JPH0254229U - - Google Patents
Info
- Publication number
- JPH0254229U JPH0254229U JP13302588U JP13302588U JPH0254229U JP H0254229 U JPH0254229 U JP H0254229U JP 13302588 U JP13302588 U JP 13302588U JP 13302588 U JP13302588 U JP 13302588U JP H0254229 U JPH0254229 U JP H0254229U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- fixing ring
- substrate fixing
- cathode electrode
- etching apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 4
- 238000001020 plasma etching Methods 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000012495 reaction gas Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
Landscapes
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13302588U JPH0254229U (ko) | 1988-10-11 | 1988-10-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13302588U JPH0254229U (ko) | 1988-10-11 | 1988-10-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0254229U true JPH0254229U (ko) | 1990-04-19 |
Family
ID=31390525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13302588U Pending JPH0254229U (ko) | 1988-10-11 | 1988-10-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0254229U (ko) |
-
1988
- 1988-10-11 JP JP13302588U patent/JPH0254229U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0254229U (ko) | ||
JPH0666301B2 (ja) | プラズマエツチング方法 | |
JPH0254228U (ko) | ||
JPH062952B2 (ja) | プラズマcvd装置及びプラズマcvdによる成膜方法 | |
JPS6255564U (ko) | ||
JPH0469465U (ko) | ||
JPS6413119U (ko) | ||
JPH0211327U (ko) | ||
JPS6257387U (ko) | ||
JPH0374663U (ko) | ||
JPS6073233U (ja) | ドライエツチング装置 | |
JPS61138249U (ko) | ||
JPH0231126U (ko) | ||
JPH0451473Y2 (ko) | ||
JPS6211181U (ko) | ||
JPS6127334U (ja) | ドライエツチング装置 | |
JPS59141570U (ja) | プラズマエツチング装置 | |
JP2693882B2 (ja) | 反応性イオンエッチング装置 | |
JPS63178913U (ko) | ||
JPS59187136U (ja) | 半導体薄膜形成装置 | |
JPS61171129A (ja) | 半導体製造装置 | |
JPS6351436U (ko) | ||
JPS6182958U (ko) | ||
JPS60181027U (ja) | 反応性イオンエツチング装置 | |
JPH01154630U (ko) |