JPH0261025A - Al-si alloy plate material having excellent formability and its manufacture - Google Patents
Al-si alloy plate material having excellent formability and its manufactureInfo
- Publication number
- JPH0261025A JPH0261025A JP21203688A JP21203688A JPH0261025A JP H0261025 A JPH0261025 A JP H0261025A JP 21203688 A JP21203688 A JP 21203688A JP 21203688 A JP21203688 A JP 21203688A JP H0261025 A JPH0261025 A JP H0261025A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- thermal expansion
- plate material
- excellent formability
- coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 229910021364 Al-Si alloy Inorganic materials 0.000 title claims abstract description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 19
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 7
- 239000000956 alloy Substances 0.000 claims abstract description 7
- 238000005098 hot rolling Methods 0.000 claims abstract description 6
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 5
- 238000005097 cold rolling Methods 0.000 claims abstract description 5
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 5
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 5
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 3
- 239000011856 silicon-based particle Substances 0.000 claims description 13
- 238000000265 homogenisation Methods 0.000 claims description 10
- 239000012535 impurity Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229910000676 Si alloy Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910018125 Al-Si Inorganic materials 0.000 claims 1
- 229910018520 Al—Si Inorganic materials 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 abstract description 3
- 238000005096 rolling process Methods 0.000 abstract description 2
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 8
- 239000000047 product Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000004881 precipitation hardening Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910018134 Al-Mg Inorganic materials 0.000 description 1
- 229910018467 Al—Mg Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
Description
（産業上の利用分野）
本発明はＡｌ２−Ｓｉ系合金板材に係り、電気機器、特
にワープロ、パソコン、エンジニアリング・ワーク・ス
テーション等のシャーシの如く強度と成形性の両者が要
求され、且つ記憶ディスクとの熱膨張係数との関係から
熱膨張係数が低いことが要求される用途に好適な、成形
性の優れたＡｌ−Ｓｉ系合金板材とその製造方法に関す
る。
（従来の技術及び解決しようとする課題）従来より、コ
ンピューターのハード・ディスク・ドライブ、ブロッピ
ー・ディスク・ドライブのような精密部品には、低コス
ト、低熱膨張の理由からアルミニウムダイキャスト品、
例えばＪＩＳＡＤｅ１２などが多用されている。
しかし、近時、製品の薄肉化による軽量化及び更なるコ
