JPH0254787B2 - - Google Patents
Info
- Publication number
- JPH0254787B2 JPH0254787B2 JP59028097A JP2809784A JPH0254787B2 JP H0254787 B2 JPH0254787 B2 JP H0254787B2 JP 59028097 A JP59028097 A JP 59028097A JP 2809784 A JP2809784 A JP 2809784A JP H0254787 B2 JPH0254787 B2 JP H0254787B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- electrode
- head
- electrodes
- resistors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012212 insulator Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は、サーマルヘツドに関するもので、
たとえばワードプロセツサに用いられる。[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to a thermal head,
For example, it is used in word processors.
ワードプロセツサに用いられるサーマルヘツ
ド、（thermal head）は、第１図に示すように構
成されている。ガラス基板１１上に絶縁性のアン
ダーコート１２を介して、最小単位を構成する抵
抗体１３ａ，１３ｂ，１３ｃ…が縦列され、各抵
抗体１３ａ，１３ｂ，１３ｃ…には、それぞれ入
力電極１４ａ，１４ｂ，１４ｃ…と出力電極１５
ａ，１５ｂ，１５ｃ…が接続されている。そし
て、抵抗体及び電極の上面には、ガラス材による
オーバーコート１６が施されている。
A thermal head used in a word processor is constructed as shown in FIG. Resistors 13a, 13b, 13c, . , 14c... and the output electrode 15
a, 15b, 15c... are connected. An overcoat 16 made of glass material is applied to the upper surfaces of the resistor and the electrodes.
上記サーマルヘツドは、その横方向走査の途中
において、文字又はパターン信号にて選択された
抵抗体に直流電圧が印加されその抵抗体が発熱す
ることにより、感熱シート１７を発熱することに
より文字又はパターンを印刷することができる。
今、抵抗体１３ａが一定期間発熱すると印刷用紙
には横線が印刷され、抵抗１３ａ，１３ｂ，１３
ｃ…が同時に瞬間的に発熱すると縦線が印刷され
る。 During the horizontal scanning, the thermal head applies a DC voltage to a resistor selected by a character or pattern signal, and the resistor generates heat, which generates heat in the heat-sensitive sheet 17, thereby creating a character or pattern. can be printed.
Now, when the resistor 13a generates heat for a certain period of time, a horizontal line is printed on the printing paper, and the resistors 13a, 13b, 13
When c... simultaneously instantaneously generates heat, a vertical line is printed.
上記従来のサーマルヘツドによると、抵抗体の
入力電極及び出力電極を、アンダーコート１２上
に平面的に設けた構造である。そして、この入力
電極と出力電極に跨つて抵抗体を形成する方法で
ある。
According to the conventional thermal head described above, the input electrode and the output electrode of the resistor are provided on the undercoat 12 in a planar manner. In this method, a resistor is formed across the input electrode and the output electrode.
従つて、第１図からもわかるように、従来のも
のは、抵抗体部分のオーバーコート１６が盛り上
がつた形となる。このため、抵抗体のエツジ部分
と中央部分とでは、感熱シート１７に対する一様
な熱伝達を得られず、輪郭が不鮮明となる問題が
ある。 Therefore, as can be seen from FIG. 1, in the conventional type, the overcoat 16 of the resistor portion has a raised shape. For this reason, uniform heat transfer to the heat-sensitive sheet 17 cannot be achieved between the edge portions and the center portion of the resistor, resulting in a problem that the outline becomes unclear.
更に、描画ラインをきめ細かくするのに、抵抗
体の密度を上げると、その電極数も同一平面上で
抵抗体の２倍の数となり、高度な製造技術が要求
され、製造歩留りが低下する。また入力電極、出
力電極を同一平面上に形成するので、密度を上げ
た場合、電極の引き出し方向を考慮した配線の自
由度が著るしく低下する。 Furthermore, if the density of the resistor is increased to make drawing lines finer, the number of electrodes will be twice as many as the number of resistors on the same plane, requiring advanced manufacturing technology and lowering the manufacturing yield. Furthermore, since the input electrodes and output electrodes are formed on the same plane, when the density is increased, the degree of freedom of wiring in consideration of the direction in which the electrodes are drawn is significantly reduced.
この発明に上記した事情に鑑みてなされたもの
で、抵抗体の密度を容易に向上できる簡素化され
たものとして得、よつて製造も簡易で歩留りも良
く、さらには電極配線も自由度があり、特にパタ
ーン印刷を行なう場合有効で、かつ描画の輪郭も
鮮明とし得るサーマルヘツドを提供することを目
的とする。
This invention has been made in view of the above-mentioned circumstances, and it is possible to obtain a simplified resistor that can easily increase the density of the resistor, and is therefore easy to manufacture and has a good yield, and furthermore, has a high degree of freedom in electrode wiring. It is an object of the present invention to provide a thermal head which is particularly effective in pattern printing and which can provide clear contours of the drawing.
