JPH0252438U - - Google Patents
Info
- Publication number
- JPH0252438U JPH0252438U JP13114388U JP13114388U JPH0252438U JP H0252438 U JPH0252438 U JP H0252438U JP 13114388 U JP13114388 U JP 13114388U JP 13114388 U JP13114388 U JP 13114388U JP H0252438 U JPH0252438 U JP H0252438U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- drying chamber
- drying
- wall
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001035 drying Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims 2
- 230000008016 vaporization Effects 0.000 claims 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Drying Of Solid Materials (AREA)
Description
第1図は本考案の一実施例のウエハー乾燥装置
の断面図、第2図は本考案の他の実施例のウエハ
ー乾燥装置の断面図、第3図は従来のウエハー乾
燥装置の断面図である。
1……ウエハー収納キヤリア、2……ウエハー
、3……チヤンバー、4……チヤンバー上蓋、5
……真空シール用Oリング、6……パンチング板
、7……真空ポンプ、8……バルブ、9……バル
ブ、10……ヒーター、11……加熱器、12…
…N2シヤワーノズル。
Fig. 1 is a cross-sectional view of a wafer drying apparatus according to an embodiment of the present invention, Fig. 2 is a cross-sectional view of a wafer drying apparatus according to another embodiment of the present invention, and Fig. 3 is a cross-sectional view of a conventional wafer drying apparatus. be. 1...Wafer storage carrier, 2...Wafer, 3...Chamber, 4...Chamber top lid, 5
... O-ring for vacuum sealing, 6 ... Punching plate, 7 ... Vacuum pump, 8 ... Valve, 9 ... Valve, 10 ... Heater, 11 ... Heater, 12 ...
... N2 shower nozzle.
Claims (1)
装置において、乾燥室の前記壁面に乾燥室へのガ
ス導入系並びに乾燥室からのガス排気系を設け、
前乾燥室を減圧状態に保つて、ウエハーに付着し
た水分を加熱し気化させることにより、ウエハー
の脱水乾燥を行なうことを特徴とするウエハー乾
燥装置。 In a wafer drying apparatus having a heating mechanism on the wall of the drying chamber, a gas introduction system to the drying chamber and a gas exhaust system from the drying chamber are provided on the wall of the drying chamber,
A wafer drying apparatus characterized by dehydrating and drying a wafer by keeping a pre-drying chamber in a reduced pressure state and heating and vaporizing moisture attached to the wafer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13114388U JPH0252438U (en) | 1988-10-05 | 1988-10-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13114388U JPH0252438U (en) | 1988-10-05 | 1988-10-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0252438U true JPH0252438U (en) | 1990-04-16 |
Family
ID=31386934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13114388U Pending JPH0252438U (en) | 1988-10-05 | 1988-10-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0252438U (en) |
-
1988
- 1988-10-05 JP JP13114388U patent/JPH0252438U/ja active Pending