ストダウンを図るために、アルミニウム合金の板材が強
く要望されてきている。
しかし、従来のアルミニウム合金板材、例えば、成形加
工用合金（７）ＪＩＳ５０５２やＪＩＳ５０８３などの
Ａｌ−Ｍｇ系合金をディスク・ドライブの蓋に用いると
、アルミニウム合金ダイカストＡＤＣ１２１１のベース
プレートとの熱膨張係数との差から歪が発生し、読取エ
ラーを惹き起こすことがある。
また、ディスク・ドライブのヘッドアームやキャリッジ
もアルミ板から製作される場合があるが、従来のアルミ
ニウム合金では熱膨張係数が高いので、同様の問題が生
じる。
そこで、熱膨張係数が低い成形加工用アルミニウム合金
板材の開発が要請されているのが現状である。
本発明は、上記要請に応えるべくなされたものであって
、成形性に優れ且つ熱膨張係数が低く。
コンピューター等の電気機器部品用に適するアルミニウ
ム合金板材を提供し、ま、たその製造方法を提供するこ
とを目的とするものである。
（課題を解決するための手段）
前記目的を達成するため、本発明者は、従来の成形加工
用アルミニウム合金が熱膨張係数が高いことに鑑みて、
他の成分系においてその化学成分の調整並びに製造条件
について鋭意研究を重ねた。
その結果、熱膨張係数を低下させることに有効な添加元
素としてＳｉがあり、Ｓｉ量は適度に多いほど熱膨張係
数が低くなる。しかし、Ｓｉ量が多くなるとまｆ製造段
階における圧延性が悪く、また製品の成形性も悪くなる
ことが判明した。
そこで、Ｓｉを比較的多く含有するアルミニウム合金に
おいて圧延性、製品の成形性が悪化する原因の究明に努
めたところ、最終製品でのＳｉ粒子径が圧延性、成形性
に大きく影響を及ぼすことが判明し、その対策として均
質化処理条件によりＳｉ粒子径をコントロールすること
により、可能であることを見出したものである。
すなわち、本発明に係るアルミニウム合金板材は、必須
合金成分としてＳｉ：３〜１５％を含有し、必要に応じ
て更に、Ｍｇ：Ｑ、５〜５．０％、Ｃｕ：Ｏ６２〜３．
０％、Ｎｉ：０．５〜２．０％、Ｍｎ：０．０６〜１．
０％、Ｃｒ：０．０６〜０．３％、Ｚｒ：０．０６〜０
．２％、Ｖ：０．０６〜０．２％、Ｔｉ：０．０１〜０
．１％、Ｂ：Ｏ，ＯＯｌ 〜０．２％及びＺｎ： ０
。
１〜２．０％のうちの１種又は２種以上を含有し。
残部がＡｌ及び不純物からなる組成を有し、Ｓｉ粒子の
平均径が４〜１５μｍであることを特徴とする成形性に
優れ熱膨張係数の低い電気機器部品用Ａｌ２−Ｓｉ系合
金板材を要旨とするものである。
また、か＼るアルミニウム合金板材の製造方法は、上記
組成を有するアルミニウム合金につき、その鋳塊をバー
ニング温度以下の４５０〜５４０℃の範囲の温度で均質
化処理を施し、続いて熱間圧延、冷間圧延により所望の
板厚とし、８１粒子の平均径が４〜１５μｍのものを得
ることを特徴とする成形性に優れ熱膨張係数の低い電気
機器部品用Ａｌ−Ｓｉ系合金板材の製造方法を要旨とす
るものである。
以下に本発明を更に詳細に説明する。
（作用）
まず、本発明における化学成分の限定理由を説明する。
Ｓｉ：
Ｓｉは、その含有量に比例して熱膨張係数を低下させ、
またＭｇとの共存によりＭｇ、Ｓｉを生成して析出硬化
により強度を上げることに寄与する元素である。しかし
、Ｓｉが３％未満では熱膨張係数を低下させる効果は少
なく、また１５％を超えれば成形性が不足する。したが
って、Ｓｉ量は３〜１５％の範囲内とする。
本発明では、少なくともＳｉを上記量で含有させること
を必須とするが、熱膨張係数、成形性の改善を目的とし
て以下の元素の１種又は２種以上を必要に応じて含有さ
せることができる。
Ｍｇ：
Ｍｇは既で述べたようにＳＬとの共存により強度を上げ
ることに寄与する元素であるが、０．５％未満ではその
効果が得られず、逆に多過ぎれば成形性が低下する。ま
た、Ｍｇはその含有量に比例して熱膨張係数を上昇させ
る元素である。したがって、Ｍｇ量は０．５〜５．０％
の範囲内とする。
Ｃｕ：
Ｃｕはその含有量に比例して強度を上げるのに寄与する
元素であるが、０．２％未満ではその効果は少なく、一
方、３．０％を超えれば強度は向上するが成形性が低下
する。また、Ｃｕは熱膨張係数を低下させることに有効
である。したがって、Ｃｕ量は０．２〜３．０％の範囲
とする。
Ｎｉ：
Ｎｉは熱膨張係数を低下させることに大変有効な元素で
あるが、０．５％未満ではその効果が少なく、また多過
ぎれば成形性を低下させることになる。したがって、Ｎ
ｉ量は０．５〜２．０％の範囲とする。
Ｍｎ、 Ｃｒ、 Ｚｒ、 Ｖ ：
Ｍｎ、Ｃｒ、Ｚｒ、Ｖは再結晶粒を微細化させ、強度を
上げることに寄与するが、含有量が多過ぎると巨大晶出
物を生成し、成形性を低下させる。
したがって、それぞれ、Ｍｎ量は０．０６〜１．０％、
Ｃｒ量は０．０６〜０．３％、Ｚｒ量は０．０６〜０．
２％、Ｖ量は０．０６〜０．２％の範囲とする。
Ｔｉ、Ｂ：
Ｔｉ、Ｂは鋳塊の結晶粒を微細化させ、粗大なＳｉ粒子
の晶出を抑制することにより、成形性を向上させる元素
であるが、含有量が多過ぎると巨大晶出物を生成し、成
形性を低下させる。したがって、Ｔｉ量は０．０１〜０
．１％、Ｂ量は０．００１〜０．０５％の範囲とする。
Ｚｎ：
Ｚｎは成形性の向上に付与する元素であるが、その含有
量に比例して熱膨張係数を上昇させる作用がある。した
がって、Ｚｎ量は０．１〜２．０％の範囲とする。
なお、不可避的不純物のＦｅは１．０％以下、またその
他の不純物のＢｅ、Ｍｏ、Ｃｏなどは、それぞれ０．０
５％以下であれば本発明板材の特性を損なうものではな
い。
また、上記ＳＬ、Ｍｇ、Ｃｕ、Ｚｎは所望の板厚とした
