JPS62105645A - Structure of thermal head - Google Patents
Structure of thermal headInfo
- Publication number
- JPS62105645A JPS62105645A JP24576785A JP24576785A JPS62105645A JP S62105645 A JPS62105645 A JP S62105645A JP 24576785 A JP24576785 A JP 24576785A JP 24576785 A JP24576785 A JP 24576785A JP S62105645 A JPS62105645 A JP S62105645A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- heating resistor
- heating
- storage layer
- heat storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 49
- 238000005338 heat storage Methods 0.000 claims abstract description 14
- 239000011521 glass Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 229910001925 ruthenium oxide Inorganic materials 0.000 claims abstract description 7
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 6
- 239000007787 solid Substances 0.000 abstract description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 10
- 239000010408 film Substances 0.000 description 10
- 238000007639 printing Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明はサーマルプリンタにおけるサーマルヘッドの構
造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to the structure of a thermal head in a thermal printer.
一般的に、サーマルプリンタは第４図に示すようにネオ
プレンゴム等によって成形されたプラテンエとサーマル
ヘッド２とのＭに、熱エネルギーにより化学変化を起こ
して発色する層を有する感熱紙３を一定圧力で挟み込み
、感熱紙３を送りながら、入力信号によって、その感熱
紙３にドー２ト構成で所望の文字や図形を得るものとな
っている。Generally, as shown in Fig. 4, in a thermal printer, thermal paper 3, which has a layer that develops color by chemical change caused by thermal energy, is placed between a platen made of neoprene rubber or the like and a thermal head 2 under constant pressure. While feeding the thermal paper 3, a desired character or figure is formed on the thermal paper 3 in a dot configuration according to an input signal.
サーマルヘッド２は、放熱特性の良好なアルミナ等によ
って成形されているベース基板４１：に、熱伝導特性の
低いガラス環装の蓄熱層５を形成し、その蓄熱層５．１
：に発熱抵抗体６及び金、銀等の貴金属製のリード電極
７・７を形成し、このリード電極７・７に一定電圧を通
電することによって１発熱抵抗体６にジュール熱を発生
させるようになっている。又１図中８は、感熱紙３０走
行による摩擦から発熱抵抗体６及びリード電極７・７の
一部を保護するための、ガラス環装による耐摩耗層であ
る。The thermal head 2 includes a base substrate 41 made of alumina or the like with good heat dissipation properties, and a glass-ringed heat storage layer 5 with low heat conduction properties formed thereon.
: A heating resistor 6 and lead electrodes 7 made of noble metal such as gold or silver are formed in the heating resistor 6, and by applying a constant voltage to the lead electrodes 7, 7, Joule heat is generated in the heating resistor 6. It has become. Reference numeral 8 in FIG. 1 is a wear-resistant layer made of a glass ring for protecting the heating resistor 6 and a portion of the lead electrodes 7 from friction caused by the running of the thermal paper 30.
このサーマルヘッド２の製造については、印刷、焼成に
よる厚膜技術、又、スパッタ蒸着による膜形成、フォト
リソエツチングによる薄膜技術、更に、その両者の混合
技術によって確立され、材料も前記した各々の製法によ
り決定されたものとなっている。The manufacturing of this thermal head 2 has been established using thick film technology by printing and baking, film formation by sputter deposition, thin film technology by photolithography etching, and a mixture technology of both, and the materials are also manufactured by each of the above-mentioned manufacturing methods. It has been decided.
ここで、サーマルヘッド２の更に具体的な構造及びその
製造過程を第５図以降をもって説明すると、アルミナ等
のベース基板４上に熱伝導特性の低いガラス環装の蓄熱
層５を形成し、その蓄熱層５とに酸化ルテニウム等から
成る発熱抵抗体６・６・・・を所定間隔Ｇを隔てて形成
し、その各々の発熱抵抗体６・６・・・と連接する金、
銀等の貴金属製のリード電極７・７・・・が構成し、前
記発熱抵抗体６・６・・・とリード電極７・７・・・の
一部を感熱紙３・′Ａ
との摩擦から保護するガラス環装お耐摩耗層８が形成さ
れる。Here, the more specific structure of the thermal head 2 and its manufacturing process will be explained with reference to FIG. Heating resistors 6 made of ruthenium oxide or the like are formed on the heat storage layer 5 at a predetermined interval G, and gold is connected to each of the heating resistors 6, 6...
