JPH0259878B2 - - Google Patents

Info

Publication number
JPH0259878B2
JPH0259878B2 JP7012383A JP7012383A JPH0259878B2 JP H0259878 B2 JPH0259878 B2 JP H0259878B2 JP 7012383 A JP7012383 A JP 7012383A JP 7012383 A JP7012383 A JP 7012383A JP H0259878 B2 JPH0259878 B2 JP H0259878B2
Authority
JP
Japan
Prior art keywords
plating
roller
plated
spray
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7012383A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59197593A (ja
Inventor
Yasuhiko Sakaki
Masato Ando
Kazuhiro Taniguchi
Kenji Yamamoto
Junichi Tezuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Original Assignee
NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK filed Critical NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Priority to JP7012383A priority Critical patent/JPS59197593A/ja
Publication of JPS59197593A publication Critical patent/JPS59197593A/ja
Publication of JPH0259878B2 publication Critical patent/JPH0259878B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7012383A 1983-04-22 1983-04-22 自動メッキ装置 Granted JPS59197593A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7012383A JPS59197593A (ja) 1983-04-22 1983-04-22 自動メッキ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7012383A JPS59197593A (ja) 1983-04-22 1983-04-22 自動メッキ装置

Publications (2)

Publication Number Publication Date
JPS59197593A JPS59197593A (ja) 1984-11-09
JPH0259878B2 true JPH0259878B2 (cs) 1990-12-13

Family

ID=13422458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7012383A Granted JPS59197593A (ja) 1983-04-22 1983-04-22 自動メッキ装置

Country Status (1)

Country Link
JP (1) JPS59197593A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100389232C (zh) * 2003-12-21 2008-05-21 福建浔兴拉链科技股份有限公司 拉链链齿排的电镀装置

Also Published As

Publication number Publication date
JPS59197593A (ja) 1984-11-09

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