JPH0252339U - - Google Patents
Info
- Publication number
- JPH0252339U JPH0252339U JP1988128376U JP12837688U JPH0252339U JP H0252339 U JPH0252339 U JP H0252339U JP 1988128376 U JP1988128376 U JP 1988128376U JP 12837688 U JP12837688 U JP 12837688U JP H0252339 U JPH0252339 U JP H0252339U
- Authority
- JP
- Japan
- Prior art keywords
- side bump
- chip
- bonded
- substrate
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/01225—
-
- H10W72/222—
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988128376U JPH0252339U (enExample) | 1988-09-30 | 1988-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988128376U JPH0252339U (enExample) | 1988-09-30 | 1988-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252339U true JPH0252339U (enExample) | 1990-04-16 |
Family
ID=31381660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988128376U Pending JPH0252339U (enExample) | 1988-09-30 | 1988-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252339U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998033217A1 (fr) * | 1997-01-24 | 1998-07-30 | Rohm Co., Ltd. | Dispositif a semi-conducteur et procede pour produire ce dispositif |
| JP2007294916A (ja) * | 2006-03-31 | 2007-11-08 | Brother Ind Ltd | 接続構造、およびバンプの形成方法等 |
-
1988
- 1988-09-30 JP JP1988128376U patent/JPH0252339U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998033217A1 (fr) * | 1997-01-24 | 1998-07-30 | Rohm Co., Ltd. | Dispositif a semi-conducteur et procede pour produire ce dispositif |
| JP2007294916A (ja) * | 2006-03-31 | 2007-11-08 | Brother Ind Ltd | 接続構造、およびバンプの形成方法等 |