It consists of lead electrodes 7, 7, etc. made of noble metal such as silver, and a part of the heating resistors 6, 6, and lead electrodes 7, 7, etc. are formed by friction with the thermal paper 3'A. A glass cladding and a wear-resistant layer 8 are formed to protect the wearer from damage.
又、前記した蓄熱層５の厚さＳはサーマルヘッド２の熱
効率から決定され、一般的には７０〜１５０ルｍであり
１発熱抵抗体６自体の厚さＴとの相関大で一般的に、発
熱抵抗体６自体の厚さＴが５ｉＬｍに対し、所定間隔Ｇ
は４０μｍ程度どされている。Further, the thickness S of the heat storage layer 5 described above is determined from the thermal efficiency of the thermal head 2, and is generally 70 to 150 lm, and has a large correlation with the thickness T of the heating resistor 6 itself. , the thickness T of the heating resistor 6 itself is 5iLm, and the predetermined interval G
is set back by about 40 μm.
又、この発熱抵抗体６−６・・・の所定間隔Ｇは発熱体
膜ベタ形成後にフォトリソエツチング技術により形成さ
れるが、このエツチング工程を第８Ａ図乃至第８Ｃ図に
よって説明すると１発熱抵抗体６・６・・・を得るため
の発熱体膜６ａ上の所定位置に所望の形状を得るためエ
ツチング用保護膜であるレジスト９・９を配置し、第８
Ｂ図のようにエツチングを進行していくと、オーバーエ
ッチ状態が発生し、所望の間隔Ｇよりも幅の広いものし
か得られない。Further, the predetermined interval G between the heating resistors 6-6 is formed by photolithography after the heating element film is formed, and this etching process will be explained with reference to FIGS. 8A to 8C. Resists 9, 9, which are protective films for etching, are placed at predetermined positions on the heating element film 6a to obtain the desired shape, and
If the etching progresses as shown in Figure B, an over-etched state will occur, and only a gap wider than the desired gap G will be obtained.
又、この従来のサーマルヘッド２によれば１発熱抵抗体
６争６・・・間の間隔が４０用ｍもあるために、ベタ黒
印字時にそのギャップを消すまで印字パワーを」―げる
必要があり、熱効率が悪く、又、印字パワーを上げるこ
とによって印字画像は不鮮明なものとなり、印字品質が
低下してしまうという問題点があった。In addition, according to this conventional thermal head 2, there is a gap of 40 m between the heating resistors 6 and 6, so it is necessary to increase the printing power until the gap is erased when printing solid black. There are problems in that the thermal efficiency is poor, and when the printing power is increased, the printed image becomes unclear and the printing quality deteriorates.
本発明は、上記した従来技術の問題点に着目してなされ
たもので、かかる問題点を解消し、発熱抵抗体のファイ
ン化を容易なものとし、その発熱抵抗体間ギャップを小
さくすることができ、その分ローパワーで鮮明なベタ黒
印字を得ることができ、又、蓄熱層の厚さも薄くするこ
とができるサーマルへラドの構造を提供することを目的
とする。The present invention has been made by focusing on the problems of the prior art as described above, and it is possible to solve these problems, facilitate the miniaturization of heat generating resistors, and reduce the gap between the heat generating resistors. The purpose of the present invention is to provide a structure of a thermal heater which can obtain clear solid black printing with a correspondingly low power and can also reduce the thickness of a heat storage layer.
この目的を達成するために、本発明は、ベース基板上に
蓄熱層を介して第一発熱抵抗体を備え、その第一発熱抵
抗体上に、その第一発熱抵抗体よりもシート抵抗値の小
さい第二発熱抵抗体を積層してあることを特徴とする。In order to achieve this object, the present invention provides a first heating resistor on a base substrate via a heat storage layer, and has a sheet resistance value higher than that of the first heating resistor on the first heating resistor. It is characterized by a stack of small second heating resistors.
かかる構造とすることにより１発熱抵抗体のファイン化
を容易として、その発熱抵抗体間のギャップを従来に比
して小さくでき、ローパワーで鮮明なベタ黒印字を得、
又、蓄熱層の厚さも小さくすることができるのである。With this structure, it is easy to make each heating resistor finer, the gap between the heating resistors can be made smaller than before, and clear solid black printing can be achieved with low power.
Moreover, the thickness of the heat storage layer can also be reduced.
