JPH025903U - - Google Patents
Info
- Publication number
- JPH025903U JPH025903U JP8353188U JP8353188U JPH025903U JP H025903 U JPH025903 U JP H025903U JP 8353188 U JP8353188 U JP 8353188U JP 8353188 U JP8353188 U JP 8353188U JP H025903 U JPH025903 U JP H025903U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- microwave
- metal carrier
- microwave semiconductor
- dielectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図ａ及びｂは本考案の一実施例の断面図及
び平面図、第２図ａ，ｂ、第３図ａ，ｂは従来の
マイクロ波回路構造の二つの例を示す断面図と平
面図である。
１…メタルキヤリアの凸部、２…誘電体基板、
３…マイクロ波用半導体チツプ、４…ボンデイン
グワイヤ、５…マイクロ波信号ライン、６…ＤＣ
電源又は制御信号ライン、７…スルーホール、８
…ダランドパターン、９…メタルチツプ、１０…
メタルキヤリア。
Figures 1a and b are a cross-sectional view and a plan view of an embodiment of the present invention, Figures 2a and b, and Figures 3 a and b are a cross-sectional view and a plan view showing two examples of conventional microwave circuit structures. It is a diagram. 1...Protrusion of metal carrier, 2...Dielectric substrate,
3...Microwave semiconductor chip, 4...Bonding wire, 5...Microwave signal line, 6...DC
Power supply or control signal line, 7...Through hole, 8
...Daland pattern, 9...Metal chip, 10...
metal carrier.
Claims (1)
基板とをマウントするメタルキヤリアと、該メタ
ルキヤリアの上面に設けられ前記マイクロ波用半
導体チツプの厚さより高さが低い凸部と、該凸部
に前記マイクロ波用半導体チツプのグランドを接
続するボンデイングワイヤとを備えることを特徴
とするマイクロ波回路の構造。 a metal carrier on which a microwave semiconductor chip and a dielectric substrate with holes are mounted; a convex portion provided on the upper surface of the metal carrier and having a height lower than the thickness of the microwave semiconductor chip; A structure of a microwave circuit characterized by comprising a bonding wire that connects the ground of a microwave semiconductor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8353188U JPH025903U (en) | 1988-06-23 | 1988-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8353188U JPH025903U (en) | 1988-06-23 | 1988-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH025903U true JPH025903U (en) | 1990-01-16 |
Family
ID=31308244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8353188U Pending JPH025903U (en) | 1988-06-23 | 1988-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH025903U (en) |
-
1988
- 1988-06-23 JP JP8353188U patent/JPH025903U/ja active Pending