後の調質において、溶体化焼入を施すことにより過飽和
に固溶し、成形加工後の塗装焼付時の析出硬化による強
度の上昇に寄与する元素でもある。
次に本発明の製造方法について説明する。
まず、前述の化学成分を有するアルミニウム合金は常法
により溶解、鋳造して鋳塊を作成する。
その際、共晶Ｓｉを微細化させるためにＮａ或いはＳｒ
を添加する場合がある。
続いて、鋳塊に均質化処理を施すが、この均質化処理は
バーニング温度以下の４５０〜５４０℃の範囲の温度で
行うことが必要である。この処理は鋳造組織を均一にす
ると共に、特にＳｉ粒子径をコントロールするためのも
ので、上記温度範囲で均質化処理することによって最終
製品のＳｉ粒子径を４〜１５μ亀にすることができる。
なお、加熱保持時間は特に制限されないが、２〜１２時
間であるのが望ましい。
次に熱間圧延及び冷間圧延を行うが、これらの圧延条件
は特に限定する必要はない。また熱間圧延後に荒焼鈍及
び中間焼鈍を行ってもよく、冷間圧延後に調質処理を行
なうこともできる。調質処理は、例えば最終焼鈍として
３３０〜４４０℃で行い、再結晶させて０材とする場合
や、４８０〜５５０℃で溶体化した後に焼入れてＴ４材
とする場合などがある。
最終製品でのＳｉ粒子径のコントロールは、前述のよう
に均質化処理条件により行うが、更にはＴｉ、Ｂなどの
元素の添加によっても行うこともでき、そのＳｉ粒子平
均径は４〜１５μｍとする。
しかし、４μｍ未満では均一に分散させることによる成
形性向上の効果は少なく、また１５μｍを超えると成形
性が極端に低下するので好ましくなり）。
（実施例）
次に本発明の実施例を示す。
実施■よ
第１表に示す化学成分を有するアルミニウム合金を通常
の方法により、溶解し、共晶Ｓｉの微細化のためにＮａ
を添加した後、鋳造して鋳塊を得た。この鋳塊を面前し
、５１０℃に４時間保持する均質化処理を施した後、熱
間圧延、冷間圧延を行って１．０ｍ＋１１厚の板材とし
た。次いで、この板材を加熱速度４０℃／ｈｒで３７０
℃に２時間保持し、４０℃／ｈｒの冷却速度で冷却する
調質処理を行った。
得られた板材の機械的性質及び熱膨張係数を第２表に示
す。
第２表に示すように、本発明材Ｎα１〜Ｎａ ９はいず
れもダイキャスト品のＪＩＳＡＤＣ１２（比較材＆１３
）並みに熱膨張係数が低く、且つ伸びもＪＩＳ５０５２
（比較材Ｎα１１）並みに大きく成形性が良いことがわ
かる。なお、Ｓｉ量が少ない比較材Ｎａ １０は成形加
工性は良好であるものの、熱膨張係数が高い。
「以下余白」
（注２）熱膨張係数は２０〜１００℃の温度範囲の値で
ある。
去】０１λ
第１表に示したＮα２のアルミニウム合金を通常の方法
で溶解し、共晶Ｓｉの微細化のためにＮａを添加した後
、鋳造した。得られた鋳塊を固剤し、４２０〜５６０℃
の種々の温度に４時間保持する均質化処理を施した後、
熱間圧延、冷間圧延を行って１．０ｍ■厚の板材とし、
この板材を加熱速度４０℃／ｈｒで３７０℃に２時間保
持し、４０℃／ｈｒの冷却速度で冷却する調質処理を行
った。
得られた板材についてＳｉ粒子径及び成形特性（エリク
セン値、限界絞り比）を調査し、これらと均質化温度と
の関係を調べた。その結果を第３表に示す。−
同表より、Ｓｉ粒子の平均径を４〜１５μｍにコントロ
ールした本発明材は、比較材よりも成形性に優れている
ことが明らかである。(Industrial Application Field) The present invention relates to Al2-Si alloy plate materials, which require both strength and formability, such as the chassis of electrical equipment, particularly word processors, personal computers, engineering work stations, etc., and storage disks. The present invention relates to an Al--Si alloy sheet material with excellent formability, which is suitable for applications requiring a low coefficient of thermal expansion due to the relationship between the coefficient of thermal expansion and the method of manufacturing the same. (Prior art and problems to be solved) Conventionally, precision parts such as computer hard disk drives and floppy disk drives have been made of aluminum die-cast products due to their low cost and low thermal expansion.
