JPH0251994B2 - - Google Patents

Info

Publication number
JPH0251994B2
JPH0251994B2 JP61274264A JP27426486A JPH0251994B2 JP H0251994 B2 JPH0251994 B2 JP H0251994B2 JP 61274264 A JP61274264 A JP 61274264A JP 27426486 A JP27426486 A JP 27426486A JP H0251994 B2 JPH0251994 B2 JP H0251994B2
Authority
JP
Japan
Prior art keywords
plating
plating solution
flow path
wafer
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP61274264A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62207895A (ja
Inventor
Aruberuto Aemirio Santeini Hyuugo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS62207895A publication Critical patent/JPS62207895A/ja
Publication of JPH0251994B2 publication Critical patent/JPH0251994B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP61274264A 1986-02-28 1986-11-19 電解めつき槽 Granted JPS62207895A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US834699 1986-02-28
US06/834,699 US4696729A (en) 1986-02-28 1986-02-28 Electroplating cell

Publications (2)

Publication Number Publication Date
JPS62207895A JPS62207895A (ja) 1987-09-12
JPH0251994B2 true JPH0251994B2 (enExample) 1990-11-09

Family

ID=25267571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61274264A Granted JPS62207895A (ja) 1986-02-28 1986-11-19 電解めつき槽

Country Status (4)

Country Link
US (1) US4696729A (enExample)
EP (1) EP0234212B1 (enExample)
JP (1) JPS62207895A (enExample)
DE (1) DE3761314D1 (enExample)

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US6841057B2 (en) * 2002-03-13 2005-01-11 Applied Materials Inc. Method and apparatus for substrate polishing
US7854828B2 (en) * 2006-08-16 2010-12-21 Novellus Systems, Inc. Method and apparatus for electroplating including remotely positioned second cathode
US7118658B2 (en) * 2002-05-21 2006-10-10 Semitool, Inc. Electroplating reactor
US20050061660A1 (en) * 2002-10-18 2005-03-24 Kempen Hein Van System and method for electrolytic plating
JP2006513041A (ja) * 2002-12-05 2006-04-20 サーフェクト テクノロジーズ インク． コーティングされた磁性粒子及びその応用
US20060049038A1 (en) * 2003-02-12 2006-03-09 Surfect Technologies, Inc. Dynamic profile anode
WO2004072331A2 (en) * 2003-02-12 2004-08-26 Surfect Technologies, Inc. Apparatus and method for highly controlled electrodeposition
US20050167275A1 (en) * 2003-10-22 2005-08-04 Arthur Keigler Method and apparatus for fluid processing a workpiece
US7727366B2 (en) * 2003-10-22 2010-06-01 Nexx Systems, Inc. Balancing pressure to improve a fluid seal
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US7553401B2 (en) * 2004-03-19 2009-06-30 Faraday Technology, Inc. Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
US7947161B2 (en) * 2004-03-19 2011-05-24 Faraday Technology, Inc. Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
US20050283993A1 (en) * 2004-06-18 2005-12-29 Qunwei Wu Method and apparatus for fluid processing and drying a workpiece
US7285195B2 (en) * 2004-06-24 2007-10-23 Applied Materials, Inc. Electric field reducing thrust plate
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JP4458057B2 (ja) * 2005-07-28 2010-04-28 Ｔｄｋ株式会社 めっき装置及びめっき方法
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US9822461B2 (en) 2006-08-16 2017-11-21 Novellus Systems, Inc. Dynamic current distribution control apparatus and method for wafer electroplating
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US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
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TWI550139B (zh) 2011-04-04 2016-09-21 諾菲勒斯系統公司 用於裁整均勻輪廓之電鍍裝置
US9909228B2 (en) 2012-11-27 2018-03-06 Lam Research Corporation Method and apparatus for dynamic current distribution control during electroplating
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
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US9752248B2 (en) 2014-12-19 2017-09-05 Lam Research Corporation Methods and apparatuses for dynamically tunable wafer-edge electroplating
US9567685B2 (en) 2015-01-22 2017-02-14 Lam Research Corporation Apparatus and method for dynamic control of plated uniformity with the use of remote electric current
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US9988733B2 (en) 2015-06-09 2018-06-05 Lam Research Corporation Apparatus and method for modulating azimuthal uniformity in electroplating
CN105648507A (zh) * 2016-03-24 2016-06-08 河南理工大学 一种用于电沉积平面件的装置
JP6462620B2 (ja) * 2016-03-29 2019-01-30 東京エレクトロン株式会社 基板処理装置および基板処理方法
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
CN106824581A (zh) * 2017-02-17 2017-06-13 张薄 一种静电吸附镀膜装置及静电吸附镀膜方法
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
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Also Published As

Publication number Publication date
DE3761314D1 (de) 1990-02-08
US4696729A (en) 1987-09-29
JPS62207895A (ja) 1987-09-12
EP0234212B1 (en) 1990-01-03
EP0234212A1 (en) 1987-09-02

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