次に２本発明の実施の一例を第１図乃至第３Ｃ図を参照
して詳細に説明する。Next, an example of the implementation of the present invention will be described in detail with reference to FIGS. 1 to 3C.
図中１０は放熱特性の良好なアルミナ等によって成形さ
れたベース基板であり、このベース基板１０上には熱伝
導特性の低いガラス環装の蓄熱層１１が形成されている
。この蓄熱層１１」−には、酸化ルテニウムにガラスフ
リットを混合した厚膜抵抗材料で成形された第一発熱抵
抗体１２が形成され、その第一発熱抵抗体１ｚ上には、
その第一発熱抵抗体１２を覆うように第二発熱抵抗体１
３が積層されているもので、この第二発熱抵抗体１３の
シート抵抗値は第一発熱抵抗体１２よりも小さくされて
いる。このシート抵抗値は厚膜抵抗材料の酸化ルテニウ
ムとガラスフリットの配合比で決定され、酸化ルテニウ
ムが多ければ小さくなり、少なければ大きくなるものと
なっている。In the figure, reference numeral 10 denotes a base substrate made of alumina or the like having good heat dissipation characteristics, and on this base substrate 10 is formed a glass-ringed heat storage layer 11 having low heat conduction characteristics. A first heating resistor 12 formed of a thick film resistance material made of a mixture of ruthenium oxide and glass frit is formed on this heat storage layer 11'', and on the first heating resistor 1z,
A second heating resistor 1 is placed so as to cover the first heating resistor 12.
3 are laminated, and the sheet resistance value of the second heating resistor 13 is made smaller than that of the first heating resistor 12. This sheet resistance value is determined by the blending ratio of ruthenium oxide of the thick film resistance material and glass frit, and the more ruthenium oxide there is, the smaller it becomes, and the less ruthenium oxide, the larger it becomes.
又、図中１４・１４は金、銀等の責金属により成形され
たリード電極である。Further, in the figure, numerals 14 and 14 are lead electrodes formed from a metal such as gold or silver.
更に、前記した第一発熱抵抗体１２と第二発熱抵抗体１
３についてのファイン化工程は従来と同様にフォトリソ
エツチング技術が用いられ、この厚膜抵抗材料のエッチ
ャントとしてはフッ酸系が使用され、ガラス部分の破壊
によって不要部を除去する。第１発熱抵抗体１２と第二
発熱抵抗体１３はかかるシート抵抗によって構成される
ために、第二発熱抵抗体１３は第一発熱抵抗体１２より
もガラス成分が少なくなっている。即ち、第３Ａ図乃至
第３Ｃ図で示すエツチングによるファイン化工程にあっ
て、ベタ形成された第一発熱体積１２ａと第二発熱体膜
１３ａに対しては、初期エツチングは遅く、まず第二発
熱抵抗体１３が形成され、厚み方向に進むとエツチング
スピードがＶまり、続いて第一発熱抵抗体１２が形成さ
れ、シート抵抗値の差によって、所望形状と略同−のも
のを得、その分従来の場合より各発熱抵抗体間の間隔ｇ
は小さくなっている。Furthermore, the first heating resistor 12 and the second heating resistor 1 described above
In the refining process for No. 3, photolithography is used as in the conventional method, and hydrofluoric acid is used as the etchant for this thick film resistor material, and unnecessary portions are removed by destroying the glass portion. Since the first heating resistor 12 and the second heating resistor 13 are constituted by such sheet resistance, the second heating resistor 13 has a lower glass component than the first heating resistor 12. That is, in the refining process by etching shown in FIGS. 3A to 3C, the initial etching is slow for the first heat generating volume 12a and the second heat generating body film 13a which are formed in a solid manner, and the second heat generating body film 13a is etched first. The resistor 13 is formed, and as it progresses in the thickness direction, the etching speed decreases by V, and then the first heating resistor 12 is formed, and due to the difference in sheet resistance, a shape that is approximately the same as the desired shape is obtained, and the etching speed is increased by V. The distance g between each heating resistor compared to the conventional case
is getting smaller.