For example, JISADe12 is often used. However, in recent years, there has been a strong demand for aluminum alloy plate materials in order to reduce weight and further reduce costs by making products thinner. However, when a conventional aluminum alloy plate material, for example, an Al-Mg alloy such as forming alloy (7) JIS5052 or JIS5083, is used for the lid of a disk drive, the thermal expansion coefficient with the base plate of the aluminum alloy die-cast ADC1211 is different. Distortion may occur due to the difference, leading to reading errors. Additionally, the head arm and carriage of a disk drive may also be made from aluminum plates, but conventional aluminum alloys have a high coefficient of thermal expansion, resulting in similar problems. Therefore, there is currently a demand for the development of an aluminum alloy sheet material for forming that has a low coefficient of thermal expansion. The present invention was made to meet the above requirements, and has excellent moldability and a low coefficient of thermal expansion. The object of the present invention is to provide an aluminum alloy plate suitable for parts of electrical equipment such as computers, and to provide a method for manufacturing the same. (Means for Solving the Problems) In order to achieve the above object, the inventors of the present invention, in view of the fact that conventional aluminum alloys for forming processing have a high coefficient of thermal expansion,
We conducted extensive research on the adjustment of chemical components and manufacturing conditions for other component systems. As a result, Si is an effective additive element for lowering the coefficient of thermal expansion, and the more the amount of Si is appropriately increased, the lower the coefficient of thermal expansion becomes. However, it has been found that when the amount of Si increases, the rollability during the machining process becomes worse, and the moldability of the product also becomes worse. Therefore, we tried to investigate the cause of the deterioration of rollability and product formability in aluminum alloys containing a relatively large amount of Si, and found that the Si particle size in the final product has a large effect on rollability and formability. As a countermeasure to this problem, we have found that it is possible to control the Si particle size by adjusting the homogenization treatment conditions. That is, the aluminum alloy plate material according to the present invention contains Si: 3 to 15% as an essential alloy component, and further contains Mg:Q, 5 to 5.0%, Cu:O62 to 3.0%, if necessary.
