JPS6248570A - Manufacture of thermal head - Google Patents
Manufacture of thermal headInfo
- Publication number
- JPS6248570A JPS6248570A JP60187214A JP18721485A JPS6248570A JP S6248570 A JPS6248570 A JP S6248570A JP 60187214 A JP60187214 A JP 60187214A JP 18721485 A JP18721485 A JP 18721485A JP S6248570 A JPS6248570 A JP S6248570A
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- etching
- conductor
- heating element
- heating elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 238000007639 printing Methods 0.000 claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 11
- 238000000206 photolithography Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 7
- 238000005338 heat storage Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 14
- 238000005530 etching Methods 0.000 abstract description 12
- 239000010409 thin film Substances 0.000 abstract description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 abstract description 6
- 239000007787 solid Substances 0.000 abstract description 3
- 239000000919 ceramic Substances 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Landscapes
- Electronic Switches (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明はサーマルヘッドに係り、特に抵抗値精度向上、
印画品質向上に好適な厚膜サーマルヘッドの製造方法に
関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a thermal head, and in particular, to improvement of resistance value accuracy,
The present invention relates to a method of manufacturing a thick film thermal head suitable for improving printing quality.
従来、厚膜サーマルヘッドの発熱体形成方法はスクリー
ン印刷が公知となっており、印刷、焼成時に発生する「
だれ」のため、抵抗値ばらつきが大きい。また、表面も
球面または円筒面状であり印画ドツト間の隙き間発生の
原因となっている。この対策として例えば、特公昭５７
−１８５０６号公報に示されるように、発、熱体のネガ
パターンをレジストで形成し、凹部に発熱体用抵抗ペー
ストを埋め込む方法が用いられている。しかし、この方
法でもペースト焼成時の「だれ」は発生し、抵抗値精度
も発熱体表面平担度も薄膜型ヘッドとの差はまだ大きい
。Conventionally, screen printing has been a well-known method for forming the heating element of thick-film thermal heads, and the "
Because of this, there is a large variation in resistance values. Furthermore, the surface is spherical or cylindrical, which causes gaps between printing dots. As a countermeasure for this, for example,
As shown in Japanese Patent No. 18506, a method is used in which a negative pattern of a heating element is formed with a resist and a resistance paste for the heating element is embedded in the recessed portion. However, even with this method, "sagging" occurs during paste firing, and there is still a large difference between the resistance value accuracy and the heating element surface flatness compared to the thin film type head.
本発明の目的は、薄膜型サーマルヘッドと同程度の抵抗
値精度及び印画品質を有する厚膜型サーマルヘッドを提
供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a thick-film thermal head that has resistance accuracy and printing quality comparable to that of a thin-film thermal head.
上記目的を達成するため、本発明においては厚膜型サー
マルヘッドの抵抗値ばらつき、印画品質に最も深く関係
している発熱体形状に着目し、形状安定化により品質同
士を計ったものである。In order to achieve the above object, the present invention focuses on the shape of the heating element, which is most closely related to the variation in resistance value of a thick film thermal head and the printing quality, and measures the quality by stabilizing the shape.
一般に印刷のみにより形成した厚膜パターンは印刷だれ
か片側１０μｍ−３０μｍ程生じ６゜この「だれ巾」は
一本の棒状の発熱体の中でも、場所により異なるγこめ
、抵抗値ばらつきの原因となる。また、この「だれ」の
ため、パターン巾８０μｍ −３００μｍ程の発熱体で
は断面形状がかまぼこ状となる。このため、印画の際に
発熱体の中心部が特に強く感熱紙と密着し、印画ドツト
は中心からだ円状に広がるアミ点状となる。以上のよう
な厚膜型ヘッドの短所を無くすためには発熱体のパター
ンエツジを鮮明に、また、発熱体の断面形状を矩形にす
る必要があり、本発明では発熱体形成にホトリソ法を適
用し、エツチングにより形成するものである。In general, thick film patterns formed only by printing have a thickness of about 10 μm to 30 μm on one side due to printing.6 This "sag width" causes gamma shrinkage and resistance value variations that vary depending on the location even in a single rod-shaped heating element. . Moreover, due to this "sag", the cross-sectional shape of a heating element having a pattern width of about 80 μm to 300 μm becomes semicylindrical. Therefore, during printing, the center of the heating element is in particularly strong contact with the thermal paper, and the printed dots become dots that spread out in an elliptical shape from the center. In order to eliminate the above-mentioned disadvantages of the thick-film type head, it is necessary to make the pattern edges of the heating element sharp and the cross-sectional shape of the heating element rectangular.In the present invention, photolithography is applied to form the heating element. It is formed by etching.
以下、本発明の一実施例を図面を用いて説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第４図に従来構造の厚膜サーマルヘッドの断面図を示す
。印刷による発熱体形成のためパターンだれか生じ、エ
ツジ不鮮明となる。第１図〜第５図に本発明によるサー
マルヘクトの断面図をプロセス別に示す。第１図はセラ
ミック基板上に蓄熱グレーズ層、耐エツチング 層、導
体を形成した状態の断面図である。通常厚膜サーマルヘ
ッドにおいては耐エツチング 層というのは存在しない
が、本実施例においては発熱体のエツチング液としてフ
ッ酸を用いたため、グレーズ層保護の目的で、耐エツチ
ング 層を設けた。尚、この耐エツチング層にはＴａ２
Ｏ，のスパッタリングによる薄膜を用いた。また、導体
の形成方法は印刷のみではなく、やはりホトリソ法を用
いた方が抵抗値精度の面で有利であった。第２図は発熱
体ベタ形成後レジスト形成まで行なった状態の断面図で
ある。レジスト形成部下の発熱体面は「だれ」の影響が
ない平担部である。また、耐フッ酸レジストとして本実
施例においては芳香族ビスアジド系フォトレジストを使
用した。第３図は本発明による完成ヘッドの断面図であ
る。第４図の従来ヘッドと比べ見かけ上の発熱体中は同
じであるが表面形状が大きく異なっている。FIG. 4 shows a sectional view of a conventional thick film thermal head. Because the heating element is formed by printing, a pattern is formed and the edges become unclear. 1 to 5 show cross-sectional views of thermal hects according to the present invention by process. FIG. 1 is a cross-sectional view of a state in which a heat storage glaze layer, an etching-resistant layer, and a conductor are formed on a ceramic substrate. Normally, thick-film thermal heads do not have an etching-resistant layer, but in this example, since hydrofluoric acid was used as the etching liquid for the heating element, an etching-resistant layer was provided for the purpose of protecting the glaze layer. Note that this etching-resistant layer contains Ta2.
