JPH0258853A - 厚膜集積回路およびその製造方法 - Google Patents
厚膜集積回路およびその製造方法Info
- Publication number
- JPH0258853A JPH0258853A JP21034488A JP21034488A JPH0258853A JP H0258853 A JPH0258853 A JP H0258853A JP 21034488 A JP21034488 A JP 21034488A JP 21034488 A JP21034488 A JP 21034488A JP H0258853 A JPH0258853 A JP H0258853A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- thick film
- film
- resist layer
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000004020 conductor Substances 0.000 claims abstract description 130
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims description 32
- 238000007747 plating Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 25
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 18
- 229910052763 palladium Inorganic materials 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 8
- 230000006866 deterioration Effects 0.000 abstract description 7
- 238000003466 welding Methods 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 239000007767 bonding agent Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 26
- 238000009792 diffusion process Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21034488A JPH0258853A (ja) | 1988-08-24 | 1988-08-24 | 厚膜集積回路およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21034488A JPH0258853A (ja) | 1988-08-24 | 1988-08-24 | 厚膜集積回路およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0258853A true JPH0258853A (ja) | 1990-02-28 |
| JPH0480539B2 JPH0480539B2 (enrdf_load_stackoverflow) | 1992-12-18 |
Family
ID=16587850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21034488A Granted JPH0258853A (ja) | 1988-08-24 | 1988-08-24 | 厚膜集積回路およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0258853A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5907488A (en) * | 1990-02-14 | 1999-05-25 | Hitachi, Ltd. | Method of evaluating easiness of works and processings performed on articles and evaluation apparatus |
-
1988
- 1988-08-24 JP JP21034488A patent/JPH0258853A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5907488A (en) * | 1990-02-14 | 1999-05-25 | Hitachi, Ltd. | Method of evaluating easiness of works and processings performed on articles and evaluation apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0480539B2 (enrdf_load_stackoverflow) | 1992-12-18 |
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