0%, Ni: 0.5-2.0%, Mn: 0.06-1.
0%, Cr: 0.06-0.3%, Zr: 0.06-0
．． 2%, V: 0.06-0.2%, Ti: 0.01-0
．． 1%, B:O,OOl~0.2% and Zn: 0
. Contains one or more of 1 to 2.0%. The purpose of the present invention is to provide an Al2-Si alloy plate material for electrical equipment parts with excellent formability and a low coefficient of thermal expansion, which has a composition in which the balance consists of Al and impurities, and the average diameter of Si particles is 4 to 15 μm. It is something to do. In addition, the method for manufacturing such an aluminum alloy plate material includes homogenizing an aluminum alloy having the above composition at a temperature in the range of 450 to 540°C below the burning temperature, followed by hot rolling, A method for producing an Al-Si alloy sheet material for electrical equipment parts with excellent formability and a low coefficient of thermal expansion, characterized by obtaining a sheet material with a desired thickness by cold rolling and an average diameter of 81 particles of 4 to 15 μm. The main points are as follows. The present invention will be explained in more detail below. (Function) First, the reason for limiting the chemical components in the present invention will be explained. Si: Si lowers the coefficient of thermal expansion in proportion to its content,
It is also an element that contributes to increasing strength through precipitation hardening by producing Mg and Si when coexisting with Mg. However, if Si is less than 3%, the effect of lowering the coefficient of thermal expansion is small, and if it exceeds 15%, moldability is insufficient. Therefore, the amount of Si should be within the range of 3 to 15%. In the present invention, it is essential to contain at least Si in the above amount, but one or more of the following elements may be contained as necessary for the purpose of improving the coefficient of thermal expansion and formability. . Mg: As mentioned above, Mg is an element that contributes to increasing strength by coexisting with SL, but if it is less than 0.5%, this effect cannot be obtained, and on the other hand, if it is too much, formability will decrease. . Furthermore, Mg is an element that increases the coefficient of thermal expansion in proportion to its content. Therefore, the amount of Mg is 0.5-5.0%
within the range of Cu: Cu is an element that contributes to increasing strength in proportion to its content, but if it is less than 0.2%, its effect is small, while if it exceeds 3.0%, strength improves but formability decreases. decreases. Further, Cu is effective in lowering the coefficient of thermal expansion. Therefore, the amount of Cu is in the range of 0.2 to 3.0%. Ni: Ni is a very effective element for lowering the coefficient of thermal expansion, but if it is less than 0.5%, its effect will be small, and if it is too much, it will reduce moldability. Therefore, N
The amount of i is in the range of 0.5 to 2.0%. Mn, Cr, Zr, V: Mn, Cr, Zr, and V contribute to making the recrystallized grains finer and increasing the strength, but if the content is too large, giant crystallized substances are generated and formability is deteriorated. lower. Therefore, the Mn content is 0.06 to 1.0%, respectively.
The amount of Cr is 0.06-0.3%, and the amount of Zr is 0.06-0.
2%, and the V amount is in the range of 0.06 to 0.2%. Ti, B: Ti and B are elements that improve formability by refining the crystal grains of the ingot and suppressing the crystallization of coarse Si particles, but if their content is too high, they may cause giant crystallization. This results in the formation of molding products and reduces moldability. Therefore, the amount of Ti is 0.01~0
．． 1%, and the amount of B is in the range of 0.001 to 0.05%. Zn: Zn is an element that improves formability, and has the effect of increasing the coefficient of thermal expansion in proportion to its content. Therefore, the Zn amount is in the range of 0.1 to 2.0%. Note that the unavoidable impurity Fe is 1.0% or less, and other impurities Be, Mo, Co, etc. are each 0.0% or less.