以下この発明の実施例を図面を参照して説明す
る。
Embodiments of the present invention will be described below with reference to the drawings.
第２図はこの発明のヘツドを製造する基本工程
を説明するための図である。ガラスあるいはセラ
ミツクによる絶縁基板２１の一方の面には、銅箔
等による下層電極２２が印刷又は蒸着等の方法で
着膜される。次にこの下層電極２２の上面には、
フオトレジスト等による絶縁層２３がコーテイン
グにより形成される。 FIG. 2 is a diagram for explaining the basic steps for manufacturing the head of the present invention. A lower electrode 22 made of copper foil or the like is deposited on one surface of an insulating substrate 21 made of glass or ceramic by a method such as printing or vapor deposition. Next, on the upper surface of this lower layer electrode 22,
An insulating layer 23 made of photoresist or the like is formed by coating.
次の工程では、絶縁層２３の上面に抵抗体パタ
ーンを得るためのマスク２４が配設され、マスク
２４を介して光による露光が行なわれる。これに
よつて、現像処理を行なうと、絶縁層２３の露光
された部分は硬化して残り、他の部分、つまり抵
抗体パターン部分は除去される。従つて、このパ
ターン部分に、抵抗体２５ａ，２５ｂ，２５ｃ…
を印刷又はデポジシヨンすることで、抵抗体２５
ａ，２５ｂ，２５ｃ…は、絶縁層で分離されたパ
ターンとなる。次に抵抗体２５ａ，２５ｂ，２５
ｃ…及び絶縁層２３で形成された同一平面上に、
導体層２６例えば10〜20μｍの厚みの良導体によ
るフオイルコートが被せられる。 In the next step, a mask 24 for obtaining a resistor pattern is provided on the upper surface of the insulating layer 23, and exposure to light is performed through the mask 24. As a result, when the development process is performed, the exposed portion of the insulating layer 23 is hardened and remains, and the other portion, that is, the resistor pattern portion is removed. Therefore, resistors 25a, 25b, 25c, . . . are placed in this pattern portion.
By printing or depositing the resistor 25
a, 25b, 25c... are patterns separated by an insulating layer. Next, resistors 25a, 25b, 25
c... and on the same plane formed by the insulating layer 23,
The conductor layer 26 is covered with a foil coat of a good conductor having a thickness of 10 to 20 μm, for example.
この発明のヘツドは上記のような製造工程で作
られる。この発明によると複数の抵抗体の間に絶
縁体が埋設された形となり、抵抗体の上面ととも
に平坦面を形成する。そして平坦面上に上層の共
通電極が形成される。このために感熱シート側が
平坦な面となり、緻密なパターンの転写を行う場
合、輪郭を鮮明に得られる。 The head of this invention is manufactured by the manufacturing process described above. According to this invention, an insulator is embedded between a plurality of resistors, forming a flat surface together with the upper surface of the resistors. Then, an upper common electrode is formed on the flat surface. For this reason, the heat-sensitive sheet side becomes a flat surface, and when transferring a precise pattern, a clear outline can be obtained.
この発明によると、抵抗体に対する入力、出力
電極を下層側と上面側に分離する構造としてい
る。このため、従来の如く同一面上に入力、出力
電極を設けるのに比べて、この発明では同一面上
に入力電極又は出力電極の何れか一方を設ければ
良く面積にゆとりができる。よつて、抵抗体の密
度を上げて、緻密な描画を得るのに好適となる。
また、予じめ定められたようなパターンを同時印
刷するヘツドとして有効である。さらに電極の配
線自由度も向上する。 According to this invention, the structure is such that the input and output electrodes for the resistor are separated into a lower layer side and an upper surface side. Therefore, compared to the conventional method in which the input and output electrodes are provided on the same surface, in the present invention, it is sufficient to provide either the input electrode or the output electrode on the same surface, and the area can be increased. Therefore, it is suitable for increasing the density of the resistor and obtaining precise drawing.
It is also effective as a head for simultaneously printing predetermined patterns. Furthermore, the degree of freedom in wiring the electrodes is also improved.
