JPH025552Y2 - - Google Patents
Info
- Publication number
- JPH025552Y2 JPH025552Y2 JP7256081U JP7256081U JPH025552Y2 JP H025552 Y2 JPH025552 Y2 JP H025552Y2 JP 7256081 U JP7256081 U JP 7256081U JP 7256081 U JP7256081 U JP 7256081U JP H025552 Y2 JPH025552 Y2 JP H025552Y2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- conductive film
- chip component
- conductive
- figures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 description 24
- 230000001070 adhesive effect Effects 0.000 description 24
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 241000219122 Cucurbita Species 0.000 description 1
- 235000009852 Cucurbita pepo Nutrition 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7256081U JPH025552Y2 (US07754267-20100713-C00017.png) | 1981-05-21 | 1981-05-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7256081U JPH025552Y2 (US07754267-20100713-C00017.png) | 1981-05-21 | 1981-05-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57186070U JPS57186070U (US07754267-20100713-C00017.png) | 1982-11-26 |
JPH025552Y2 true JPH025552Y2 (US07754267-20100713-C00017.png) | 1990-02-09 |
Family
ID=29868345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7256081U Expired JPH025552Y2 (US07754267-20100713-C00017.png) | 1981-05-21 | 1981-05-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH025552Y2 (US07754267-20100713-C00017.png) |
-
1981
- 1981-05-21 JP JP7256081U patent/JPH025552Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS57186070U (US07754267-20100713-C00017.png) | 1982-11-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH025552Y2 (US07754267-20100713-C00017.png) | ||
US4273803A (en) | Process for covering or coating electrical components | |
JPS6038292Y2 (ja) | プリント基板 | |
JPS5882555A (ja) | 2つ以上の集積回路を収納するボツクスの製造方法 | |
JPS6214497A (ja) | 印刷配線板の製造方法 | |
JPS6120734Y2 (US07754267-20100713-C00017.png) | ||
JPS6339969Y2 (US07754267-20100713-C00017.png) | ||
JPH0225276Y2 (US07754267-20100713-C00017.png) | ||
JPS6120792Y2 (US07754267-20100713-C00017.png) | ||
JPS5824459Y2 (ja) | 電気部品装着基板 | |
JP2002374060A (ja) | 電子回路板 | |
JPS5843803Y2 (ja) | プリント配線基板の支持装置 | |
JPS5940787Y2 (ja) | 電子部品接続用の半田電極構造 | |
JP2595947B2 (ja) | 可塑性樹脂コーテイング用icパツケージ | |
JPH0625006Y2 (ja) | 回路基板 | |
JPH0230921Y2 (US07754267-20100713-C00017.png) | ||
JPH06314873A (ja) | プリント配線板 | |
JPS5849659Y2 (ja) | プリント配線基板 | |
JPS5844602Y2 (ja) | プリント配線基板 | |
JPH0525768U (ja) | フラツクスのすいあがり防止構造 | |
JPH0214194Y2 (US07754267-20100713-C00017.png) | ||
JPH0749826Y2 (ja) | チップ部品の半田付構造 | |
JPS6339116B2 (US07754267-20100713-C00017.png) | ||
JPH09162530A (ja) | フロー半田付け対応基板 | |
JPS6086892A (ja) | 回路基板 |