JPH0261357B2 - - Google Patents

Info

Publication number
JPH0261357B2
JPH0261357B2 JP58231427A JP23142783A JPH0261357B2 JP H0261357 B2 JPH0261357 B2 JP H0261357B2 JP 58231427 A JP58231427 A JP 58231427A JP 23142783 A JP23142783 A JP 23142783A JP H0261357 B2 JPH0261357 B2 JP H0261357B2
Authority
JP
Japan
Prior art keywords
ceramic substrate
laser beam
groove
ceramic
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58231427A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60124485A (ja
Inventor
Seigo Ootani
Fujio Niwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP58231427A priority Critical patent/JPS60124485A/ja
Publication of JPS60124485A publication Critical patent/JPS60124485A/ja
Publication of JPH0261357B2 publication Critical patent/JPH0261357B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Structure Of Printed Boards (AREA)
JP58231427A 1983-12-09 1983-12-09 セラミツク基板のレ−ザ−加工方法およびその基板 Granted JPS60124485A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58231427A JPS60124485A (ja) 1983-12-09 1983-12-09 セラミツク基板のレ−ザ−加工方法およびその基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58231427A JPS60124485A (ja) 1983-12-09 1983-12-09 セラミツク基板のレ−ザ−加工方法およびその基板

Publications (2)

Publication Number Publication Date
JPS60124485A JPS60124485A (ja) 1985-07-03
JPH0261357B2 true JPH0261357B2 (enrdf_load_stackoverflow) 1990-12-19

Family

ID=16923402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58231427A Granted JPS60124485A (ja) 1983-12-09 1983-12-09 セラミツク基板のレ−ザ−加工方法およびその基板

Country Status (1)

Country Link
JP (1) JPS60124485A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01100989A (ja) * 1987-10-14 1989-04-19 Matsushita Electric Ind Co Ltd セラミック基板の構造
US6765174B2 (en) 2001-02-05 2004-07-20 Denso Corporation Method for machining grooves by a laser and honeycomb structure forming die and method for producing the same die
DE102008043539A1 (de) * 2007-11-07 2009-05-14 Ceramtec Ag Verfahren zum Laserritzen von spröden Bauteilen

Also Published As

Publication number Publication date
JPS60124485A (ja) 1985-07-03

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