次に、この発明によれば、絶縁層２３に形成し
たパターンホールに抵抗体を印刷又は堆積によつ
て埋設し、その上面に平坦な導体層２６を形成し
ている。したがつて、従来の如く、ヘツドの印刷
面に凹凸部が生じない。よつて、感熱シートに対
する熱伝導効率が抵抗体の中央部及びエツジ部で
一様となり、印刷描画の輪郭が極めて鮮明とな
る。これによつて、先の効果とともに、緻密で鮮
明な描画を得るのに有効である。 Next, according to the present invention, a resistor is buried in the pattern hole formed in the insulating layer 23 by printing or deposition, and a flat conductor layer 26 is formed on the upper surface thereof. Therefore, unevenness does not occur on the printing surface of the head, unlike in the prior art. Therefore, the heat conduction efficiency to the heat-sensitive sheet becomes uniform in the center and edge portions of the resistor, and the outline of the printed image becomes extremely clear. This, in addition to the above-mentioned effect, is effective in obtaining detailed and clear drawings.
第３図は、この発明を適用したヘツド３０の一
例である。この実施例の場合、予じめ印刷パター
ンが決まつている。たとえば巻売機に用いて有効
である。この実施例は、抵抗体３１ａ，３１ｂ，
３１ｃ…のパターンを「日本」とした例であり、
下層電極２２と上面電極となる導体層２６間に電
圧を印加すれば、同時に全抵抗体が発熱し、パタ
ーンの同時転写を可能とする。この場合、下層電
極、上面電極はそれぞれ共通電極となる。この実
施例の場合、表面が全体的に平坦であり、描画の
輪郭が鮮明となる。また、印刷速度は従来のもの
にくらべて格段と向上し得るものである。 FIG. 3 shows an example of a head 30 to which the present invention is applied. In this embodiment, the printing pattern is determined in advance. For example, it is effective when used in a vending machine. In this embodiment, resistors 31a, 31b,
This is an example where the pattern of 31c... is set to "Japan",
When a voltage is applied between the lower electrode 22 and the conductor layer 26 serving as the upper electrode, all the resistors generate heat at the same time, making it possible to transfer patterns at the same time. In this case, the lower layer electrode and the upper surface electrode each serve as a common electrode. In this embodiment, the surface is flat as a whole, and the outline of the drawing is clear. Furthermore, the printing speed can be significantly improved compared to conventional methods.
第４図は、この発明を適用したヘツド４０の例
である。このヘツド４０は、下層電極２２を、各
抵抗体４１ａ，４１ｂ，４１ｃ…に対応させてエ
ツチング又はパターン印刷により独立した電極２
２ａ，２２ｂ，２２ｃ…として形成したものであ
る。そして、上面の導体層２６を共通電極として
いる。このヘツド４０は、横方向に走査移動され
る途中において、電極２２ａ，２２ｂ，２２ｃ…
に選択的に電圧が印加されることによつて、印刷
パターンを形成していくことができる。この実施
例の場合も、抵抗体の密度を上げることができ、
表面が平坦となるので描画の輪郭が鮮明となる。 FIG. 4 shows an example of a head 40 to which the present invention is applied. This head 40 is made by etching or pattern printing the lower layer electrode 22 so as to correspond to each resistor 41a, 41b, 41c, . . .
2a, 22b, 22c... The upper conductor layer 26 is used as a common electrode. While the head 40 is being scanned in the horizontal direction, the electrodes 22a, 22b, 22c, . . .
A printed pattern can be formed by selectively applying a voltage to. In this embodiment as well, the density of the resistor can be increased,
Since the surface is flat, the outline of the drawing becomes clearer.
第５図は、この発明を適用したヘツド５０の例
であり、フレーム単位で各種のパターン印刷が行
なえるようにし、融通性を持たせたものである。
即ち、この実施例の場合、下層電極２２を例えば
行を形成するライン電極２２ａ，２２ｂ，２２ｃ
…として形成し、導体層２６を、列を形成するラ
イン電極２６ａ，２６ｂ，２６ｃ…として形成す
るものである。そして、各行列ラインの交差部に
抵抗体をそれぞれ配置したものである。なお、上
面のライン電極２６ａ，２６ｂ，２６ｃ…間に
は、絶縁体がコーテイングされ、表面が平滑にさ
れている。この実施例によれば、下層側と上面側
の任意の電極に選択的に電圧を印加することによ
つて、任意パターンを印刷し、第３図で示したよ
うなヘツドと同様な使用が可能であるとともに、
第４図で示したヘツドと同様な使用も可能であ
る。そして、その印刷速度も従来に比べて格段と
向上するものである。 FIG. 5 shows an example of a head 50 to which the present invention is applied, and is designed to be flexible by being able to print various patterns on a frame-by-frame basis.
That is, in the case of this embodiment, the lower layer electrode 22 is formed by, for example, line electrodes 22a, 22b, 22c forming rows.
The conductor layer 26 is formed as line electrodes 26a, 26b, 26c, . . . forming columns. A resistor is arranged at each intersection of each matrix line. Note that an insulator is coated between the line electrodes 26a, 26b, 26c, . . . on the upper surface to make the surface smooth. According to this embodiment, by selectively applying a voltage to arbitrary electrodes on the lower layer side and the upper surface side, an arbitrary pattern can be printed and the head can be used in the same way as the head shown in Fig. 3. In addition,
A similar use to the head shown in FIG. 4 is also possible. Moreover, the printing speed is also significantly improved compared to the conventional method.