Ｌ述したように、本発明によれば、発熱抵抗体のファイ
ン化が容易となって、各発熱抵抗体間のギャップを小さ
くできるので、ローパワーでベタ環の鮮明な印字を得る
ことができ、熱効率が良いものとなっている。又、ロー
パワー化については第一発熱抵抗体にガラス成分が多く
なっているため、蓄熱効果を得ることができることも加
味され、そのことから、蓄熱層の厚さを薄くすることも
可能となっている。As mentioned above, according to the present invention, the heating resistors can be made finer and the gap between each heating resistor can be made smaller, so it is possible to obtain clear printing with a solid ring at low power. , it has good thermal efficiency. In addition, regarding lower power, the first heat generating resistor has a large glass component, so it is possible to obtain a heat storage effect, which also makes it possible to reduce the thickness of the heat storage layer. ing.
第１図は本発明に係るサーマルヘッドの要部縦断面図、
第２図は同要部平面図、第３Ａ図乃至第３Ｃ図は同エツ
チング工程を示す断面図、第４図は一般的なサーマルプ
リンタの要部構造を示す断面図、第５図は従来例を示す
サーマルヘッドの部分斜視図、第６図は同要部平面図、
第７図は同要部縦断面図、第８Ａ図乃至第８Ｃ図は同エ
ツチング工程を示す断面図である。
１０・・・ベース基板 １１・・・蓄熱層１２・・・第
一発熱抵抗体 １３・・・第二発熱抵抗体第１図
第２図
第３Ａ図
第３Ｂ図
第３Ｃ図
第４図
ｂ ４
第５図
第６図
第７図
眞
第８Ａ図
第８０図FIG. 1 is a longitudinal cross-sectional view of the main part of the thermal head according to the present invention;
Figure 2 is a plan view of the main parts, Figures 3A to 3C are cross-sectional views showing the etching process, Figure 4 is a cross-sectional view showing the structure of the main parts of a general thermal printer, and Figure 5 is a conventional example. 6 is a partial perspective view of the thermal head, and FIG. 6 is a plan view of the main part.
FIG. 7 is a longitudinal sectional view of the same essential part, and FIGS. 8A to 8C are sectional views showing the same etching process. 10... Base substrate 11... Heat storage layer 12... First heating resistor 13... Second heating resistor Figure 1 Figure 2 Figure 3A Figure 3B Figure 3C Figure 4 b 4 Figure 5 Figure 6 Figure 7 True Figure 8A Figure 80
Claims (2)
備え、その第一発熱抵抗体上に、その第一発熱抵抗体よ
りもシート抵抗値の小さい第二発熱抵抗体を積層してあ
ることを特徴とするサーマルヘッドの構造。(1) A first heating resistor is provided on the base substrate via a heat storage layer, and a second heating resistor having a sheet resistance smaller than that of the first heating resistor is laminated on the first heating resistor. The structure of the thermal head is characterized by:
ニウムにガラスフリットを混合した厚膜抵抗材料により
成形し、前記第二発熱抵抗体は第一発熱抵抗体よりもガ
ラスフリットを減量してあることを特徴とする特許請求
の範囲第１項に記載のサーマルヘッドの構造。(2) The first heating resistor and the second heating resistor are formed from a thick film resistance material made of ruthenium oxide mixed with glass frit, and the second heating resistor has less glass frit than the first heating resistor. A structure of a thermal head according to claim 1, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24576785A JPS62105645A (en) | 1985-11-01 | 1985-11-01 | Structure of thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24576785A JPS62105645A (en) | 1985-11-01 | 1985-11-01 | Structure of thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62105645A true JPS62105645A (en) | 1987-05-16 |
Family
ID=17138502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24576785A Pending JPS62105645A (en) | 1985-11-01 | 1985-11-01 | Structure of thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62105645A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01228867A (en) * | 1988-03-09 | 1989-09-12 | Rohm Co Ltd | Thin film type thermal head |
| JPH0478547A (en) * | 1990-07-20 | 1992-03-12 | Rohm Co Ltd | Thermal printing head |
| JPH0489263A (en) * | 1990-08-01 | 1992-03-23 | Alps Electric Co Ltd | Thin film thermal head and its manufacture |
-
1985
- 1985-11-01 JP JP24576785A patent/JPS62105645A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01228867A (en) * | 1988-03-09 | 1989-09-12 | Rohm Co Ltd | Thin film type thermal head |
| JPH0478547A (en) * | 1990-07-20 | 1992-03-12 | Rohm Co Ltd | Thermal printing head |
| JPH0489263A (en) * | 1990-08-01 | 1992-03-23 | Alps Electric Co Ltd | Thin film thermal head and its manufacture |
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