If it is 5% or less, the properties of the plate material of the present invention will not be impaired. In addition, the above-mentioned SL, Mg, Cu, and Zn are dissolved into supersaturated solid solution by solution hardening during heat treatment after forming the desired plate thickness, and the strength is reduced by precipitation hardening during paint baking after forming. It is also an element that contributes to the rise. Next, the manufacturing method of the present invention will be explained. First, an aluminum alloy having the above-mentioned chemical components is melted and cast to create an ingot using a conventional method. At that time, Na or Sr is added to make the eutectic Si fine.
may be added. Subsequently, the ingot is subjected to a homogenization treatment, and this homogenization treatment must be performed at a temperature in the range of 450 to 540° C. below the burning temperature. This treatment is intended to make the casting structure uniform and, in particular, to control the Si particle size. By performing the homogenization treatment in the above temperature range, the Si particle size of the final product can be made to be 4 to 15 μm. Note that the heating holding time is not particularly limited, but is preferably 2 to 12 hours. Next, hot rolling and cold rolling are performed, but these rolling conditions do not need to be particularly limited. Further, rough annealing and intermediate annealing may be performed after hot rolling, and tempering treatment may be performed after cold rolling. The thermal treatment may be performed, for example, at 330 to 440°C as final annealing and then recrystallized to form a zero material, or may be solution-treated at 480 to 550°C and then quenched to form a T4 material. The Si particle size in the final product is controlled by the homogenization treatment conditions as described above, but it can also be done by adding elements such as Ti and B, and the average Si particle size is 4 to 15 μm. do. However, if it is less than 4 μm, the effect of improving moldability by uniformly dispersing it will be small, and if it exceeds 15 μm, the moldability will be extremely deteriorated, so this is not preferred). (Example) Next, an example of the present invention will be shown. Implementation ■ An aluminum alloy having the chemical components shown in Table 1 was melted using a normal method, and Na was added to refine the eutectic Si.
After adding , it was cast to obtain an ingot. This ingot was subjected to a homogenization treatment in which it was held at 510° C. for 4 hours, and then hot rolled and cold rolled to form a plate material of 1.0 m + 11 thickness. Next, this plate material was heated at a heating rate of 40°C/hr for 370°C.
Temperature treatment was carried out by holding at a temperature of 2 hours and cooling at a cooling rate of 40°C/hr. Table 2 shows the mechanical properties and coefficient of thermal expansion of the plate material obtained. As shown in Table 2, all of the present invention materials Nα1 to Na9 are die-cast products JISADC12 (comparative materials & 13
), the coefficient of thermal expansion is as low as that, and the elongation is also JIS5052.
It can be seen that the moldability is as large as that of (comparative material Nα11) and that the moldability is good. Note that although the comparative material Na 10 with a small amount of Si has good moldability, it has a high coefficient of thermal expansion. "Leaving space below" (Note 2) The coefficient of thermal expansion is a value in the temperature range of 20 to 100°C. 01λ Aluminum alloys with Nα2 shown in Table 1 were melted by a conventional method, Na was added to refine the eutectic Si, and then cast. The obtained ingot is solidified and heated to 420-560℃
After homogenization treatment by holding at various temperatures for 4 hours,
Hot rolled and cold rolled into a 1.0m thick plate,
This plate material was heated at 370° C. for 2 hours at a heating rate of 40° C./hr, and then cooled at a cooling rate of 40° C./hr. The Si particle size and forming characteristics (Erichsen value, critical drawing ratio) of the obtained plate material were investigated, and the relationship between these and the homogenization temperature was investigated. The results are shown in Table 3. - From the same table, it is clear that the material of the present invention, in which the average diameter of Si particles is controlled to 4 to 15 μm, has better formability than the comparative material.
