28a, 2 provided on one surface
8b) is arranged so as to cover almost the entire area of the other surface corresponding to 8b).

That is, as shown in FIG. 3, the electrode portion 25 provided on the substrate 12 is composed of eight electrode portions 25a, ... 25h corresponding to the respective through holes 14, and is arranged above and below in FIG. Reinforcing patterns 26a and 26b are arranged respectively. .. 26h and reinforcing patterns 25i, 25j constitute a metal foil pattern, and the metal foil pattern includes insulating grooves 28a, 28b.
It covers almost the entire area corresponding to. Therefore, the insulating grooves 28a and 28b can be reinforced by the metal foil patterns (electrode portions 25a, ... 25h and reinforcing patterns 26a and 26b), and stress concentration applied to the substrate 12 near the insulating grooves 28a and 28b can be reduced. can do.

Instead of arranging the metal foil pattern as shown in FIG. 3, the metal foil pattern may be arranged as shown in FIG. That is, as shown in FIG.
8 electrode parts 25 corresponding to each through hole 14
25h are arranged, and the electrode portions 25a, 25h are arranged.
To form a metal foil pattern. And the electrode part 2
The metal foil pattern 5a, ..., 25h covers substantially the entire area of the portions corresponding to the insulating grooves 28a, 28b.

Further, a metal foil pattern may be arranged as shown in FIG. That is, as shown in FIG.
8 electrode portions 25a corresponding to each through hole 14,
... 25h is arranged. These eight electrode parts 25a,
25h extends in a strip shape from the through hole 14 to the vicinity of the IC chip 17. Further, each electrode portion 25a, ... 25h
In between, a reinforcing pattern 41 covering substantially the entire area of the portions corresponding to the insulating grooves 28a and 28b is arranged in a strip shape along the portions corresponding to the insulating grooves 28a and 28b.

In FIG. 5, the electrode portions 25a, ... 2
The metal foil pattern is composed of 5h and the reinforcing pattern 41. Of these, the reinforcing pattern 41 particularly strengthens the insulating grooves 28a and 28b.

Further, a metal foil pattern may be arranged as shown in FIG. That is, as shown in FIG. 6, eight electrode portions 25a corresponding to each through hole are formed on the substrate 12,
... 25h is arranged. These eight electrode parts 25a,
25h extends in a strip shape from the through hole 14 to the vicinity of the IC chip 17. In addition, each electrode portion 25a, ...
The reinforcing pattern 42 that covers substantially the entire area of the substrate 12 is provided between the two. Since the reinforcing pattern 42 covers almost the entire area of the substrate 12, it covers almost the entire area of the portions corresponding to the insulating grooves 28a and 28b.

In FIG. 6, electrode portions 25a, ... 25h
And a reinforcing pattern 42 constitute a metal foil pattern. Among them, the reinforcing pattern 42 can reinforce the insulating grooves 28a and 28b.

The recess 3 formed in the card substrate 30.
5 is preferably the same as or slightly larger than the IC module 11 so that the mounted IC module 11 can be easily inserted.

While using the IC card 10, the IC card 10
Is mainly subjected to a bending action in the longitudinal direction of the card base material 30 (direction of arrow L in FIG. 1). It is conceivable that the bending action in the longitudinal direction causes stress concentration especially on the substrate 12 in the vicinity of the insulating groove 28b orthogonal to the longitudinal direction of the card base material 30, but the electrode portion 25 substantially corresponds to the insulating groove 28b. Since the whole area is covered, the stress concentration applied to the substrate 12 can be reduced. Therefore, the IC chip 17 is not affected by the stress concentration on the substrate 12, and
Damage to the C chip 17 is prevented. Similarly, IC card 1
When 0 is subjected to a bending action in a direction orthogonal to the longitudinal direction of the card base material 30, the electrode portion 25 can reduce the stress concentration generated on the substrate 12 in the vicinity of the insulating groove 28a.

[0027]

As described above, according to the present invention, I
When the C card receives a bending action from the outside, stress concentration applied to the substrate in the vicinity of the insulating groove can be reduced by the electrode portion. Therefore, it is possible to reliably prevent damage to the IC chip due to stress concentration on the substrate.

[Brief description of drawings]

FIG. 1 is a side sectional view of an IC card showing an embodiment of the present invention.

FIG. 2 is a plan view of an IC module.

FIG. 3 is a bottom view of the IC module.

FIG. 4 is a bottom view showing a modified example of the IC module.

FIG. 5 is a bottom view showing another modification of the IC module.

FIG. 6 is a bottom view showing still another modified example of the IC module.

[Explanation of symbols]

 10 IC Card 11 IC Module 12 Board 13 External Terminal 17 IC Chip 25 Electrodes 28a, 28b Insulation Groove 30 Card Base Material 35 Recess

Claims (4)

[Claims] 1. An external terminal is provided on one surface of a substrate, and an IC chip and an electrode portion are provided on the other surface of the substrate.
In an IC card comprising a C module and a card substrate having a recess formed therein for mounting the IC module via an adhesive, the external terminal is divided into a plurality of regions by an insulating groove, and the other surface is formed on the other surface. An IC card, wherein a metal foil pattern is arranged so as to cover substantially the entire area corresponding to the insulating groove. 2. The IC card according to claim 1, wherein the metal foil pattern is an electrode portion. 3. An external terminal is provided on one surface of a substrate, and an IC chip and an electrode portion are provided on the other surface of the substrate.
In the C module, the external terminal is divided into a plurality of regions by an insulating groove, and a metal foil pattern is arranged on the other surface so as to cover substantially the entire region corresponding to the insulating groove. module. 4. The IC card according to claim 3, wherein the metal foil pattern is an electrode portion.