JPH0254248U - - Google Patents

Info

Publication number
JPH0254248U
JPH0254248U JP13406288U JP13406288U JPH0254248U JP H0254248 U JPH0254248 U JP H0254248U JP 13406288 U JP13406288 U JP 13406288U JP 13406288 U JP13406288 U JP 13406288U JP H0254248 U JPH0254248 U JP H0254248U
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
resin
lead frames
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13406288U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13406288U priority Critical patent/JPH0254248U/ja
Publication of JPH0254248U publication Critical patent/JPH0254248U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP13406288U 1988-10-13 1988-10-13 Pending JPH0254248U (it)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13406288U JPH0254248U (it) 1988-10-13 1988-10-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13406288U JPH0254248U (it) 1988-10-13 1988-10-13

Publications (1)

Publication Number Publication Date
JPH0254248U true JPH0254248U (it) 1990-04-19

Family

ID=31392473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13406288U Pending JPH0254248U (it) 1988-10-13 1988-10-13

Country Status (1)

Country Link
JP (1) JPH0254248U (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164492A (ja) * 2000-11-10 2002-06-07 Fairchild Korea Semiconductor Kk インテリジェントパワーモジュールパッケージ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164492A (ja) * 2000-11-10 2002-06-07 Fairchild Korea Semiconductor Kk インテリジェントパワーモジュールパッケージ
JP4676640B2 (ja) * 2000-11-10 2011-04-27 フェアチャイルドコリア半導體株式会社 インテリジェントパワーモジュールパッケージ

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