（発明の効果）
以上詳述したように、本発明によれば、必須成分として
所定量のＳｉを含有するＡｌ−Ｓｉ系合金について均質
化処理によってＳｉ粒子径をコントロールするので、成
形性に優れると共に熱膨張係数の低いアルミニウム合金
板材を得ることができる。したがって、コンピューター
等の電気機器部品の軽量化及びコストダウンに寄与する
ところが大きい。
特許出願人 株式会社神戸裏鋼所
代理人弁理士 中 村 尚(Effects of the Invention) As described in detail above, according to the present invention, the Si particle size of an Al-Si alloy containing a predetermined amount of Si as an essential component is controlled by homogenization treatment, so that it has excellent formability. At the same time, an aluminum alloy plate material with a low coefficient of thermal expansion can be obtained. Therefore, it greatly contributes to reducing the weight and cost of electrical equipment components such as computers. Patent applicant Takashi Nakamura, patent attorney representing Kobe Ura Kosho Co., Ltd.
Claims (3)
Ｓｉ：３〜１５％を含有し、残部がＡｌ及び不純物から
なる組成を有し、Ｓｉ粒子の平均径が４〜１５μｍであ
ることを特徴とする成形性に優れ熱膨張係数の低い電気
機器部品用Ａｌ−Ｓｉ系合金板材。(1) Contains Si: 3 to 15% as an essential alloy component in terms of weight% (the same applies hereinafter), with the remainder consisting of Al and impurities, and the average diameter of Si particles is 4 to 15 μm. An Al-Si alloy plate material for electrical equipment parts with excellent formability and a low coefficient of thermal expansion.
５．０％、Ｃｕ：０．２〜３．０％、Ｎｉ：０．５〜２
．０％、Ｍｎ：０．０６〜１．０％、Ｃｒ：０．０６〜
０．３％、Ｚｒ：０．０６〜０．２％、Ｖ：０．０６〜
０．２％、Ｔｉ：０．０１〜０．１％、Ｂ：０．００１
〜０．２％及びＺｎ：０．１〜２．０％のうちの１種又
は２種以上を含有する組成を有する請求項１に記載のＡ
ｌ−Ｓｉ系合金板材。(2) The Al-Si alloy further contains Mg: 0.5 to
5.0%, Cu: 0.2-3.0%, Ni: 0.5-2
．． 0%, Mn: 0.06~1.0%, Cr: 0.06~
0.3%, Zr: 0.06~0.2%, V: 0.06~
0.2%, Ti: 0.01-0.1%, B: 0.001
A according to claim 1, having a composition containing one or more of Zn: 0.2% and Zn: 0.1 to 2.0%.
l-Si alloy plate material.
ウム合金につき、その鋳塊をバーニング温度以下の４５
０〜５４０℃の範囲の温度で均質化処理を施し、続いて
熱間圧延、冷間圧延により所望の板厚とし、Ｓｉ粒子の
平均径が４〜１５μｍのものを得ることを特徴とする成
形性に優れ熱膨張係数の低い電気機器部品用Ａｌ−Ｓｉ
系合金板材の製造方法。(3) Regarding the aluminum alloy having the composition according to claim 1 or 2, the ingot is heated to 45% below the burning temperature.
Forming characterized by performing homogenization treatment at a temperature in the range of 0 to 540°C, followed by hot rolling and cold rolling to obtain a desired thickness, and obtaining a sheet with an average diameter of Si particles of 4 to 15 μm. Al-Si for electrical equipment parts with excellent properties and low coefficient of thermal expansion
Method for manufacturing alloy sheet materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21203688A JPH0261025A (en) | 1988-08-26 | 1988-08-26 | Al-si alloy plate material having excellent formability and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21203688A JPH0261025A (en) | 1988-08-26 | 1988-08-26 | Al-si alloy plate material having excellent formability and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0261025A true JPH0261025A (en) | 1990-03-01 |
Family
ID=16615807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21203688A Pending JPH0261025A (en) | 1988-08-26 | 1988-08-26 | Al-si alloy plate material having excellent formability and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0261025A (en) |
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