上記したように、この発明によれば、電極間に
抵抗体を挾む構造とすることによつて、従来の如
く凹凸がなく輪郭の鮮明な印刷描画を得ることが
できる。また、電極配線面積に余裕が生じ、製
造、設計が容易となり、歩留りの向上、信頼性の
向上、密度の向上が得られ、高速印刷を可能にす
るなど多くの利点を備える。さらに、電極配線に
自由度があり、使用目的に応じて便利な位置に端
子を導出できる。 As described above, according to the present invention, by using a structure in which a resistor is sandwiched between electrodes, it is possible to obtain a print with a clear outline without unevenness unlike the conventional method. In addition, there are many advantages such as an extra electrode wiring area, ease of manufacturing and design, improved yield, improved reliability, improved density, and enable high-speed printing. Furthermore, there is a degree of freedom in electrode wiring, and the terminals can be led out to convenient positions depending on the purpose of use.
第１図ａ，ｂはそれぞれ従来のサーマルヘツド
を説明するための平面図、断面図、第２図はこの
発明のヘツドの構造工程を説明するための工程説
明図、第３図はこの発明の一実施例を示す斜視図
及び断面図、第４図はこの発明の他の実施例を示
す斜視図及び断面図、第５図はこの発明の更に他
の実施例における電極構造を示す平面図である。
２１……絶縁基板、２２……下層電極、２３…
…絶縁層、２５ａ，２５ｂ，２５ｃ……抵抗体、
２６……導体層。
Figures 1a and b are a plan view and a sectional view, respectively, for explaining a conventional thermal head, Figure 2 is a process explanatory diagram for explaining the structural steps of the head of the present invention, and Figure 3 is a diagram for explaining the structural steps of the head of the present invention. FIG. 4 is a perspective view and a sectional view showing one embodiment of the invention, FIG. 4 is a perspective view and a sectional view showing another embodiment of the invention, and FIG. 5 is a plan view showing an electrode structure in still another embodiment of the invention. be. 21... Insulating substrate, 22... Lower layer electrode, 23...
...Insulating layer, 25a, 25b, 25c...Resistor,
26...Conductor layer.
Claims (1)
と、この複数電極上にそれぞれ対応して形成配列
された抵抗体と、 この複数の抵抗体の間に埋設された形となり、
前記抵抗体の上面とともに平坦面を形成する絶縁
体と、 この絶縁体と前記抵抗体とで形成された平坦面
上に形成される上層の共通電極とを具備したこと
を特徴とするサーマルヘツド。[Scope of Claims] 1. A plurality of lower electrodes provided on the upper surface of an insulating substrate, resistors formed and arranged in correspondence with each other on the plurality of electrodes, and a shape embedded between the plurality of resistors. Then,
A thermal head comprising: an insulator forming a flat surface together with the upper surface of the resistor; and an upper common electrode formed on the flat surface formed by the insulator and the resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2809784A JPS60172553A (en) | 1984-02-17 | 1984-02-17 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2809784A JPS60172553A (en) | 1984-02-17 | 1984-02-17 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60172553A JPS60172553A (en) | 1985-09-06 |
| JPH0254787B2 true JPH0254787B2 (en) | 1990-11-22 |
Family
ID=12239284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2809784A Granted JPS60172553A (en) | 1984-02-17 | 1984-02-17 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60172553A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494356U (en) * | 1972-04-13 | 1974-01-16 | ||
| JPS5630186A (en) * | 1979-08-20 | 1981-03-26 | Ricoh Kk | Combined characters indication*control system in indication control circuit |
| JPS5644678A (en) * | 1979-09-21 | 1981-04-23 | Hitachi Ltd | Thermo-sensitive recording head |
| JPS56133184A (en) * | 1980-03-21 | 1981-10-19 | Toshiba Corp | Two-dimensional heat-sensitive recording head |
-
1984
- 1984-02-17 JP JP2809784A patent/JPS60172553A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494356U (en) * | 1972-04-13 | 1974-01-16 | ||
| JPS5630186A (en) * | 1979-08-20 | 1981-03-26 | Ricoh Kk | Combined characters indication*control system in indication control circuit |
| JPS5644678A (en) * | 1979-09-21 | 1981-04-23 | Hitachi Ltd | Thermo-sensitive recording head |
| JPS56133184A (en) * | 1980-03-21 | 1981-10-19 | Toshiba Corp | Two-dimensional heat-sensitive recording head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60172553A (en) | 1985-09-06 |
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