DE3761314D1 - Elektroplattierzelle. - Google Patents

Elektroplattierzelle.

Info

Publication number
DE3761314D1
DE3761314D1 DE8787100343T DE3761314T DE3761314D1 DE 3761314 D1 DE3761314 D1 DE 3761314D1 DE 8787100343 T DE8787100343 T DE 8787100343T DE 3761314 T DE3761314 T DE 3761314T DE 3761314 D1 DE3761314 D1 DE 3761314D1
Authority
DE
Germany
Prior art keywords
electroplating plate
electroplating
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787100343T
Other languages
English (en)
Inventor
Hugo Alberto Santini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3761314D1 publication Critical patent/DE3761314D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
DE8787100343T 1986-02-28 1987-01-13 Elektroplattierzelle. Expired - Fee Related DE3761314D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/834,699 US4696729A (en) 1986-02-28 1986-02-28 Electroplating cell

Publications (1)

Publication Number Publication Date
DE3761314D1 true DE3761314D1 (de) 1990-02-08

Family

ID=25267571

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787100343T Expired - Fee Related DE3761314D1 (de) 1986-02-28 1987-01-13 Elektroplattierzelle.

Country Status (4)

Country Link
US (1) US4696729A (de)
EP (1) EP0234212B1 (de)
JP (1) JPS62207895A (de)
DE (1) DE3761314D1 (de)

