JPH0256434B2 - - Google Patents
Info
- Publication number
- JPH0256434B2 JPH0256434B2 JP62270265A JP27026587A JPH0256434B2 JP H0256434 B2 JPH0256434 B2 JP H0256434B2 JP 62270265 A JP62270265 A JP 62270265A JP 27026587 A JP27026587 A JP 27026587A JP H0256434 B2 JPH0256434 B2 JP H0256434B2
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- tank
- plating
- plating solution
- diaphragm tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27026587A JPH01116094A (ja) | 1987-10-28 | 1987-10-28 | 隔膜鍍金法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27026587A JPH01116094A (ja) | 1987-10-28 | 1987-10-28 | 隔膜鍍金法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01116094A JPH01116094A (ja) | 1989-05-09 |
| JPH0256434B2 true JPH0256434B2 (enExample) | 1990-11-30 |
Family
ID=17483842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27026587A Granted JPH01116094A (ja) | 1987-10-28 | 1987-10-28 | 隔膜鍍金法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01116094A (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7022211B2 (en) | 2000-01-31 | 2006-04-04 | Ebara Corporation | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer |
| WO2001068952A1 (en) * | 2000-03-17 | 2001-09-20 | Ebara Corporation | Method and apparatus for electroplating |
| DE502005007138D1 (de) * | 2005-04-26 | 2009-06-04 | Atotech Deutschland Gmbh | Alkalisches Galvanikbad mit einer Filtrationsmembran |
| JP5257919B2 (ja) * | 2007-05-08 | 2013-08-07 | 株式会社 大昌電子 | めっき装置 |
| US9421617B2 (en) | 2011-06-22 | 2016-08-23 | Tel Nexx, Inc. | Substrate holder |
| JP5651737B2 (ja) * | 2013-06-03 | 2015-01-14 | 株式会社ムラタ | ニッケルめっきのためのめっき装置 |
| CN106435695A (zh) * | 2016-08-24 | 2017-02-22 | 谢彪 | 电镀设备及电镀方法 |
-
1987
- 1987-10-28 JP JP27026587A patent/JPH01116094A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01116094A (ja) | 1989-05-09 |
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