A thin film formed by sputtering of O, was used. In addition, the method of forming the conductor is not limited to printing, but photolithography is also advantageous in terms of resistance accuracy. FIG. 2 is a cross-sectional view of the state in which the heating element has been formed in a solid state and the resist has been formed. The surface of the heating element under the resist formation is a flat portion that is not affected by "sag". Furthermore, in this example, an aromatic bisazide photoresist was used as the hydrofluoric acid-resistant resist. FIG. 3 is a cross-sectional view of a completed head according to the present invention. Compared to the conventional head shown in FIG. 4, the inside of the apparent heating element is the same, but the surface shape is significantly different.
さらに本実施例においては、導体形成もホトリソ法を用
い、導体ベタ印刷の際にベーストビヒクルの調整により
厚み２μｍで形成しているため、発熱体の厚み２０μｍ
に比べて十分薄く、発熱体の表面に段差を生じることな
く、平坦度が一層向上している。このため、より薄膜に
近い印画品質が得られる。Furthermore, in this example, the conductor was formed using the photolithography method, and was formed to a thickness of 2 μm by adjusting the base vehicle during solid printing of the conductor, so the thickness of the heating element was 20 μm.
It is sufficiently thinner than that of the heating element, and the flatness is further improved without creating any step on the surface of the heating element. Therefore, printing quality closer to that of a thin film can be obtained.
本発明によれば、発熱体のパターンエツジを鮮明に、ま
た、発熱体表面の平担化が可能となるため薄膜ヘッドに
ほぼ等しい印画品質が得られ、印画ドツトの間隙も小さ
くなる。５ ｄ Ｏｔ／ｒｒｍのヘッドの場合の印画ド
ツト間隙は、反射濃度Ｄ＝１のとき従来ヘッドは約５０
μｍであったのに対し、本発明のヘッドは２μｍ以下、
また反射濃度Ｄ＝０．５のとき、従来ヘッドは約１５０
μｍ本発明のヘッドは１０μｍ以下であった。According to the present invention, the pattern edges of the heating element can be made clear and the surface of the heating element can be flattened, so that printing quality almost equal to that of a thin film head can be obtained, and the gaps between printing dots can be reduced. The print dot gap for a head of 5 d Ot/rrm is approximately 50 for a conventional head when reflection density D=1.
In contrast, the head of the present invention has a diameter of 2 μm or less.
Also, when the reflection density D = 0.5, the conventional head has approximately 150
μm The head of the present invention had a diameter of 10 μm or less.
第１図は本発明の一実施例の導体まで形成した状態の厚
膜サーマルヘッドの断゛面図、第２図は本発明により発
熱体上にレジストまで形成した状態の厚膜サーマルヘッ
ドの断面図、第３図は本発明により完成した厚膜サーマ
ルヘッドの断面図、第４図は従来構造の厚膜サーマルヘ
ッド断面図である。
１・・・・・・基板、
２・・・・・・蓄熱グレーズ層、
５・・・・・・導体、
４・・・・・・発熱体、
５・・・・・・オーバーコート、
６・・・・・・耐エツチング層、
７・・・・・・レジスト。FIG. 1 is a cross-sectional view of a thick film thermal head in which a conductor is formed according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a thick film thermal head in which a resist is formed on a heating element according to the present invention. 3 are sectional views of a thick film thermal head completed according to the present invention, and FIG. 4 is a sectional view of a thick film thermal head having a conventional structure. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Thermal storage glaze layer, 5...Conductor, 4...Heating element, 5...Overcoat, 6 ...Etching resistant layer, 7...Resist.
Claims (1)
コートガラス等がペースト印刷により形成される厚膜サ
ーマルヘッドにおいて、発熱体のパターンニングにホト
リソ工程を用いたことを特徴とするサーマルヘッドの製
造方法。1. A thick film thermal head in which a heat storage glaze layer, a conductor, a heating element, an overcoat glass, etc. are formed on a substrate by paste printing, and a thermal head characterized in that a photolithography process is used for patterning the heating element. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60187214A JPS6248570A (en) | 1985-08-28 | 1985-08-28 | Manufacture of thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60187214A JPS6248570A (en) | 1985-08-28 | 1985-08-28 | Manufacture of thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6248570A true JPS6248570A (en) | 1987-03-03 |
Family
ID=16202070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60187214A Pending JPS6248570A (en) | 1985-08-28 | 1985-08-28 | Manufacture of thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6248570A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01123756A (en) * | 1987-11-09 | 1989-05-16 | Fuji Xerox Co Ltd | Thick film type thermal head |
-
1985
- 1985-08-28 JP JP60187214A patent/JPS6248570A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01123756A (en) * | 1987-11-09 | 1989-05-16 | Fuji Xerox Co Ltd | Thick film type thermal head |
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