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US4871435A (en) * 1988-10-14 1989-10-03 Charles Denofrio Electroplating apparatus
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US4935108A (en) * 1989-04-28 1990-06-19 Hewlett-Packard Company Apparatus for troubleshooting photoimage plating problems in printed circuit board manufacturing
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US5893966A (en) * 1997-07-28 1999-04-13 Micron Technology, Inc. Method and apparatus for continuous processing of semiconductor wafers
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US6126798A (en) * 1997-11-13 2000-10-03 Novellus Systems, Inc. Electroplating anode including membrane partition system and method of preventing passivation of same
US6179983B1 (en) 1997-11-13 2001-01-30 Novellus Systems, Inc. Method and apparatus for treating surface including virtual anode
US6156167A (en) * 1997-11-13 2000-12-05 Novellus Systems, Inc. Clamshell apparatus for electrochemically treating semiconductor wafers
US6159354A (en) * 1997-11-13 2000-12-12 Novellus Systems, Inc. Electric potential shaping method for electroplating
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6228232B1 (en) 1998-07-09 2001-05-08 Semitool, Inc. Reactor vessel having improved cup anode and conductor assembly
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US6919010B1 (en) 2001-06-28 2005-07-19 Novellus Systems, Inc. Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction
US6454918B1 (en) * 1999-03-23 2002-09-24 Electroplating Engineers Of Japan Limited Cup type plating apparatus
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US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
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JP4288010B2 (ja) 1999-04-13 2009-07-01 セミトゥール・インコーポレイテッド 処理流体の流れ具合を向上させる処理チャンバを備えた加工物処理装置
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US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
KR100293239B1 (ko) * 1999-06-23 2001-06-15 김무 반도체 기질 도금장치 및 방법
DE19938409C1 (de) * 1999-08-13 2001-03-22 Tyco Electronics Logistics Ag Anordnung zum gleichmäßigen Umströmen einer Oberfläche einer Probe mit Flüssigkeit und Verwendung der Anordnung
US6278210B1 (en) 1999-08-30 2001-08-21 International Business Machines Corporation Rotary element apparatus with wireless power transfer
US8308931B2 (en) * 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
US8475636B2 (en) 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US6821407B1 (en) * 2000-05-10 2004-11-23 Novellus Systems, Inc. Anode and anode chamber for copper electroplating
US6527920B1 (en) 2000-05-10 2003-03-04 Novellus Systems, Inc. Copper electroplating apparatus
US7622024B1 (en) 2000-05-10 2009-11-24 Novellus Systems, Inc. High resistance ionic current source
US6869515B2 (en) 2001-03-30 2005-03-22 Uri Cohen Enhanced electrochemical deposition (ECD) filling of high aspect ratio openings
US20060011487A1 (en) * 2001-05-31 2006-01-19 Surfect Technologies, Inc. Submicron and nano size particle encapsulation by electrochemical process and apparatus
US7682498B1 (en) 2001-06-28 2010-03-23 Novellus Systems, Inc. Rotationally asymmetric variable electrode correction
US6908540B2 (en) * 2001-07-13 2005-06-21 Applied Materials, Inc. Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
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JP4011336B2 (ja) * 2001-12-07 2007-11-21 日鉱金属株式会社 電気銅めっき方法、電気銅めっき用純銅アノード及びこれらを用いてめっきされたパーティクル付着の少ない半導体ウエハ
US6841057B2 (en) 2002-03-13 2005-01-11 Applied Materials Inc. Method and apparatus for substrate polishing
US7854828B2 (en) * 2006-08-16 2010-12-21 Novellus Systems, Inc. Method and apparatus for electroplating including remotely positioned second cathode
US7118658B2 (en) * 2002-05-21 2006-10-10 Semitool, Inc. Electroplating reactor
US20050061660A1 (en) * 2002-10-18 2005-03-24 Kempen Hein Van System and method for electrolytic plating
US20040256222A1 (en) * 2002-12-05 2004-12-23 Surfect Technologies, Inc. Apparatus and method for highly controlled electrodeposition
AU2003298904A1 (en) * 2002-12-05 2004-06-30 Surfect Technologies, Inc. Coated and magnetic particles and applications thereof
US20060049038A1 (en) * 2003-02-12 2006-03-09 Surfect Technologies, Inc. Dynamic profile anode
JP4642771B2 (ja) 2003-10-22 2011-03-02 ネックス システムズ インコーポレイテッド ワークピースを流体処理する方法及び装置
US7727366B2 (en) 2003-10-22 2010-06-01 Nexx Systems, Inc. Balancing pressure to improve a fluid seal
US20050230260A1 (en) * 2004-02-04 2005-10-20 Surfect Technologies, Inc. Plating apparatus and method
US7553401B2 (en) * 2004-03-19 2009-06-30 Faraday Technology, Inc. Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
US7947161B2 (en) * 2004-03-19 2011-05-24 Faraday Technology, Inc. Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
US20050283993A1 (en) * 2004-06-18 2005-12-29 Qunwei Wu Method and apparatus for fluid processing and drying a workpiece
US7285195B2 (en) * 2004-06-24 2007-10-23 Applied Materials, Inc. Electric field reducing thrust plate
US7608174B1 (en) 2005-04-22 2009-10-27 Sandia Corporation Apparatus and method for electroforming high aspect ratio micro-parts
JP4458057B2 (ja) * 2005-07-28 2010-04-28 Ｔｄｋ株式会社 めっき装置及びめっき方法
TWI314957B (en) * 2005-12-29 2009-09-21 Ind Tech Res Inst Apparatus for metal plating on a substrate
US9822461B2 (en) 2006-08-16 2017-11-21 Novellus Systems, Inc. Dynamic current distribution control apparatus and method for wafer electroplating
US7651384B2 (en) * 2007-01-09 2010-01-26 Applied Materials, Inc. Method and system for point of use recycling of ECMP fluids
US7799684B1 (en) 2007-03-05 2010-09-21 Novellus Systems, Inc. Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers
US8012319B2 (en) * 2007-11-21 2011-09-06 Texas Instruments Incorporated Multi-chambered metal electrodeposition system for semiconductor substrates
US8513124B1 (en) 2008-03-06 2013-08-20 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers
US7964506B1 (en) 2008-03-06 2011-06-21 Novellus Systems, Inc. Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers
US8703615B1 (en) 2008-03-06 2014-04-22 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers
US8475637B2 (en) * 2008-12-17 2013-07-02 Novellus Systems, Inc. Electroplating apparatus with vented electrolyte manifold
US8262871B1 (en) 2008-12-19 2012-09-11 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
TWI550139B (zh) 2011-04-04 2016-09-21 諾菲勒斯系統公司 用於裁整均勻輪廓之電鍍裝置
US8575028B2 (en) 2011-04-15 2013-11-05 Novellus Systems, Inc. Method and apparatus for filling interconnect structures
US9909228B2 (en) 2012-11-27 2018-03-06 Lam Research Corporation Method and apparatus for dynamic current distribution control during electroplating
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US9677190B2 (en) 2013-11-01 2017-06-13 Lam Research Corporation Membrane design for reducing defects in electroplating systems
US9752248B2 (en) 2014-12-19 2017-09-05 Lam Research Corporation Methods and apparatuses for dynamically tunable wafer-edge electroplating
US9567685B2 (en) 2015-01-22 2017-02-14 Lam Research Corporation Apparatus and method for dynamic control of plated uniformity with the use of remote electric current
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US9988733B2 (en) 2015-06-09 2018-06-05 Lam Research Corporation Apparatus and method for modulating azimuthal uniformity in electroplating
CN105648507A (zh) * 2016-03-24 2016-06-08 河南理工大学 一种用于电沉积平面件的装置
JP6462620B2 (ja) * 2016-03-29 2019-01-30 東京エレクトロン株式会社 基板処理装置および基板処理方法
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
CN106824581A (zh) * 2017-02-17 2017-06-13 张薄 一种静电吸附镀膜装置及静电吸附镀膜方法
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
CN110541180B (zh) * 2019-10-12 2020-08-18 深圳市宜诺自动化设备有限公司 一种具有阳极导电装置的铝箔连续氧化设备

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Also Published As

Publication number Publication date
US4696729A (en) 1987-09-29
EP0234212A1 (de) 1987-09-02
JPS62207895A (ja) 1987-09-12
JPH0251994B2 (de) 1990-11-09
EP0234212B1 (de) 1990-01-03

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee