JPH0253951B2 - - Google Patents
Info
- Publication number
- JPH0253951B2 JPH0253951B2 JP57126180A JP12618082A JPH0253951B2 JP H0253951 B2 JPH0253951 B2 JP H0253951B2 JP 57126180 A JP57126180 A JP 57126180A JP 12618082 A JP12618082 A JP 12618082A JP H0253951 B2 JPH0253951 B2 JP H0253951B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- conductor
- glass ceramics
- paste
- dielectric constant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 18
- 239000003990 capacitor Substances 0.000 claims description 17
- 239000002131 composite material Substances 0.000 claims description 16
- 239000000919 ceramic Substances 0.000 claims description 14
- 239000002241 glass-ceramic Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 238000010304 firing Methods 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052810 boron oxide Inorganic materials 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 5
- 229910000464 lead oxide Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000012298 atmosphere Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Ceramic Capacitors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57126180A JPS5917294A (ja) | 1982-07-20 | 1982-07-20 | 複合積層セラミツク部品とその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57126180A JPS5917294A (ja) | 1982-07-20 | 1982-07-20 | 複合積層セラミツク部品とその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5917294A JPS5917294A (ja) | 1984-01-28 |
| JPH0253951B2 true JPH0253951B2 (th) | 1990-11-20 |
Family
ID=14928662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57126180A Granted JPS5917294A (ja) | 1982-07-20 | 1982-07-20 | 複合積層セラミツク部品とその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5917294A (th) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60177695A (ja) * | 1984-02-23 | 1985-09-11 | 日本電気株式会社 | 複合セラミツク基板 |
| JPH01128587A (ja) * | 1987-11-13 | 1989-05-22 | Tdk Corp | セラミック配線基板の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5658295A (en) * | 1979-10-17 | 1981-05-21 | Hitachi Ltd | Method of manufacturing high accuracy capacitor contained multilayer circuit board |
| JPS5658294A (en) * | 1979-10-17 | 1981-05-21 | Hitachi Ltd | Multilayer circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54156753U (th) * | 1978-04-01 | 1979-10-31 | ||
| JPS56154080U (th) * | 1980-04-11 | 1981-11-18 |
-
1982
- 1982-07-20 JP JP57126180A patent/JPS5917294A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5658295A (en) * | 1979-10-17 | 1981-05-21 | Hitachi Ltd | Method of manufacturing high accuracy capacitor contained multilayer circuit board |
| JPS5658294A (en) * | 1979-10-17 | 1981-05-21 | Hitachi Ltd | Multilayer circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5917294A (ja) | 1984-01-28 |
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